IC Power Supplies Specifications

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General Specifications

	IC Package Type
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	DIP / CDIP / PDIP		Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade. Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers, commercial electronics, and telecommunications.
	DPAK (TO-252)		Discrete package or deca-watt (DPAK).
	PPAK (QFN-16)		Power packaging (PPAK).
	QFP		Quad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets, and other applications.
	SC-70		SC-70 is one of the smallest available IC packages. It is used in cellular phones, PDAs, electronic games, laptops, and other portable and hand-held applications where space is extremely limited.
	SO-8		Small outline (SO) package with 8 pins.
	SO-14		Small outline (SO) package with 14 pins.
	SO-20		Small outline (SO) package with 20 pins.
	SSOP		Shrink small outline package (SSOP).
	SOIC / SOP		Small outline integrated circuit (SOIC). Small outline package (SOP).
	SOJ		Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device.
	SOT23		SOT23 is a rectangular, surface mounted, small outline transistor (SOT) package with three or more gull wing leads. SOT23 features a very small footprint and is optimized for the highest possible current. Because of its low cost and low profile, SOT23 is used in home appliances, office and industrial equipment, personal computers, printers, and communication equipment.
	SOT89		SOT89 is a plastic, surface mounted, small outline transistor (SOT) package with three leads and a collector pad for good heat transfer. Unlike other packages, SOT89 lead posts are up-set and not down-set. SOT89 is designed for medium power and high-speed switching applications. It is also used in applications that feature very low RDS (on), no secondary breakdown, and direct interface to complementary metal oxide semiconductor (CMOS) and transistor-transistor logic (TTL).
	TO-3		TO-3 is a transistor outline (TO) package with three leads.
	TO-39		TO-39 is a transistor outline (TO) package.
	TO-92		TO-92 is a single in-line, transistor outline (TO) package that is often used for low power devices. One of the oldest power packages, TO-92 is suitable for applications in office and communication equipment.
	TO-220		TO-220 is a transistor outline (TO) package that is suitable for high power, medium current, and fast-switching power devices. TO-220 is used in home appliances, office and industrial equipment, and personal and consumer electronics. A package variant, TO-220 Full Pack, includes a fully encapsulated heat sink that does not require extra hardware for electrical isolation. TO-220 Full Pack has the same footprint as TO-220, provides electrical isolation up to 5 KV, and is often used in motor drive applications and power supplies.
	TO-263		TO-263 is the surface-mount version of the TO-220 package. TO-263 is a transistor outline (TO) package with 2, 3, 5, 6, or 7 leads. TO-263 can accommodate large dice because of its large pad design. It is suitable for high power applications due to its low resistance. Typical applications for TO-263 include home appliances and personal computers.
	Other		Other unlisted, specialized, or proprietary IC package types.
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Performance

	Operating Temperature:		This is the ambient temperature range through which the device is designed to operate.
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	Output Power
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	Output Voltage (Volt)		The output regulated voltage (Volt) represents minimum and maximum amounts in continuous mode (DC).
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	Input Voltage (VIN)		The input voltage (VIN) is in continuous mode (DC) in accordance with minimum and maximum levels that can be applied to the integrated circuit (IC).
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Features

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	Shutdown (Inhibit) Pin		Shutdown (inhibit) pins are used to disable the regulator outputs.
	Reverse Voltage Protection		This feature prevents damage to the regulator when the input voltage is reversed. It is essential in applications where a user can accidentally reverse the polarity of the batteries, or make similar mistakes.
	Error Flag		This flag is used to alert monitoring or control circuitry that the output has dropped (generally 5%) below its nominal value.
	Internal Current Limit		Regulators have an internal circuit to control the amount of current produced.
	Input Overcurrent Protection		Regulators have an internal circuit that protects it when an excessive input current is applied.
	Thermal Shutdown Protection		Regulators have an embedded control circuit that shuts down the device when the temperature exceeds a predefined limit.
	Multiple Outputs		Regulators have more than one output (channel).
	Synchronous Rectification		For switching, converters used metal-oxide silicone field-effect transistors (MOSFET) instead of diodes. Synchronous rectification means that the MOSFETs are turned on and off at the right time for efficient gating or rectification of the output.
	Other		Other unlisted features.
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