AFLAS FFKM PM-3500 was specifically developed for applicatoins such as chamber seals and centering o-rings in flanges where high-purity is vital to the user's processes.  It achieves Shore A hardness wtihout the need for fillers that could generate particulates.  It is also plasma resistance, so it can be used in the etching process of semiconductor manufacturing.

AFLAS FFKM PM-3500 can be peroxide cured, as well as nitrile-cured FFKM and precompound, and are ultra-high temperature (>300 °C), low compression set and high purity.