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Supplier: Oak-Mitsui, Inc.
Description: Aluminum Bonded Copper or “ABC” represents a quality alternative to copper/aluminum lamination separator plates. Continuous process ultrasonic welding performed in a clean room environment is the basis surrounding ABC’s product technology. Critical metal surfaces are cleaned
- Nonferrous Metals: Non-ferrous - Any Type, Aluminum / Aluminum Alloy (UNS A)
- Alloy: Yes
- Applications: Electronics / RF-Microwave
Supplier: Alfa Laval Inc.
Description: Gasket-free Alfa Nova M plate heat exchangers (PHEs) feature both plates and brazing of 100% stainless steel. Intended for use as indirect cargo condensers and/or heaters aboard LPG/E carriers, they are also ideal for many other gas system duties as a result of their wide temperature range
- Applications: Marine / Shipboard
- Temperature Range: -321 to 1022 F
- Type: Plate
- Primary Exchanger Material: Stainless Steel
Description: PA&E has over 20 years of experience in metal surface finishing. We are experts at plating a variety of metals including aluminum, titatnium, iron/nickel alloys, copper and even our explosively bonded bi-metallic transition materials. We have a staff of certified chemical and process engineers
- Plating Processes: Copper Plating, Gold Plating, Nickel Plating - Hard, Silver Plating, Tin Plating, Other
- Material / Substrate: Aluminum, Copper / Copper Alloys, Iron / Cast Iron, Metal, Nickel / Nickel Alloys, Precious Metals, Stainless Steel, Steel / Steel Alloys, Titanium
- Additional Services: Electropolishing
- Industry: Aerospace, Energy / Utilities, Military Specification, OEM / Industrial, Vessels (Tanks / Reactors)
Supplier: PLANSEE SE
Description: Wafer substrates are bonded to the semiconductor layers of LED chips. With molybdenum and molybdenum-copper wafer substrates, PLANSEE offers the optimum material for a reliable heat dissipation in LED chips. The uniform thermal expansion of the wafer substrate, sapphire substrate and ceramic base
Heat and Energy Recovery Systems - Packaged Air Dynamic Handling Units With Cross-flow Heat Exchangers With Centrifugal Fans And Hermetic Scroll Compressors -- Climamixer
Description: Packaged air dynamic handling units with crossflow heat exchangers with centrifugal fans and hermetic scroll compressors. • Compressors scroll hermetic type. • Double suction centrifugal fans. • Air side heat exchanger with seamless copper tubes and plate type aluminium fins
- Application: Commercial, Residential
- System Type: Heat Energy Recovery
Description: tubes and plate type aluminium fins mechanically bonded to the tubes. • Heat recovery exchanger is an air to air exchanger characterized by the fact that the plates are corrugated. • Microprocessor. • Casing made of painted galvanised steel. MOUNTED ACCESSORIES • Over/under
- Cooling Capacity: 4.8 to 22.1 kW
- Process Flow: 3082 to 15410 GPM
- Compressor Motor Horsepower: 1.47 to 7.91 HP
- Power Source: 380 / 50 / 3, Other Power
Description: Homogeneous Si Trench = Trenchgate technology Vcesat with positive temperature coefficient High short circuit capability, self limiting to 6x Ic Low inductance case Isolated by Al2O3 DCB (Direct Copper Bonded) ceramic plate Pressure contact technology for thermal contacts Vf value
- Transistor Type / Technology: IGBT
- Transistor Grade / Operating Range: Industrial
Supplier: Materion Corporation
Description: High purity copper sheets 0.010" or 0.012" (250 or 300 microns) thick can be directly bonded to BeO or alumina substrates by the direct bond copper process, which involves the materials being bonded by a ternary phase of Be-Cu-O and Al-Cu-O. The result is a strong, hermetic bond of thick copper
- Electroceramic Type: Other
- Shape / Form: Bar Stock
- Applications: Other
Description: Features Glass passivated silicon chips Low thermal impedance through use of direct copper bonded aluminum substrate (DCB) base plate Blocking voltage up to 1800 V Suitable for PCB mounting and wave soldering For applications with high vibrations we recommend to fasten the bridge to the pcb
- Diode Type: Other
- Diode Applications: Rectifier Diode
- VF: 1.45 volts
- Tj: -40 to 302 F
Description: section) propeller type. • Air side heat exchangers finned coil with seamless copper tubes and plate type aluminium fins mechanically bonded to the tubes. • Microprocessor. • Aluminium profile casing and galvanized and painted steel removable panel for maintenance inspection. MOUNTED
Description: Features Industrial standard package Electrically insulated base plate Heat transfer through aluminum oxide ceramic insulated metal base plate Chip soldered on direct copper bonded Al2O3 ceramic Thyristor with center gate UL recognition applied for file no. E63532 Typical Applications DC
- Thyristor Type: Silicon Controlled Rectifier (SCR)
- IC Package Type: Other
- Pin Count: 7
- Number of Thyristors in Package: 2
Supplier: Visual Sound, Inc.
Description: designed for control and support cone edge travel and resist against mechanical deformation in compact enclosure high pressure conditions. The whole suspension system offers extremely controlled transient response. The 100mm (4 in) copper round wire voice coil, based on Interleaved Sandwich Voice coil (ISV
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Featured Products Top
Aluminum Bonded Copper
Aluminum Bonded Copper or "ABC" represents a quality alternative to copper/aluminum lamination separator plates. Continuous process ultrasonic welding performed in a clean room environment is the basis surrounding ABC's product technology. Critical metal surfaces are cleaned then bonded without the use of an adhesive which could interfere with the subsequent outer layer processing of the multilayer. In short, use of ABC instead of the conventional component lay-up / wiping technique ensures... (read more)
Browse Copper, Brass, and Bronze Alloys Datasheets for Oak-Mitsui, Inc.
H.C. Starck Inc. - Fabricated Products Group
Molybdenum Glass Melting Electrodes
processes that provide molybdenum and other refractory metals with outstanding protection against oxidation at high temperatures. These ceramic coatings are integral with and chemically bonded to the metal surface and they cannot separate or spall. Being produced via a chemical vapor deposition, the coatings can be applied uniformly to all surfaces including the inside of thin tubes. . GMEs Manufactured from Powder Metallurgical Processing. Structure. Glass melting electrodes will normally... (read more)
Browse Molybdenum and Molybdenum Alloys Datasheets for H.C. Starck Inc. - Fabricated Products Group
Conduct Research Top
Actively cooled cold plates utilize copper or aluminum tubes. They are typically bonded into aluminum plates to reduce weight and optimize thermal conductivity thus minimizing hot spots on the electronics that may be mounted onto the plates. Alternatively, cold plates may have machined passages
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Fabrication Methods for Precision Optics
Copper plated bonds provide a softer alternative to the nickel plated tools.
Journal of Spacecraft and Rockets > Vented Tank Resupply Experiment: Flight Test Results
The presence of liquid in the vent line was indicated by capacitance-type meters consisting of an acrylic tube with two copper plates bonded to the exterior.
Encyclopedia of Radiation Oncology
In the camera-based system, a 2 mm thick copper plate bonded to an underlying gadolin- ium oxy-sulfide (Gd2O2S) phosphor screen is used to detect the x-rays and produce an optical signal.
Proceedings of the 1979 linear accelerator conference
The girder is a closed profile,made of mild steel,with a copper plate bonded to the bottom flange by epoxy resin.
Comparative testing of slurry monitors
To aid temperature uniformity, copper plate bonded with heat conducting epoxy will be placed on the large side surfaces.
An iterative algorithm for reconstructing incident beam distributions
from transmission measurements using electronic portal imaging
The imager has a converter comprising a 1 mm thick copper plate bonded to a 134 mg cm?2 Gd2O2S:Tb phosphor screen.
Correction of scatter in megavoltage cone-beam CT
It is CCD camera-based and has a converter comprising a 1 mm thick copper plate bonded to a 134 mg cm?2 Gd2O2S:Tb phosphor.
Thermal performance of novel thin heat pipe
The thin heat pipe is constructed of two machined copper plates bonded together to form the body, with a wick bonded internally.
Simulation of a Novel Copper Heat Sink Using Copper Pipe and AM Method for CPU Group Heat Removing in Power Transformer's Cabinet
Copper heatsinks can be milled, die- cast, or made of copper plates bonded together; extrusion is not possible.
Cooling Microstructure for Automotive Electronic Module
The semiconductor structure is soldered to DCB (Direct Copper Bonding ) plate .
Design and R&D results of the joints for the ITER conductor
Alternatively, sucuh as in , the termination is a rectan- gnlar box, with one side consisting of a copper plate bonded to the structural box prior to the assembly of the termination (e.g. by explosive bonding ,or vacuum brazing).
Comparison of electrical characteristics of barbed-plate and wire-plate precipitators
The segmented ground plate is a 0.8-mm thick copper plate bonded with insulating epoxy to a 7.9-mm thick fiberglass laminate board (the material used in printed circuit boards).
Electrical machines and drives
Into image 10.2.7-1 c, the copper plates frontally conductively connected between individual sheet metal segment positions (in the image sinisterly!) as originating cage are inserted.
For determination of small amounts of copper
The zinc rod can be held also by means of a small terminal, and the shell can one to set to a copper plate connected to the wire sling.