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Supplier: Oak-Mitsui, Inc.
Description: Aluminum Bonded Copper or “ABC” represents a quality alternative to copper/aluminum lamination separator plates. Continuous process ultrasonic welding performed in a clean room environment is the basis surrounding ABC’s product technology. Critical metal surfaces are cleaned
- Nonferrous Metals: Non-ferrous - Any Type, Aluminum / Aluminum Alloy (UNS A)
- Alloy: Yes
- Applications: Electronics / RF-Microwave
- Shape / Form: Semi-finished Shape / Mill Stock, Foil
Supplier: Materion Corporation
Description: for applications requiring low thermal resistance and high current-carrying capabilities. Plates of alumina or BeO are blanket bonded on both faces with Cu, and then the Cu is photoetched into the desired pattern. After patterning, the copper can be plated with Ni and Au.
- Electroceramic Type: Other
- Shape / Form: Bar Stock
- Applications: Other
Description: Features Industrial standard package Electrically insulated base plate Heat transfer through aluminum oxide ceramic insulated metal base plate Chip soldered on direct copper bonded Al2O3 ceramic Thyristor with center gate UL recognition applied for file no. E63532 Typical Applications DC
- Thyristor Type: Silicon Controlled Rectifier (SCR)
- IC Package Type: Other
Description: Key Features Enhanced aluminum fins bonded to durable rifled copper tube Corrosion resistant aluminum end plates Pressure tested to 450 lbs. Polymer drain pan
Description: Homogeneous Si Trench = Trenchgate technology Vcesat with positive temperature coefficient High short circuit capability, self limiting to 6x Ic Low inductance case Isolated by Al2O3 DCB (Direct Copper Bonded) ceramic plate Pressure contact technology for thermal contacts Vf value
- Transistor Type / Technology: IGBT
- Transistor Grade / Operating Range: Industrial
- Features: Output Diode
Heat and Energy Recovery Systems - Packaged Air Dynamic Handling Units With Cross-flow Heat Exchangers With Centrifugal Fans And Hermetic Scroll Compressors -- ClimamixerSupplier: Thermocold Costruzioni Srl
Description: Packaged air dynamic handling units with crossflow heat exchangers with centrifugal fans and hermetic scroll compressors. • Compressors scroll hermetic type. • Double suction centrifugal fans. • Air side heat exchanger with seamless copper tubes and plate type aluminium fins
- Application: Commercial, Residential
- System Type: Heat Energy Recovery
Supplier: PLANSEE SE
Description: Wafer substrates are bonded to the semiconductor layers of LED chips. With molybdenum and molybdenum-copper wafer substrates, PLANSEE offers the optimum material for a reliable heat dissipation in LED chips. The uniform thermal expansion of the wafer substrate, sapphire substrate and ceramic base
Description: Features Glass passivated silicon chips Low thermal impedance through use of direct copper bonded aluminum substrate (DCB) base plate Blocking voltage up to 1800 V Suitable for PCB mounting and wave soldering For applications with high vibrations we recommend to fasten the bridge to the pcb
- Diode Type: Other
- Diode Applications: Rectifier Diode
- Rectifier Type: Full-wave
- Rectifier Configuration / Technology: Bridge
Supplier: Thermocold Costruzioni Srl
Description: exchanger with seamless copper tubes and plate type aluminium fins mechanically bonded to the tubes. • Heat recovery exchanger is an air to air exchanger characterized by the fact that the plates are corrugated. • Microprocessor. • Casing made of painted galvanised steel. MOUNTED
- Power Source: 380 / 50 / 3, Other Power
- Application / Industry: HVAC
- Condenser Cooling System: Water-Cooled
- Other Features: Microprocessor Control
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Featured Products for Copper Bonded Plate Top
Aluminum Bonded Copper
Aluminum Bonded Copper or "ABC" represents a quality alternative to copper/aluminum lamination separator plates. Continuous process ultrasonic welding performed in a clean room environment is the basis surrounding ABC's product technology. Critical metal surfaces are cleaned then bonded without the use of an adhesive which could interfere with the subsequent outer layer processing of the multilayer. In short, use of ABC instead of the conventional component lay-up / wiping technique ensures... (read more)
Browse Copper, Brass, and Bronze Alloys Datasheets for Oak-Mitsui, Inc.
Conduct Research Top
Designing Custom Cold Plates
protection. Several patterns for different ranges of required impedance, pressure drop, and flow have been developed. (See Figure 5.). Inner-Finned Brazed Cold Plates - Inner-finned brazed cold plates consist of two plates metallurgically bonded together with internal fin. They can be vacuum-brazed
Low-Melting Metallic Sputtering Targets Bonded At Room Temperature (Ambient)
to a backing plate with Nano-. Foil® that is pre-coated with solder. Nanobond® Technology. Figure 1. Indium target bonded to a copper backing plate with NanoFoil® material. The process of bonding with NanoFoil®. is a mature technology that has been. solder layer. The heat released is not. used
Actively cooled cold plates utilize copper or aluminum tubes. They are typically bonded into aluminum plates to reduce weight and optimize thermal conductivity thus minimizing hot spots on the electronics that may be mounted onto the plates. Alternatively, cold plates may have machined passages
Cold Plate Manufacturing Cost Drivers
of two plates metallurgically bonded together with internal fin. They are available in all sizes and offer extremely high performance, making them ideal for applications where heat loads are concentrated. With both tubed and vacuum-brazed cold plate technologies, the labor time is limited. Therefore
Aircraft Liquid Cooling
tube, and performance-fin. Vacuum-brazed performance-fin is the cold plate technology most often found on aircraft. (See Figure 3.) Performance-fin cold plates consist of two plates metallurgically bonded together with internal fin, the most common of which are vacuum-brazed. With aluminum
Medical Device Link .
and investment casting. The economical process has been used, for example, to mold laparoscopic surgical devices from 17-4PH stainless steel. The company offers design assistance that includes extensive finite element analysis, as well as prototyping and production services. Bonded tubing produced by means
An Introduction to ASTM B898, The Reactive and Refractory Metal Clad Specification (.pdf)
applies to clad plates consisting of titanium, zirconium, tantalum, niobium, and. their alloys integrally bonded to a base metal plate of steel or any other metal. The cladding may be. performed by any technology, which produces a compliant product. Cladding methods may be, but are. not limited
Air Cooled Heat Pipe Assembly (.pdf)
the available envelope. · Folded Fins Extended surface in the form of folded fins remove heat directly. from the base mounting plate. These fins are also made of copper and. metallurgical bonded to the heat spreader. Based on their height, thickness and. conductivity these fins approach 100% efficiency
Engineering Web Search: Copper Bonded Plate Top
ASTM B432 - 09a Standard Specification for Copper and Copper...
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Heat exchanger - Wikipedia, the free encyclopedia
An interchangeable plate heat exchanger 2.2 Plate heat exchanger 2.3 Plate and shell heat exchanger
- Mineral - Wikipedia, the free encyclopedia
- Copper & Copper Alloy Plate
HowStuffWorks "The Future of Heat Sink Materials"
Copper is one of the best materials for making heat sinks because of its very high thermal conductivity.
Vishay - Vishay Launches Gen VII Power Module Series with...
Devices Gain 20 % Improvement in Thermal Performance with Exposed Direct Bonded Copper Substrate
an intermediate layer bonded to one side of the first metal plate remote from the semiconductor element, the intermediate layer being made of a