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Supplier: Indium Corporation
Description: The flip-chip process involves taking the singulated die from a wafer mounted on a wafer dicing tape, inverting ("flipping") them and placing them onto a substrate. The substrate may be a printed circuit board, a ceramic substrate, or (in the case of 2.5D and 3D assembly) an interposer.
- Fluxes & Cleaners: Soldering Flux / Rosin
Standards and Technical Documents - PERFORMANCE STANDARD FOR FLIP CHIP/CHIP SCALE BUMPS -- J-STD-028
Description: This standard establishes the construction detail requirements for bumps and other terminal structures on flip chips and chip scale carriers. All flip chip and chip scale device terminals shall meet the designated standards detailed in this document which includes such diverse terminations
Supplier: Skyworks Solutions, Inc.
Description: This series of Skyworks GaAs Schottky barrier flip chip diodes produces excellent high frequency performance up to millimeter wave range in a mechanically robust, small form factor. The series is comprised of a single junction device, DMK2790-000, and an antiparallel pair, DMK2308-000
- Diode Type: Schottky Barrier Diodes
- VF: 0.6500 to 0.7500 volts
Description: The TriQuint TGA4705-FC is a flip-chip low noise amplifier (LNA) designed to operate at frequencies that target the automotive radar market. The TGA4705-FC is designed using TriQuint's proven 0.13 µm pHEMT process and front-side Cu / Sn pillar technology for reduced source inductance
- Device Type: Other
Description: LOW CAPACITANCE DIODE, -000, Flip Chip Diode Type:Low Capacitance Power Dissipation Pd:60W Diode Case Style:Flip Chip No. of Pins:4
Standards and Technical Documents - Implementation of flip chip and chip scale technology -- IEC PAS 62084:1998
Description: Describes the implementation of flip chip and related chip scale semiconductor packaging technologies. The areas discussed include: design considerations, assembly processes, technology choices, application, and reliability data. Chip scale packaging variations include: flip chip, High Density
Supplier: Ohmite Manufacturing Co.
Description: High Voltage Film Flip Chip Power rating up to 1 watt Resistance up to 100 Gig 1% Tolerance standard High Voltage handling up to 3000 volts industry standard sizes 1206 and 2512 RoHS Compliant
- Configuration: Single Resistor
- Category / Application: High-Voltage Resistor
- Mounting / Packaging: Surface Mount (SMT / SMD)
- Resistance Range: 1000 to 1.00E11 ohms
Electronic Development Boards - STMICROELECTRONICS - STEVAL-CCA001V1 - TS4962MEIJT flip chip version based mono class audio amplifier d -- 628482
Description: TS4962MEIJT flip chip version based mono class audio amplifier design Silicon Manufacturer:ST Micro Silicon Core Number:TS4962MEIJT Kit Application Type:Amplifier Application Sub Type:Audio Power Amplifier Kit Contents:Board RoHS Compliant: Yes
- Supported System: Other
- Manufacturer: Other
Supplier: Radwell International, Inc.
Description: Are you looking for the best website to buy HARRIS SEMI CD4015BE? Then you have found exactly the industrial MRO outlet you need right here! At PLCCenter.com our #1 goal is the satisfaction of our customers - we strive to develop market-leading products and services that are offered to you at an
- Propagation Delay: 45 ns
- IC Package Type: DIP
- Pin Count: 14
Supplier: IHS Product Design
Description: IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY
Supervisory Circuits and Battery Monitor Chips - High-Precision Li+ Battery Monitor with Alerts -- DS2762Supplier: Maxim Integrated Products, Inc.
Description: + protection into the small footprint of either a TSSOP package or flip-chip package. The DS2762 is a key component in applications including remaining capacity estimation, safety monitoring, and battery-specific data storage.
- Package Type: TSSOP, Other
- Pin Count: 12 to 16
- Supply Voltage (Vi): 2.5 to 5.5 volts
- Operating Temperature: -40 to 185 F
Light Emitting Diodes (LED) - Subminiature High Performance TS AlGaAs Red LED Lamps -- HLMP-Q106-R0011Supplier: Avago Technologies
Description: AlGaAs). This LED technology has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents (500 mA to 50 mA). The color is deep red at a dominant wavelength of 644 nm deep red. TS AlGaAs is a flip-chip LED technology, die attached to the anode lead
- Color: Red
- Peak Wavelength: 654 nm
- Forward Voltage: 1.9 volts
- Forward Current: 0.0300 amps
Description: TVS DIODE ARRAY, 50W 14.2V FLIPCHIP Reverse Stand-Off Voltage Vrwm:12V Breakdown Voltage Range:14.2V to 18V Diode Configuration:Bidirectional Peak Pulse Current Ippm:3A Diode Case Style:Flip Chip No. of Pins:5 RoHS Compliant: Yes
- Diode Type: Transient Voltage Suppressor Diodes (TVS)
- RoHS Compliant: Yes
Supplier: Epoxy Technology
Description: A single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. It can be used as an underfill for flip chip mounted ICs, BGAs, and sensor device packaging. Also available in a frozen syringe.
- Substrate / Material Compatibility: Metal, Plastic
- Industry: Electronics, Semiconductors / IC Packaging
- Chemical / Polymer System Type: Epoxy (EP)
- Filled / Reinforced: Yes
Supplier: Photonic Science
Description: PSL delivers X-ray digital radiographic systems that detect porosity, inclusions, cracks and grain structure down to micrometer range at up to 60 keV. Ball Grid Arrays (BGA), Micro-Electro-Mechanical Systems (MEMS) and flip-chip devices, are imaged with up to x10 magnification in order to isolate
Supplier: ASTM International
Description: Fatigue Behavior of Solders Used in Flip-Chip Technology Volume 1, Issue 2 (March 1973) This paper surveys the mechanical fatigue behavior of 5/95 Sn/Pb solder and solder with copper, silver and palladium impurities at different temperatures and on-off cycling frequencies. Presence of copper
Supplier: Cymbet Corporation
Description: The EnerChip is the world’s first solid state thin film battery created on a silicon substrate. The CBC050-BDC can be placed directly on a PCB or inside a packaged part with other integrated circuits. It can be attached using standard wire bonds or solder bumps for flip chip assembly. During
- Voltage: 3.8 volts
- Operating Temperature: -4 to 158 F
- Standard Battery Sizes: Other
- Specialty Cells: Thin Film
Supplier: Atmel Corporation
Description: This application note describes how to perform the firmware upgrade of the megaAVR with USB products using the on-chip bootloader and FLIP software.
Supplier: Maxim Integrated Products, Inc.
Description: bus. Access to an individual device is achieved by using a device address that is determined by the logic levels of address pins A0 though A2. Additionally, the DS1845 will operate from 3 volt or 5 volt supplies. Three package options are available: Flip Chip Package, 16-ball CSBGA and 14-pin TSSOP.
- Wiper Memory: Non-Volatile
- Standard and Compliances: RoHS Compliant
Supplier: IntelLiDrives, Inc.
Description: : - acceleration 10G - stroking frequency above 10 Hz - force control from grams to kilograms - soft touch with programmable push/pull force Applications - die eject and bond head (die bond and flip chip - stroking frequency above 10 Hz - IC placement and testing - high speed assembly and insertion
- Device Type: Rod Type
- Actuation Type: Electrical
- Stroke or X-Axis Travel: 0.9843 inch
- Motor Specifications: DC Brushless Servo
Electronic Design Automation (EDA) and Electronic Computer-aided Design Software (ECAD) - FloTHERM® PACK Automated Simulation Based IC PackageSupplier: Mentor Graphics Corporation
Description: manner Network Assembly support FloTHERM PACK now supports two-resistor and Delphi compact thermal models in the more advanced Network Assembly format in FLOTHERM Enhanced package families TO247 package is now supported, as are Delphi compact thermal models for SOT23 package. Flip-chip PBGA now
Supplier: Epoxy Technology
Description: . Adhesive for V-groove, fiber arrays or lens arrays. Bonding optical fibers into ferrules. Fibers of glass or plastic. Ferrules of glass, quartz, stainless steel, kovar, or ceramic. o Semiconductor: Recommended for underfilling of flip chips or SMDs on PCB; can also be used
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy
- Compound Type: Liquid
- Features: Optical Grade
Semiconductor Wet Process Equipment - High Performance, Stainless Steel Constructed In-line Cleaning System -- OmniJet/CBW 224®Supplier: Stoelting Cleaning Equipment
Description: cross-contaminants and minimizing carryover into wash. Wash and rinse stages deliver 120 psi of spray pressure, capable of cleaning the toughest PCBA, SMT, BGA, flip chip products. All stainless steel piping for top performance and reliability. Swivel nozzles for pinpoint accuracy and 1/4-turn quick release
Supplier: OSI Optoelectronics
Description: FCI-InGaAs-300B1XX series are multifunctional backside illuminated photodiode/arrays. They come standard in a single element diode or 4 - or 8- elements array with active area of 300µm. These back illuminated InGaAs photodiode/arrays are designed to be flip chip mounted (active area facing up
- PN, PIN, or Avalanche: PIN Photodiode
- Spectral Response: IR
- Array: Yes
- Sensitivity: 0.8500 A/W
Supplier: Perfect Parts Corporation
Description: 729 SERIES, POSITIVE EDGE TRIGGERED T FLIP-FLOP, COMPLEMENTARY OUTPUT, CQCC16
- Triggering: Positive-edge Triggered
- Output Characteristics: Complementary Output
- Operating Temperature: -40 to 185 F
- IC Package Type: Other
Supplier: Digi-Key Corporation
Description: IC D-TYPE NEG TRG SNGL 16QFN
- Type: D
- Triggering: Negative-edge Triggered
- Output Characteristics: Other
- Supply Voltage: Other
Supplier: American Microsemiconductor, Inc.
Description: D Flip/Flop Outputs
- Propagation Delay: 1.1 ns
- Operating Temperature: 32 to 185 F
- Supply Voltage: -4.5 V
- IC Package Type: QFP
Supplier: Semtech Corp.
Description: Protects 2 bidirectional or 3 unidirectional data or I/O lines.
- Device Type: ESD Suppressor, Other
- Configuration: Single Device
- Mounting / Packaging: Flip Chip
- Tj: -67 to 257 F
Educational and Training Software - Implementation of Flip Chip & Chip Scale Technology -- J-STD-012
Description: This informative document describes the implementation of flip chip and related chip scale semiconductor packaging technologies. The areas discussed include design considerations, assembly processes, technology choices, application and reliability data.
Standards and Technical Documents - Implementation of Flip Chip & Chip Scale Technology -- J-STD-012
Description: DESCRIPTION This informative document describes the implementation of flip chip and related chip scale semiconductor packaging technologies. The areas discussed include design considerations, assembly processes, technology choices, application and reliability data. Chip packaging variations include
Supplier: Allied Electronics, Inc.
Description: RESISTOR; HV FLIP CHIP FILM, 5M OHM, +/-1% TOL, 1500V, 1206
- Category / Application: General Use
- Technology / Construction: Other
- Mounting / Packaging: Surface Mount (SMT / SMD), 1206
- Resistance Range: 4.00E6 ohms
Supplier: Mettrix Technology Corporation
Description: coating Printed circuit board rework and repair Our surface mount (SMT) parts capabilities allow us to pick and place the full range of parts presently available, from 0201 two-terminal devices to full-size fine pitch devices including flip chips and micro BGAs.
- Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services, Other
- Testing Services: Functional Testing
- Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, Optoelectronic Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
- Production Capabilities: Prototype / Low Volume, Mid Volume, Quick Turn, Cabling
Description: Detailed Features System x3500 M3 servers are high-throughput, two-way, SMP-capable network servers with excellent performance scalability when you add memory and a second processor. They incorporate powerful Intel Xeon processors, model dependent. These flip-chips, land grid array 6 (FC-LGA6
- Form Factor: Tower
Supplier: RS Components, Ltd.
Description: Amplifier Type:Class-AB; Function:Speaker; Power Supply Type:Single; Input Signal Type:Differential; Output Signal Type:Differential; Output Type:1-Channel Mono; Typical Gain Bandwidth Product:2MHz; Minimum CMRR:90dB; Typical Single Supply Voltage:3, 5V; Supplier Package:Flip-Chip
- Type: Amplifier
- Amplifier Class: Class AB
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Featured Products Top
Advanced Interconnections Corp.
Flip-Top BGA Sockets Ease Device Test
The compact Flip-Top ™ Test Socket design matches your device footprint and uses less PC board space than typical test sockets because it requires no external screws, backing plates, or mounting holes in the PCB. The hinged clamp, with integral heat sink, makes insertion and removal of devices quick and easy while ensuring a reliable connection. A chip support plate, customized to your specific IC package, allows for inconsistencies in package coplanarity, thickness, or tolerance issues... (read more)
Browse IC Sockets and Headers Datasheets for Advanced Interconnections Corp.
Halogen-Free Water-Soluble Dipping Flux
Indium Corporation will introduce Flip-Chip Flux WS-688 at Semicon West, July 10-12, 2012, in San Francisco, California, USA. Flip-Chip Flux WS-688 is a halogen-free water-soluble dipping flux suitable for use with both eutectic, tin, and tin-silver solder bumps and copper-pillar microbumps. It is designed to be useful in high temperature application environments, such as thermocompression bonding. Flip-Chip Flux WS-688 reduces or eliminates voids, even in applications where damage... (read more)
Browse Fluxes Datasheets for Indium Corporation
Advanced Technical Ceramics Company
High Density (HD) Alumina for RF Applications
AdTech has designed a product line that combines thin film substrate qualities with multilayer HTCC structure, which allows the combination of high density thin film technology with the practicality of multilayer co-fire alumina. Demonstrated programs have included flip chip, copper metallization and cavities. (read more)
Browse IC Interconnect Components Datasheets for Advanced Technical Ceramics Company
EPO-TEK® PCB Applications Guide
Epoxy Technology announces its latest offering for epoxy adhesive selection, our PCB Applications Guide. This interactive tool allows users to select applications within a PCB in order to view each corresponding product recommendation. Each sheet provides mechanical and physical properties for each product to help in selecting the most appropriate epoxy. Applications include: Advanced IC Packaging, Ferrite Cores & Magnets, Flex PCB, Flip Chip, Glob Top, Glob Top Dam-N-Fill, LED, Photonic... (read more)
Browse Epoxy Adhesives Datasheets for Epoxy Technology
Advanced Technical Ceramics Company
High Density HTCC Alumina for Thin Film
AdTech Ceramics has developed a High Density Alumina Straight-Through Vias for Thin Film Applications. This product line combines thin film substrate qualities (5 micro inch or better surface finish) with multilayer HTCC structure and straight through hermetic vias, with the practicality of multilayer co-fire alumina. Demonstrated programs have included flip chip, copper metallization, and cavities. (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for Advanced Technical Ceramics Company
Insight Analytical Labs, Inc.
PCB Electronic Failure Analysis
further, it is now very common to have Chip-on-Board (COB), the direct mounting and wiring of an integrated circuit on the PCB. Flip chips and Ball Grid Array packages may be on the PCB as well. These technologies, while providing a very dense board layout, also pose new challenges to the board manufacturer: tighter tolerances, more fragile die, underfill, and solder contacts that are not visible to the naked eye. To address these concerns, IAL has assembled equipment to identify the specific... (read more)
Browse Electrical and EMC Testing Services Datasheets for Insight Analytical Labs, Inc.
Mouser Electronics, Inc.
Philips Lumileds LUXEON Q White LEDs
Philips Lumileds LUXEON Q White LEDs deliver superior performance in a high-power emitter that serves as a direct drop-in replacement for products that use the standard 3535 surface mount package. LUXEON Q is the first high-power LED based on LUXEON Flip Chip die, Philips Lumileds high performance Chip Scale Package (CSP) device architecture. LUXEON Q takes advantage of a fully developed ecosystem for 3535 components, including optics, to speed the time-to-market for indoor and outdoor... (read more)
Browse Light Emitting Diodes (LED) Datasheets for Mouser Electronics, Inc.
Insight Analytical Labs, Inc.
CSAM & Electronic Failure Analysis
. Electronic ceramic package evaluation. Chip capacitor and resistor evaluation. Die attach evaluation. Molding compound evaluation. Package crack detection. Flip chip bond evaluation. Printed circuit metal trace evaluation... (read more)
Browse Nondestructive Testing (NDT) Services Datasheets for Insight Analytical Labs, Inc.
Infineon Technologies AG
Dual-Sensor Package Devices for Safety
with a patented flip-chip technique. This saves precious space and cost in safety critical applications, such as electric power steering (EPS), throttle control, pedal position and brushless DC motor control in such areas as EPS motors, transmission and clutch actuators. The dual-sensor package integrates two linear Hall sensors or two angle sensors. Both sensors have separate power supply and separate signal outputs. They are electrically independent due to galvanic isolation. This means that the two... (read more)
Browse Sensor Chips Datasheets for Infineon Technologies AG
EPO-TEK® Underfills Guide
What Are Underfills?. Underfills are used to fill space beneath a die and adhere to its carrier. They add structural. strength, increase impact resistance, bolster thermal cycling resistance and improve overall reliability. Underfills can be found in a wide variety of applications including flip-chip, fine pitch BGA, and chip scale packages. How Can Underfills Be Used?. Underfills are used most often in three distinct applications: • Capillary Underfills. • Non-Flow Thermally... (read more)
Browse Epoxy Adhesives Datasheets for Epoxy Technology
Parts by Number Top
|Part #||Distributor||Manufacturer||Product Category||Description|
|1020FLIP CHIP||ASAP Semiconductor||ALTERA||Not Provided||BGA|
|1020 FLIP CHIP||ASAP Semiconductor||ALTERA||Not Provided||Not Provided|
|30-OHM-FLIP-CHIP||National Microchip||Not Provided||Not Provided||Not Provided|
|30-OHM-FLIP-CHIP||National Microchip||TRX||Not Provided||Not Provided|
|30-OHM-FLIP-CHIP||ASAP Semiconductor||TRY||Not Provided||Not Provided|
Conduct Research Top
Flip Chip Bonder (Embedded)
Embedding an Industrial PC with image processing board into a Flip Chip Bonder.
Study of RF Flip-Chip Assembly with Underfill Epoxy (.pdf)
Flip-chip assembly technology is becoming more and more important to radio frequency (RF) MCM with the following advantages: automated assembly, compact size, low cost, low cross talk, and low insertion loss. However, flip-chip assembly also demands carful evaluation of solder joint reliability.
Advanced Thermal Interface Materials for Enhanced Flip Chip BGA
Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient
Simulation and Measurement of High Speed Serial Link Performance in a Dense, Thin Core Flip Chip Package
, like Hyper Transport, Infiniband, PCI Express, RapidIO and SATA, are driving new speed and density specifications for differential signals. This paper will show how to meet these product requirements with a thin core, flip chip, organic package which uses a standard, reasonable-cost, reliable FR-4
Thermal Enhancement of Systems using Organic Flip-Chip Packages (FC-PBGA) with an Alternate Cooling Path through the Printed Wiring Board
The thermal performance characteristics of organic flip-chip packages (FC-PBGA) incorporating thin (0.5mm), high interconnect density (dense-core) organic substrates has been studied using 1-D calculations and 3-D numerical analysis. Of particular interest is the ability of the substrate to provide
The Drive to Miniaturize - 0201 Flip Chip Silicon Schottky Diodes
The incessant drive to. miniaturize electronic. systems places pressure. on semiconductor manufacturers. to offer ever-smaller components. This trend is rapidly. approaching its logical conclusion,. which is the elimination. of the semiconductor's package. altogether in favor of a die. which can be
Medical Device Link .
Flip-Chip Processes Affect Size, Cost, and Reliability by Albert P. Kretz and Donald Styblo Flip-chip processes allow miniaturization of electronic circuitry by utilizing integrated circuit (IC) chips without the conventional plastic packaging that adds a great deal of bulk. Combined with tiny
Integrated cooling system lets chips beat the heat
. In contrast, Georgia Tech's CMOS-compatible technique works at temperatures <260 C and builds microfluidiccooling channels without damaging attached circuits. The scheme works on gigascale integrated (GSI) chips and is fully compatible with conventional flip-chip packaging. Researchers begin by etching
More Information Top
Advanced Flip Chip Packaging
Advanced Flip Chip Packaging .
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Reliability Data for BGA, Flip Chip BGA, and CSP .
Integrated Circuit Packaging, Assembly and Interconnections
7.1 — The COB Process..................................................................................94 7.2 — Flip Chip On Board (FCOB).................................................................98 7.3 — Summary.............................................................................................101 .
Solder Joint Technology
C-4 Flip Chip Technology .......................................
Materials for Advanced Packaging
Latest advances in several key packaging materials including lead-free solders, flip chip underfills, epoxy molding compounds, conductive adhesives, die attach adhesives/films, and Thermal Interface Materials (TIMs) are reviewed in great detail in Chapters 5, 9, 10, 11, 12, and 13, respectively.
Lead-free Solders: Materials Reliability for Electronics
Huang, Zhiheng, Conway, P.P., Liu, Changqing and Thomson, R.C. (2004) The effect of microstructural and geometrical features on the reliability of ultrafine flip chip microsolder joints.
Electrical Conductive Adhesives with Nanotechnologies
Currently, two types of first-level intercon- nection dominate the industry: (1) wire bonding and (2) flip chip attachment.
A Novel Three Dimensional Wafer Level Chip Scale Packaging Technology-Manufacturing Process Development and Reliability Characterizations
Key Words: 3D Packaging, Die to Wafer Integration, Silicon on Silicon, Pb-free Reflow, Capillary Underfill, No Flow Underfill, Fine Pitch Flip Chip Assembly .