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Supplier: Oak-Mitsui, Inc.
Description: Aluminum Bonded Copper or “ABC” represents a quality alternative to copper/aluminum lamination separator plates. Continuous process ultrasonic welding performed in a clean room environment is the basis surrounding ABC’s product technology. Critical metal surfaces are cleaned
- Nonferrous Metals: Non-ferrous - Any Type, Aluminum / Aluminum Alloy (UNS A)
- Alloy: Yes
- Applications: Electronics / RF-Microwave
Supplier: Alfa Laval Inc.
Description: Gasket-free Alfa Nova M plate heat exchangers (PHEs) feature both plates and brazing of 100% stainless steel. Intended for use as indirect cargo condensers and/or heaters aboard LPG/E carriers, they are also ideal for many other gas system duties as a result of their wide temperature range
- Applications: Marine / Shipboard
- Temperature Range: -321 to 1022 F
- Type: Plate
- Primary Exchanger Material: Stainless Steel
Supplier: PLANSEE SE
Description: Wafer substrates are bonded to the semiconductor layers of LED chips. With molybdenum and molybdenum-copper wafer substrates, PLANSEE offers the optimum material for a reliable heat dissipation in LED chips. The uniform thermal expansion of the wafer substrate, sapphire substrate and ceramic base
Supplier: SOURIAU PA&E
Description: PA&E has over 20 years of experience in metal surface finishing. We are experts at plating a variety of metals including aluminum, titatnium, iron/nickel alloys, copper and even our explosively bonded bi-metallic transition materials. We have a staff of certified chemical and process engineers
- Plating Processes: Copper Plating, Gold Plating, Nickel Plating - Hard, Silver Plating, Tin Plating, Other
- Material / Substrate: Aluminum, Copper / Copper Alloys, Iron / Cast Iron, Metal, Nickel / Nickel Alloys, Precious Metals, Stainless Steel, Steel / Steel Alloys, Titanium
- Additional Services: Electropolishing
- Industry: Aerospace, Energy / Utilities, Military Specification, OEM / Industrial, Vessels (Tanks / Reactors)
Packaged Air Dynamic Handling Units With Cross-flow Heat Exchangers With Centrifugal Fans And Hermetic Scroll Compressors -- Climamixer
Description: Packaged air dynamic handling units with crossflow heat exchangers with centrifugal fans and hermetic scroll compressors. • Compressors scroll hermetic type. • Double suction centrifugal fans. • Air side heat exchanger with seamless copper tubes and plate type aluminium fins
- Application: Commercial, Residential
- System Type: Heat Energy Recovery
Description: Homogeneous Si Trench = Trenchgate technology Vcesat with positive temperature coefficient High short circuit capability, self limiting to 6x Ic Low inductance case Isolated by Al2O3 DCB (Direct Copper Bonded) ceramic plate Pressure contact technology for thermal contacts Vf value
- Transistor Type / Technology: IGBT
- Transistor Grade / Operating Range: Industrial
Description: exchanger with seamless copper tubes and plate type aluminium fins mechanically bonded to the tubes. • Heat recovery exchanger is an air to air exchanger characterized by the fact that the plates are corrugated. • Microprocessor. • Casing made of painted galvanised steel. MOUNTED
- Cooling Capacity: 4.8 to 22.1 kW
- Process Flow: 3082 to 15410 GPM
- Compressor Motor Horsepower: 1.47 to 8.04 HP
- Power Source: 380 / 50 / 3, Other Power
Supplier: Materion Corporation
Description: High purity copper sheets 0.010" or 0.012" (250 or 300 microns) thick can be directly bonded to BeO or alumina substrates by the direct bond copper process, which involves the materials being bonded by a ternary phase of Be-Cu-O and Al-Cu-O. The result is a strong, hermetic bond of thick copper
- Electroceramic Type: Other
- Shape / Form: Bar Stock
- Applications: Other
Description: section) propeller type. • Air side heat exchangers finned coil with seamless copper tubes and plate type aluminium fins mechanically bonded to the tubes. • Microprocessor. • Aluminium profile casing and galvanized and painted steel removable panel for maintenance inspection. MOUNTED
Description: Features Glass passivated silicon chips Low thermal impedance through use of direct copper bonded aluminum substrate (DCB) base plate Blocking voltage up to 1800 V Suitable for PCB mounting and wave soldering For applications with high vibrations we recommend to fasten the bridge to the pcb
- Diode Type: Other
- Diode Applications: Rectifier Diode
- VF: 1.45 volts
- Tj: -40 to 302 F
Description: Features Industrial standard package Electrically insulated base plate Heat transfer through aluminum oxide ceramic insulated metal base plate Chip soldered on direct copper bonded Al2O3 ceramic Thyristor with center gate UL recognition applied for file no. E63532 Typical Applications DC
- Thyristor Type: Silicon Controlled Rectifier (SCR)
- IC Package Type: Other
- Pin Count: 5
- Number of Thyristors in Package: 2
Supplier: Visual Sound, Inc.
Description: designed for control and support cone edge travel and resist against mechanical deformation in compact enclosure high pressure conditions. The whole suspension system offers extremely controlled transient response. The 100mm (4 in) copper round wire voice coil, based on Interleaved Sandwich Voice coil (ISV
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Aluminum Bonded Copper
Aluminum Bonded Copper or "ABC" represents a quality alternative to copper/aluminum lamination separator plates. Continuous process ultrasonic welding performed in a clean room environment is the basis surrounding ABC's product technology. Critical metal surfaces are cleaned then bonded without the use of an adhesive which could interfere with the subsequent outer layer processing of the multilayer. In short, use of ABC instead of the conventional component lay-up / wiping technique ensures... (read more)
Browse Copper, Brass, and Bronze Alloys Datasheets for Oak-Mitsui, Inc.
H.C. Starck Inc. - Fabricated Products Group
Molybdenum Glass Melting Electrodes
processes that provide molybdenum and other refractory metals with outstanding protection against oxidation at high temperatures. These ceramic coatings are integral with and chemically bonded to the metal surface and they cannot separate or spall. Being produced via a chemical vapor deposition, the coatings can be applied uniformly to all surfaces including the inside of thin tubes. . GMEs Manufactured from Powder Metallurgical Processing. Structure. Glass melting electrodes will normally... (read more)
Browse Molybdenum and Molybdenum Alloys Datasheets for H.C. Starck Inc. - Fabricated Products Group
Conduct Research Top
Actively cooled cold plates utilize copper or aluminum tubes. They are typically bonded into aluminum plates to reduce weight and optimize thermal conductivity thus minimizing hot spots on the electronics that may be mounted onto the plates. Alternatively, cold plates may have machined passages
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Cooling Microstructure for Automotive Electronic Module
The semiconductor structure is soldered to DCB (Direct Copper Bonding ) plate .
Methodology for the design assurance of aricraft lightning protection systems continued airworthiness
Nickel plated copper bond jumpers offer improved protection from moisture and degradation due to environment.
Over the attempts of the Hrn. Mrs. Exner to the theory of the Volta'schen fundamental attempt
The Electrometernadel is connected to the copper plate and derived to the earth; the Condensator becomes geschloesen maintaining the connection with the earth beeteht in itself metallically.
Cryogenic Conduction Cooling Test of Removable Panel Mock-Up for ITER Cryostat Thermal Shield
Then the bonded copper plate is partially removed by machining to obtain a copper bridge pattern as shown in Fig. 2.
Kontakt�? potentials between metals: history, terms and permanent misunderstandings, part 1
In image 2b, the positive battery terminal is connected to the copper plate , and the straight line rnit of positive slope represents the copper charge.
Thermally Induced Failure of Copper�?Bonded Alumina Substrates for Electronic Packaging
The copper on one side must be patterned for an electric circuit which may be made either by bonding small copper chips or by etching a bonded copper plate .
Planning The National New Technology Telescope (NNTT): III. Primary Optics - Tests On A 1.8-M Borosilicate Glass Honeycomb Mirror
A 2 -inch square of duct tape was applied over the thermistor / copper plate bonding it to the glass.
Travel to Battelle Memorial Institute. Trip report, September 17, 24, and October 8, 1953
3ecent success with s o l d e r bonding copper plated aluminum and--.
Mechanical Strength and Failure Characterization of Sn-Ag-Cu Intermetallic Compound Joints at the Microscale
A four-point bending test with a notched speci- men, a very common configuration used for mea- suring fracture toughness and critical strain energy release rate, was conducted using copper plates bonded using a thick layer (average 220 lm) of IMC material.
Experimental Investigation of Texture Gradients in Aluminium/Copper Plates Bonded through Explosive Welding Process
• Experimental Investigation of Texture Gradients in Aluminium/ Copper Plates Bonded through Explosive Welding Process, p.603 .
carbonate outside walls, with 2 copper plates bonded to their outside .
Ultra-high density, thin core and low loss organic system-on-package (SOP) substrate technology for mobile applications
Plated Copper Bonding Strength .
Modelling of jet-impingement cooling for power electronics
Total 6 IGBTs have been placed on the direct bonded copper plate .