Isopaste Thermally Conductive Paste
from Acrolab Ltd.

Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. Larger quantities can be arranged with your Acrolab Engineering... [See More]

  • Substrate Compatibility: Metal; Used with Isobar® Heat Pipe
  • Cure / Technology: Thermoset; Single Component
  • Composition: Unfilled
  • Features: Thermally Conductive
POLY-CARB MARK-29
from Dow Polyurethanes

ADHESIVE FOR PLOWABLE & NON-PLOWABLE MARKERS A 100% solids, two-part epoxy system designed to be used as a fast setting, low viscosity (pourable) structural adhesive. Features. Low viscosity material can be poured into grooves where thick bonding agents cannot be used. Fast paced traffic can be... [See More]

  • Substrate Compatibility: Concrete, Masonry; Asphalt
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Permabond Anaerobic Threadlocker -- HH120 50ML BOTTLE
from Ellsworth Adhesives

PERMABOND HH120 Threadlocker is an excellent general-purpose threadlocker and sealant. Sold as a pack (10/pk). [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Paper or Paperboard; Plastic; Porous Surfaces; Wood; Dissimilar Substrates
  • Type / Form: Gel
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
INSULBOND 839 Adjustable Flexibility Epoxy Adhesive
from ITW Polymer Technologies - Insulcast Division

INSULBOND 839 is a thixotropic paste epoxy adhesive with adjustable flexibility. INSULBOND 839 can be cured at room temperature or at elevated temperatures. The INSULBOND 839 flexibility is determined by the amount of Part B used. INSULBOND 839 exhibits a good mechanical bond, peel strength and... [See More]

  • Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Wood
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Epoxy For Bonding Treated Fluropolymers -- EP19M
from Master Bond, Inc.

Master Bond Polymer System EP19M is a high performance epoxy resin formulation specially formulated to bond to treated fluoropolymer and other difficult to bond surfaces. It is supplied as a single component low viscosity compound and requires cure at elevated temperatures in order to obtain high... [See More]

  • Substrate Compatibility: Fluoropolymer/Difficult to Bond Surfaces
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
Scotch-Weld Adhesive 1386 -- 1386 [1386 from 3M]
from R. S. Hughes Company, Inc.

Very clear, fast setting, room temperature curing, two-part adhesive [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Wood
  • Type / Form: Gel
  • Chemical System: Epoxy
  • Composition: Unfilled
RTV-1 Silicone Rubber / Adhesive -- ELASTOSIL® N 2189
from Wacker Chemical Corp.

ELASTOSIL ® N2189 is a non-slump, one-part silicone sealant, which cures at room temperature under influence of moisture. Special features. neutral curing system (alkoxy). short skin forming time. non-slump. primerless adhesion to many substrates. excellent adhesion to cast magnesium. good... [See More]

  • Substrate Compatibility: Metal; Cast Magnesium
  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone; Elastomeric
  • Features: Flame Retardant; Sealant
3M™ Scotch-Grip™ Rubber And Gasket Adhesive -- 847 Brown
from 3M Aerospace and Aircraft Maintenance Division

3M ™ Scotch-Weld ™ Nitrile High Performance Rubber And Gasket Adhesive 847 is a premium quality, reddish brown, multi-purpose adhesive that develops strong flexible bonds. Develops strong flexible bonds very rapidly to a wide variety of substrates, including many plastics and rubbers,... [See More]

  • Substrate Compatibility: Plastic; Rubber or Elastomer; Gasketing Materials, Leather
  • Type / Form: Liquid
  • Chemical System: Elastomeric
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Power Grab Adhesive -- AAAD
from Acoustical Solutions, Inc.

AlphaPanel ™ Adhesive is a non-toxic water based adhesive that makes installation quick and easy by providing a strong permanent bond when apply foam panels to walls or ceilings. It offers easy clean up and is compatible with all polyurethane and melamine foam products. The tubes are 10.1... [See More]

  • Substrate Compatibility: Paper or Paperboard; Plastic; Porous Surfaces; Dissimilar Substrates; Acoustical Foam Products
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Elastomeric
  • Features: Flexible; Water Based 
Aremco-Seal™ -- FO-380
from Aremco Products, Inc.

Hi-temp, low viscosity, easy to use, offered in alternative pigments [See More]

  • Substrate Compatibility: Fiberoptics
  • Composition: Unfilled
  • Chemical System: Silicone
  • Cure / Technology: Thermoset
Hardman<reg> Epoxy and Urethane Ad -- GO-08778-02
from Cole-Parmer

Epoxy,quick-set, 10/pk. Complete selection of epoxies for all your maintenance needs. Single-use adhesives are perfect for quick repair jobs. Applications: Wood, metal, glass, stone, concrete, and leather. Model: 4001-BG10. Manufacturer number: 4001-BG10. Temperature range (*F): -20 to 180 &176;F. [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Wood; Leather
  • Cure / Technology: Thermoset
  • Chemical System: Epoxy
  • Use Temperature: -20 to 180
FDA Approved Compliant Epoxy System -- 10-3039
from Epoxies Etc...

10-3039 is a room temperature curing, two component epoxy. This system meets the Food and Drug Administration (FDA) regulations permitting use in food contact applications. When properly cured, these products comply with the FDA regulations of Title 21 Code of Federal Regulations under Sections... [See More]

  • Substrate Compatibility: Concrete, Masonry; Metal; Food Contact Applications
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
GSP 1339-1
from GS Polymers, Inc.

Two part, 4:1 flowable, chemical & thermal resistance [See More]

  • Substrate Compatibility: Ceramic, Glass; Concrete, Masonry (optional feature); Composites (optional feature); Metal; Paper or Paperboard; Porous Surfaces; Dissimilar Substrates; Wide Range of Substrates
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Hysol® Die Attach Adhesive -- KO0125
from Henkel Corporation - Electronics

Withstands polymer decomposition during reflow [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Cu, Pd, Ag, and Au Plating
  • Type / Form: Gel
  • Chemical System: Epoxy
  • Composition: Filled
HASA -- 718
from Hernon Manufacturing, Inc.

HERNON ® offers a complete line of structural anaerobics, the HASA line of products. These adhesives are 100% active single component adhesives that cure upon exclusion of air. HASA adhesive have been highly engineered to meet specific design criteria combing high tensile, impact, temperature,... [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Dissimilar Substrates; Magnets
  • Type / Form: Liquid
  • Chemical System: Polyurethane
  • Composition: Unfilled
Epoxy Adhesive -- E107
from Koford Engineering, LLC

E-107 is a high performance silica filled single component adhesive which provides exceptional shearstrength in combination with high peel strength, impact resistance, and good temperature resistance.Especially suitable for bonding magnets and other applications where dissimilar materials are bonded... [See More]

  • Substrate Compatibility: Metal; Dissimilar Substrates; Magnets
  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Use Temperature: 356 to 392
Epoxy Adhesive -- ANE-26144
from Protavic America, Inc.

Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]

  • Substrate Compatibility: Ceramic, Glass; Metal; Plastic; FR4 Substrates, Ferrites
  • Type / Form: Liquid
  • Chemical System: Epoxy
  • Composition: Unfilled