Product Announcements:
Electronics and Microelectronics Manufacturing

Advanced porous ceramic vacuum chucks featuring sub-micron flatness and uniform airflow distribution, engineered to eliminate wafer deformation and minimize TTV during 300mm semiconductor backgrinding and inspection. Read more...

Advanced ceramic solutions provide outstanding stability, cleanliness, and durability in demanding semiconductor environments, helping improve process consistency, equipment performance, and manufacturing efficiency. Read more...

High-performance electrostatic chucks with stable clamping force, fast dechucking, and uniform helium cooling for plasma etch, CVD, and PVD chambers. Read more...

How Suntech Ceramic Capillaries Compete Globally in the Semiconductor Packaging Market Read more...

In copper wire bonding, inert gas is essential to block oxygen from the atmosphere and prevent oxidation of the Free Air Ball (FAB) during ball formation. Without proper shielding, oxidation can damage bonding quality and lead to reliability issues.

Oxygen content is a key factor in this process. If oxygen levels are too high, the FAB can deform and oxidize during melting. As the... Read more...

Designed for next-generation manufacturing, this high-purity component delivers non-destructive wafer holding via uniform micro-pores. It ensures excellent flatness during high-vacuum processing while preventing contamination. By maintaining sub-micron coplanarity, it directly enhances production yields in lithography and inspection. Read more...

LED vs. IC Packaging Ceramic Capillaries: Find the Perfect Fit for Your Semiconductor Bonding Needs Read more...

Air bearing positioning tables with zero friction, no wear, and sub-micron accuracy. Used in wafer inspection, precision metrology, and laser processing. Travel range up to 1200mm per axis, load capacity up to 100 kg. Read more...

High-precision SiC pre-aligner chucks feature excellent thermal stability and chemical resistance, making them ideal for wafer clamping, inspection, and handling applications in semiconductor manufacturing. Read more...

High-precision wafer pin silicon carbide chuck designed for semiconductor manufacturing, offering strong adsorption, excellent stability, and resistance to high temperature, corrosion, and wear. Ideal for wafer clamping and prealigner applications. Read more...