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Parts by Number for Flip Chip Top

Part # Distributor Manufacturer Product Category Description
1020FLIP CHIP ASAP Semiconductor ALTERA Not Provided BGA
1020 FLIP CHIP ASAP Semiconductor ALTERA Not Provided Not Provided
30-OHM-FLIP-CHIP National Microchip Not Provided Not Provided Not Provided
30-OHM-FLIP-CHIP National Microchip TRX Not Provided Not Provided
30-OHM-FLIP-CHIP ASAP Semiconductor TRY Not Provided Not Provided
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Conduct Research Top

  • Flip Chip Bonder (Embedded)
    Embedding an Industrial PC with image processing board into a Flip Chip Bonder. CONTEC A Focus on Quality. A Commitment to Our Environment. Global | - Region - Japan China. Change Home Sitemap. Search. Products. Industrial Computers. Board Computers. Data Acquisition & Control. DAQ
  • Study of RF Flip-Chip Assembly with Underfill Epoxy (.pdf)
    Flip-chip assembly technology is becoming more and more important to radio frequency (RF) MCM with the following advantages: automated assembly, compact size, low cost, low cross talk, and low insertion loss. However, flip-chip assembly also demands carful evaluation of solder joint reliability.
  • Advanced Thermal Interface Materials for Enhanced Flip Chip BGA
    Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient
  • The Drive to Miniaturize - 0201 Flip Chip Silicon Schottky Diodes
    be directly mounted. to a printed circuit board. (PCB) with automated assembly. equipment. ./29eef687-4138-4c76-8128-1360d774fcce PAGE 1 • NOVEMBER 2009. FEATURE ARTICLE. www.MPdiGEst.cOM. The Drive to Miniaturize - 0201 Flip Chip Silicon Schottky. Diodes. by Rick Cory, Skyworks Solutions, Inc
  • Simulation and Measurement of High Speed Serial Link Performance in a Dense, Thin Core Flip Chip Package
    , like Hyper Transport, Infiniband, PCI Express, RapidIO and SATA, are driving new speed and density specifications for differential signals. This paper will show how to meet these product requirements with a thin core, flip chip, organic package which uses a standard, reasonable-cost, reliable FR-4
  • Thermal Enhancement of Systems using Organic Flip-Chip Packages (FC-PBGA) with an Alternate Cooling Path through the Printed Wiring Board
    The thermal performance characteristics of organic flip-chip packages (FC-PBGA) incorporating thin (0.5mm), high interconnect density (dense-core) organic substrates has been studied using 1-D calculations and 3-D numerical analysis. Of particular interest is the ability of the substrate to provide
  • Medical Device Link .
    Flip-Chip Processes Affect Size, Cost, and Reliability by Albert P. Kretz and Donald Styblo Flip-chip processes allow miniaturization of electronic circuitry by utilizing integrated circuit (IC) chips without the conventional plastic packaging that adds a great deal of bulk. Combined with tiny
  • Medical Device Link .
    types. Although flip chips can sometimes be difficult to work with, when they are properly designed and executed, they are very reliable. A flip chip package design eliminates the problems associated with solder balls being missing, bridged, cracked, or voided. In addition, the underfill material fills

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