Ceramic capillaries are the primary tools used for wire bonding. Under the influence of pressure, heat, and ultrasonic vibration, these capillaries are used to bond wires with diameters ranging from 0.025mm to 0.050mm onto solder pads or pins.

  During the bonding process, different interface conditions are formed among the capillaries, the chip, and the substrate under different ultrasonic power settings, resulting in varying bond strengths. As a tool for directly welding wire materials, the parameters of ceramic capillaries have a certain impact on both the bonding morphology and functionality.

  Hole Size (H): An excessively small H hole can cause poor wire flow and easy neck breakage, resulting in insufficient wire arc height (Figure 1). Conversely, an excessively large H hole can lead to the golf ball effect (Figure 2)."

??  T: An excessively small T will result in excessively short wire length, leading to insufficient tensile strength (Figure 3). Conversely, an excessively large T will cause contact with adjacent wires (Figure 4, Figure 5).

??  CD: An excessively small CD will result in poor wire feeding, with the wire tail being too short, affecting ball bonding (Figure 6, Figure 7). Conversely, an excessively large CD will cause excessive ball height (Figure 8)."

??  FA and OR: An excessively small FA and OR will result in wire breakage or weak bonding (Figure 9). Conversely, an excessively large FA and OR will cause insufficient wire compression, leading to insufficient welding force and tensile strength (Figure 10).

?? In conclusion, the parameters of ceramic capillaries have an impact on wire bonding. When making selection, it is important to consider the aforementioned issues to avoid functional impacts on wire bonding caused by inappropriate parameters. This will help improve the success rate of ceramic capillaries validation."