High Temperature Co-fired Ceramic (HTCC) is a popular material choice for hermetic packaging due to its desirable electrical properties, high mechanical strength and good thermal conductivity. AdTech Ceramics manufactures its proprietary HTCC blend which allows for hermetic straight through vias and dense metal interconnects. AdTech Ceramics' HTCC packages are most commonly used in military, aerospace, medical device and high temperature applications.

Co-fired ceramic packages are fabricated through four distinct processing stages that include material preparation, green processing, sintering, and post-fire processing. Material preparation consists of milling raw materials into a dielectric "green tape" as well as conductive inks. Green processing consists of punching cavities, via punch, via fill, screen printing and lamination. Once the green process is complete, the ceramic/metal composite is "co-fired" in a carefully controlled atmosphere. Post fire processing consists of additional printing, sawing, machining and brazing. Almost all packages are plated with Ni and Au for solder and wirebond applications. AdTech Ceramics offers both electroless and electrolytic plating options, as well as a variety of thin filmed variations.

Design assistance and HFSS simulation is available for high frequency applications. Please see below for additional material specifications and download the Design and Capabilities Guideline for layout specific design rules.