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Supplier: Oak-Mitsui, Inc.
Description: Aluminum Bonded Copper or “ABC” represents a quality alternative to copper/aluminum lamination separator plates. Continuous process ultrasonic welding performed in a clean room environment is the basis surrounding ABC’s product technology. Critical metal surfaces are cleaned
- Nonferrous Metals: Non-ferrous - Any Type, Aluminum / Aluminum Alloy (UNS A)
- Alloy: Yes
- Applications: Electronics / RF-Microwave
Supplier: PLANSEE SE
Description: Wafer substrates are bonded to the semiconductor layers of LED chips. With molybdenum and molybdenum-copper wafer substrates, PLANSEE offers the optimum material for a reliable heat dissipation in LED chips. The uniform thermal expansion of the wafer substrate, sapphire substrate and ceramic base
Supplier: SOURIAU PA&E
Description: PA&E has over 20 years of experience in metal surface finishing. We are experts at plating a variety of metals including aluminum, titatnium, iron/nickel alloys, copper and even our explosively bonded bi-metallic transition materials. We have a staff of certified chemical and process engineers
- Plating Processes: Copper Plating, Gold Plating, Nickel Plating - Hard, Silver Plating, Tin Plating, Other
- Material / Substrate: Aluminum, Copper / Copper Alloys, Iron / Cast Iron, Metal, Nickel / Nickel Alloys, Precious Metals, Stainless Steel, Steel / Steel Alloys, Titanium
- Additional Services: Electropolishing
- Industry: Aerospace, Energy / Utilities, Military Specification, OEM / Industrial, Vessels (Tanks / Reactors)
Heat and Energy Recovery Systems - Packaged Air Dynamic Handling Units With Cross-flow Heat Exchangers With Centrifugal Fans And Hermetic Scroll Compressors -- Climamixer
Description: Packaged air dynamic handling units with crossflow heat exchangers with centrifugal fans and hermetic scroll compressors. • Compressors scroll hermetic type. • Double suction centrifugal fans. • Air side heat exchanger with seamless copper tubes and plate type aluminium fins
- Application: Commercial, Residential
- System Type: Heat Energy Recovery
Description: Homogeneous Si Trench = Trenchgate technology Vcesat with positive temperature coefficient High short circuit capability, self limiting to 6x Ic Low inductance case Isolated by Al2O3 DCB (Direct Copper Bonded) ceramic plate Pressure contact technology for thermal contacts Vf value
- Transistor Type / Technology: IGBT
- Transistor Grade / Operating Range: Industrial
Description: exchanger with seamless copper tubes and plate type aluminium fins mechanically bonded to the tubes. • Heat recovery exchanger is an air to air exchanger characterized by the fact that the plates are corrugated. • Microprocessor. • Casing made of painted galvanised steel. MOUNTED
- Cooling Capacity: 4.8 to 22.1 kW
- Process Flow: 3082 to 15410 GPM
- Compressor Motor Horsepower: 1.47 to 8.04 HP
- Power Source: 380 / 50 / 3, Other Power
Supplier: Materion Corporation
Description: High purity copper sheets 0.010" or 0.012" (250 or 300 microns) thick can be directly bonded to BeO or alumina substrates by the direct bond copper process, which involves the materials being bonded by a ternary phase of Be-Cu-O and Al-Cu-O. The result is a strong, hermetic bond of thick copper
- Electroceramic Type: Other
- Shape / Form: Bar Stock
- Applications: Other
Description: section) propeller type. • Air side heat exchangers finned coil with seamless copper tubes and plate type aluminium fins mechanically bonded to the tubes. • Microprocessor. • Aluminium profile casing and galvanized and painted steel removable panel for maintenance inspection. MOUNTED
Description: Features Glass passivated silicon chips Low thermal impedance through use of direct copper bonded aluminum substrate (DCB) base plate Blocking voltage up to 1800 V Suitable for PCB mounting and wave soldering For applications with high vibrations we recommend to fasten the bridge to the pcb
- Diode Type: Other
- Diode Applications: Rectifier Diode
- VF: 1.45 volts
- Tj: -40 to 302 F
Description: Features Industrial standard package Electrically insulated base plate Heat transfer through aluminum oxide ceramic insulated metal base plate Chip soldered on direct copper bonded Al2O3 ceramic Thyristor with center gate UL recognition applied for file no. E63532 Typical Applications DC
- Thyristor Type: Silicon Controlled Rectifier (SCR)
- IC Package Type: Other
- Pin Count: 7
- Number of Thyristors in Package: 2
Supplier: Visual Sound, Inc.
Description: designed for control and support cone edge travel and resist against mechanical deformation in compact enclosure high pressure conditions. The whole suspension system offers extremely controlled transient response. The 100mm (4 in) copper round wire voice coil, based on Interleaved Sandwich Voice coil (ISV
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Featured Products for Copper Bonded Plate Top
Aluminum Bonded Copper
Aluminum Bonded Copper or "ABC" represents a quality alternative to copper/aluminum lamination separator plates. Continuous process ultrasonic welding performed in a clean room environment is the basis surrounding ABC's product technology. Critical metal surfaces are cleaned then bonded without the use of an adhesive which could interfere with the subsequent outer layer processing of the multilayer. In short, use of ABC instead of the conventional component lay-up / wiping technique ensures... (read more)
Browse Copper, Brass, and Bronze Alloys Datasheets for Oak-Mitsui, Inc.
H.C. Starck Inc. - Fabricated Products Group
Molybdenum Glass Melting Electrodes
processes that provide molybdenum and other refractory metals with outstanding protection against oxidation at high temperatures. These ceramic coatings are integral with and chemically bonded to the metal surface and they cannot separate or spall. Being produced via a chemical vapor deposition, the coatings can be applied uniformly to all surfaces including the inside of thin tubes. . GMEs Manufactured from Powder Metallurgical Processing. Structure. Glass melting electrodes will normally... (read more)
Browse Molybdenum and Molybdenum Alloys Datasheets for H.C. Starck Inc. - Fabricated Products Group
Conduct Research Top
Designing Custom Cold Plates
protection. Several patterns for different ranges of required impedance, pressure drop, and flow have been developed. (See Figure 5.). Inner-Finned Brazed Cold Plates - Inner-finned brazed cold plates consist of two plates metallurgically bonded together with internal fin. They can be vacuum-brazed
Low-Melting Metallic Sputtering Targets Bonded At Room Temperature (Ambient)
to a backing plate with Nano-. Foil® that is pre-coated with solder. Nanobond® Technology. Figure 1. Indium target bonded to a copper backing plate with NanoFoil® material. The process of bonding with NanoFoil®. is a mature technology that has been. solder layer. The heat released is not. used
Actively cooled cold plates utilize copper or aluminum tubes. They are typically bonded into aluminum plates to reduce weight and optimize thermal conductivity thus minimizing hot spots on the electronics that may be mounted onto the plates. Alternatively, cold plates may have machined passages
Cold Plate Manufacturing Cost Drivers
of two plates metallurgically bonded together with internal fin. They are available in all sizes and offer extremely high performance, making them ideal for applications where heat loads are concentrated. With both tubed and vacuum-brazed cold plate technologies, the labor time is limited. Therefore
Aircraft Liquid Cooling
tube, and performance-fin. Vacuum-brazed performance-fin is the cold plate technology most often found on aircraft. (See Figure 3.) Performance-fin cold plates consist of two plates metallurgically bonded together with internal fin, the most common of which are vacuum-brazed. With aluminum
Medical Device Link .
and investment casting. The economical process has been used, for example, to mold laparoscopic surgical devices from 17-4PH stainless steel. The company offers design assistance that includes extensive finite element analysis, as well as prototyping and production services. Bonded tubing produced by means
An Introduction to ASTM B898, The Reactive and Refractory Metal Clad Specification (.pdf)
applies to clad plates consisting of titanium, zirconium, tantalum, niobium, and. their alloys integrally bonded to a base metal plate of steel or any other metal. The cladding may be. performed by any technology, which produces a compliant product. Cladding methods may be, but are. not limited
Air Cooled Heat Pipe Assembly (.pdf)
the available envelope. • Folded Fins – Extended surface in the form of folded fins remove heat directly. from the base mounting plate. These fins are also made of copper and. metallurgical bonded to the heat spreader. Based on their height, thickness and. conductivity these fins approach 100% efficiency
More Information on: Copper Bonded Plate Top
Cooling Microstructure for Automotive Electronic Module
The semiconductor structure is soldered to DCB (Direct Copper Bonding ) plate .
Cryogenic Conduction Cooling Test of Removable Panel Mock-Up for ITER Cryostat Thermal Shield
Then the bonded copper plate is partially removed by machining to obtain a copper bridge pattern as shown in Fig. 2.
Travel to Battelle Memorial Institute. Trip report, September 17, 24, and October 8, 1953
3ecent success with s o l d e r bonding copper plated aluminum and--.
Experimental Investigation of Texture Gradients in Aluminium/Copper Plates Bonded through Explosive Welding Process
• Experimental Investigation of Texture Gradients in Aluminium/ Copper Plates Bonded through Explosive Welding Process, p.603 .
carbonate outside walls, with 2 copper plates bonded to their outside .
Ultra-high density, thin core and low loss organic system-on-package (SOP) substrate technology for mobile applications
Plated Copper Bonding Strength .
Modelling of jet-impingement cooling for power electronics
Total 6 IGBTs have been placed on the direct bonded copper plate .
Design and Use of a Laser Interferometer for Ultrasonic Bonding Studies
Figure 8 illustrates the procedure used. :Agold wire (150 micrometers in diameter) is placed on a gold- plated copper bonding pad.