High-Performance Solution for Diverse Industrial Needs (read more)

Gel forming technology offers significant advantages for ceramic plunger production, providing a competitive edge in the market. This method integrates powder molding with organic polymer chemistry to enhance ceramic properties and manufacturing efficiency. (read more)

Micro-hole spark machine has the advantages of high processing efficiency, high precision, good consistency, easy operation, no pollution and so on. Applied to engine nozzle, semiconductor collets and other fields. (read more)

Aluminum nitride (AlN) ceramic heater is a device used for heating semiconductor materials,which has excellent thermal conductivity and high temperature resistance, and can operate stably at high temperatures. The heater usually uses a resistance wire as a heating element, and the resistance wire is heated by energizing, so as to transfer heat to the surface of the heater and realize the... (read more)

With the power of computer components increasing, the heat is getting bigger than ever. The issue of computer cooling already caused the attention of people adequately. More and more people choice special cooling fan for the core chip in personal computer excepting power supply and CPU. (read more)

The AMB Alumina Copper-Clad Plate offers superior thermal conductivity and bonding compared to traditional DBC substrates, making it ideal for various electronic applications. (read more)

Suntech offers advanced ceramic solutions for high-end cosmetic packaging. These ceramics combine balanced weight, a cool touch, and a flawless surface finish, ensuring smooth and uniform application. With higher hardness, precision, and finish than standard ceramics, these materials bring both functionality and artistic appeal to cosmetic packaging. (read more)

As integrated circuit has become a strategic industry, many semiconductor materials have been researched and developed, and AlN is undoubtedly one of the most promising semiconductor materials. (read more)

Explore how Suntech Applied Materials' Ceramic Injection Molding (CIM) technology achieves high precision and complex shapes efficiently, reducing processing costs for ceramic products. (read more)

Discover the AMB AlN ceramic substrate, designed for high-power applications with superior thermal cycling and bonding strength. Ideal for IGBT module encapsulation in electric vehicles, aerospace, and more. (read more)

The main material of ceramic heater is AIN. It is sintered with complex tungsten circuits, with fast thermal response and uniform temperature, and can integrate temperature sensors. (read more)

The material which have high strength and toughness, high thermal conductivity can reduce the chip junction temperature, improve the overall efficiency of the device module, and prolong the life cycle. (read more)

Ceramic surface metallization is mainly used in ceramic and kovar alloy brazing, high gas-tight ceramic-kovar alloy welding welding, metallized in its welding position, and then brazing. By improving the infiltration of metal solder on the ceramic surface, and the metallization layer as the intermediate layer, forming a firm connection with the metal solder through metallurgical combinat... (read more)

Ceramics, known for their exceptional high-temperature resistance, corrosion resistance, and good chemical stability, have long been vital materials in industrial applications and scientific research. With the advancement of 3D printing technology, the 3D printing of ceramic materials has become a reality, showcasing advantages that traditional manufacturing methods cannot match. (read more)

Suntech's advanced ceramics provide exceptional electrical conductivity, anti-static properties, and insulation, ensuring reliability in medical machines, semiconductor equipment, and high-tech industries. (read more)

HTCC multilayer co-fired ceramic substrate packaging technology is an advanced electronic packaging technology, which utilizes the unique properties of HTCC materials, such as high mechanical strength, high thermal conductivity, good chemical stability and high wiring density, to achieve high-performance electronic packaging. (read more)

Explore the porous ceramic vacuum chuck, providing stability and efficiency for processes like heating, cutting, and grinding. (read more)

Suntech has started ceramics production for more than ten years. We launched ceramic grinders in 2017.Suntech ceramic parts are certificated by NFS51 and FDAThe grinders are made by high purity alumina. It excels on hardness, wear, heat resistance and anti-rusting over steel. (read more)

This paper introduces the advantages and characteristics of ceramic hip join (read more)

Products have passed the ROHS and REACH environmental certification of the European Chemicals Agency, in accordance with EU Regulation No. 1907/2006. (read more)

Suntech ceramic capillaries offer a cost-effective solution for copper wire bonding, enhancing reliability and optimizing the process for multi-level and high-density semiconductor packaging. (read more)

Ceramic injection molding (CIM) is the main branch of powder injection molding (PIM) technology, is developed on the basis of polymer injection molding technology, is a polymer injection forming method and ceramic preparation process combined to develop a new process to prepare ceramic parts. For the mass production of ceramic products with high size accuracy and complex shape, using cer... (read more)

Enhancing High-Speed Performance and Thermal Stability (read more)

Zirconia ceramic is widely valued in various fields due to its ability to improve brittleness performance through a unique phase transformation toughening mechanism. Shenzhen Suntech Advanced Ceramic Co., Ltd. produces black zirconia ceramic using nano ZrO2 ceramic powder combined with nano black pigment powder, resulting in a highly durable and functional material. (read more)

Discover how Suntech's innovative ceramic nozzles revolutionize surface mount systems, ensuring unparalleled wear resistance and precision placement. (read more)

Understanding capillary aging in wire bonding, its impact on solder joint quality, and methods to mitigate deterioration for prolonged capillary life. (read more)

Explore high-quality dispensing nozzles designed for die bonding processes, crafted by Suntech using premium materials for optimal performance in various applications. (read more)

Discover advanced ceramic materials from Suntech Applied Materials, enhancing signal transparency, durability, and heat dissipation in consumer electronics. (read more)

Discover the ultimate solution for precise chip packaging with our innovative ceramic spring nozzle. (read more)

Elevate your wire bonding precision with our advanced wedge capillary tools, designed for superior performance with customizable heads and various material options to meet your packaging needs. (read more)

Innovative Material for Precision Applications (read more)

There are many connection methods between ceramic and metal, such as brazing, diffusion welding, fusion welding and oxide glass solder connection method, among which brazing method is one of the main methods to obtain high strength ceramic/metal joint. (read more)

Silicon carbide is a high-performance ceramic material with exceptional hardness, just below that of diamond, and is manufactured by sintering silicon carbide powder with organic binders and additives at high temperatures. (read more)

Discover the superiority of semiconductor ceramic packaging, enhancing product stability and reliability. (read more)

The manufacturing of the latest generation of alumina-toughened zirconia (ATZ) composite ceramic hip joint balls presents significant challenges, making it a highly specialized and technically demanding process. This material, which optimizes the performance of the first three generations of hip joint balls, is considered the most suitable for hip joint replacements due to its superior m... (read more)

Tailored Technology Parameters for Superior Performance (read more)

Empowering High-Performance Electronics with Superior Heat Dissipation (read more)

Optimize thermal stability and precision with ceramic sliding bearings, ideal for high-speed spindles and superior to traditional oil-lubricated bearings. (read more)

Innovative Solutions for Heat Dissipation and Hermetic Sealing Challenges (read more)

Ceramic packages, also known as ceramic encapsulation packages, are encapsulation shells made from ceramic materials. Depending on the structure, ceramic packages can be categorized into various types, including Ceramic Pin Grid Array (CPGA),Ceramic Ball Grid Array (CBGA), and Ceramic Quad Flat No-lead (CQFN), among others. Based on different raw materials, ceramic packages can also be d... (read more)

Mullite has a high melting point, good thermal stability at high temperature, better mechanical properties,its mechanical properties increase with the increase of temperature, lower dielectric constant and thermal expansion coefficient, good resistance to heat shock performance and air tightness. Due to its excellent physical and chemical properties, molite ceramics are widely used in hi... (read more)

Overcoming Metal Shortages through Superior Ceramic Solutions (read more)

Enhancing Soldering Quality with Wedge Capillaries (read more)

Due to the advantages of simple equipment, continuous operation, high production efficiency and uniform body performance, tape casting has become an important method for preparing large-area, ultra-thin ceramic substrates. (read more)

In order to achieve more efficient and reliable bonding with silver alloy wire, the specially treated texture of Suntech ceramic capillary is recommended, which has been proven to enhance the coupling interface between the capillary tip surface and the silver alloy wire, providing more efficient ultrasonic energy transfer. (read more)

Ceramic tweezer have the advantages of anti-static, high using temperature, good heat insulation, high hardness, good resistance to acid, long product life, etc. It could greatly improve the performance compared with traditional tweezers and is the best choice for high-precision electronic products, ultra-high temperature welding. (read more)

DLC coating on ceramic surface is a kind of diamond carbon coating prepared on ceramic surface by physical vapor deposition (PVD) technology. It has the advantages of high hardness, wear resistance, corrosion resistance and high temperature resistance. It is widely used in machinery, electronics, optics and aviation fields. (read more)

Ceramic capillaries are the primary tools used for wire bonding. Under the influence of pressure, heat, and ultrasonic vibration, these capillaries are used to bond wires with diameters ranging from 0.025mm to 0.050mm onto solder pads or pins. (read more)