Large aperture porous ceramic has high mechanical strength, chemical and physical stability system, high service life, and large aperture, high air permeability, small air resistance. (read more)

As integrated circuit has become a strategic industry, many semiconductor materials have been researched and developed, and AlN is undoubtedly one of the most promising semiconductor materials. (read more)

Unlock the potential of copper wire bonding with Shangde ceramic capillaries - a game-changer in semiconductor packaging. Optimize processes, enhance reliability, and cut costs, achieving a remarkable 95% qualification rate. (read more)

There are many connection methods between ceramic and metal, such as brazing, diffusion welding, fusion welding and oxide glass solder connection method, among which brazing method is one of the main methods to obtain high strength ceramic/metal joint. (read more)

Explore the porous ceramic vacuum chuck, providing stability and efficiency for processes like heating, cutting, and grinding. (read more)

Discover the superiority of semiconductor ceramic packaging, enhancing product stability and reliability. (read more)

Ceramic injection molding (CIM) is the main branch of powder injection molding (PIM) technology, is developed on the basis of polymer injection molding technology, is a polymer injection forming method and ceramic preparation process combined to develop a new process to prepare ceramic parts. For the mass production of ceramic products with high size accuracy and complex shape, using cer... (read more)

Discover the ultimate solution for precise chip packaging with our innovative ceramic spring nozzle. (read more)

Suntech has started ceramics production for more than ten years. We launched ceramic grinders in 2017.Suntech ceramic parts are certificated by NFS51 and FDAThe grinders are made by high purity alumina. It excels on hardness, wear, heat resistance and anti-rusting over steel. (read more)

Enhancing Thermal Stability and Precision in High-Speed Rotation Systems (read more)

Overcoming Metal Shortages through Superior Ceramic Solutions (read more)

Enhancing Soldering Quality with Wedge Capillaries (read more)

Understanding capillary aging in wire bonding, its impact on solder joint quality, and methods to mitigate deterioration for prolonged capillary life. (read more)

The Zirconia ceramic is widely used in many fields, as it can effectively improve the brittleness performance through the unique phase transformation toughening mechanism. The black zirconia ceramic produced by Shenzhen Suntech Advanced ceramic Co., ltd, is made of nano ZrO2 ceramic powder and nano black pigment powder. (read more)

Discover how Suntech's innovative ceramic nozzles revolutionize surface mount systems, ensuring unparalleled wear resistance and precision placement. (read more)

Special characteristics and advantages of Suntech advanced ceramics

Product application

Because the excellent special characteristics of advanced ceramics. Super pure ceramics usually apply to the cycle of semiconductor manufacture, include semiconductor chip and chip handling, semiconductor manufacture(front-end) and semiconductor package(behind-end).... (read more)

Compared with traditional DBC substrate, ceramic substrate prepared by AMB technology not only has higher thermal conductivity, better copper layer bonding, but also has the advantages of lower thermal resistance, higher reliability. (read more)

Innovative Material for Precision Applications (read more)

Unveiling the Potential of Next-Generation Ceramic Materials (read more)

The latest generation of alumina toughened zirconia composite ceramic hip joint ball, one stroke optimization of the first three generations of hip joint ball, making it the most suitable hip joint material products, due to its material performance superiority and stability, raw material manufacturing process has high technical barriers, in addition to ceramic material brittleness, fract... (read more)

Innovative Solutions for Heat Dissipation and Hermetic Sealing Challenges (read more)

Micro-hole spark machine has the advantages of high processing efficiency, high precision, good consistency, easy operation, no pollution and so on. Applied to engine nozzle, semiconductor collets and other fields. (read more)

Enhancing High-Speed Performance and Thermal Stability (read more)

With the power of computer components increasing, the heat is getting bigger than ever. The issue of computer cooling already caused the attention of people adequately. More and more people choice special cooling fan for the core chip in personal computer excepting power supply and CPU. (read more)

Empowering High-Performance Electronics with Superior Heat Dissipation (read more)

The main material of ceramic heater is AIN. It is sintered with complex tungsten circuits, with fast thermal response and uniform temperature, and can integrate temperature sensors. (read more)

Aluminum nitride (AlN) ceramics as a high thermal conductivity, thermal expansion coefficient close to silicon semiconductor material, has good insulation and mechanical properties, aluminum nitride copper clad plate has very high thermal conductivity in thermal characteristics, heat dissipation fast. (read more)

Silicon carbide is a special ceramics which is made by sintering silicon carbide powder and an organic binder at high temperature under the action of an additive. Its hardness is just lower than that of diamond. (read more)

Tailored Technology Parameters for Superior Performance (read more)

Suntech designs and manufactures various types of dispensing nozzles for the die bonding process.

Our dispensing nozzles can be made by SUS，tungsten and ceramics, and the dispensing nozzles have been widely used on ESEC (BESI), ASM or any other die bonding machine. (read more)

Gel plunger has more advantages compared with other molding methods and is more competitive in the subsequent market competition. (read more)

The material which have high strength and toughness, high thermal conductivity can reduce the chip junction temperature, improve the overall efficiency of the device module, and prolong the life cycle. (read more)

DLC coating on ceramic surface is a kind of diamond carbon coating prepared on ceramic surface by physical vapor deposition (PVD) technology. It has the advantages of high hardness, wear resistance, corrosion resistance and high temperature resistance. It is widely used in machinery, electronics, optics and aviation fields. (read more)

Wire bonding is currently the mainstream connection method for semiconductors packaging. Commonly used wire bonding welding methods include thermocompression welding, ultrasonic welding and ultrasonic thermocompression welding. Wire bonding can be categorised as ball bonding and wedge bonding according to the shape of the welded solder joints. (read more)

Gel plunger has more advantages compared with other molding methods and is more competitive in the subsequent market competition. (read more)

This paper introduces the preparation process of ceramic hip joint and the advantages of ceramic hip joint. (read more)

This paper introduces the advantages and characteristics of ceramic hip join (read more)

Due to the advantages of simple equipment, continuous operation, high production efficiency and uniform body performance, tape casting has become an important method for preparing large-area, ultra-thin ceramic substrates. (read more)

In order to achieve more efficient and reliable bonding with silver alloy wire, the specially treated texture of Suntech ceramic capillary is recommended, which has been proven to enhance the coupling interface between the capillary tip surface and the silver alloy wire, providing more efficient ultrasonic energy transfer. (read more)

Products have passed the ROHS and REACH environmental certification of the European Chemicals Agency, in accordance with EU Regulation No. 1907/2006. (read more)

Suntech Advanced Ceramics uses cutting-edge ceramic technology for high-end cosmetic applications and packaging components to complement cosmetic applications. (read more)

Ceramic tweezer have the advantages of anti-static, high using temperature, good heat insulation, high hardness, good resistance to acid, long product life, etc. It could greatly improve the performance compared with traditional tweezers and is the best choice for high-precision electronic products, ultra-high temperature welding. (read more)

Ceramic capillaries are the primary tools used for wire bonding. Under the influence of pressure, heat, and ultrasonic vibration, these capillaries are used to bond wires with diameters ranging from 0.025mm to 0.050mm onto solder pads or pins. (read more)