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Supplier: Indium Corporation
Description: The flip-chip process involves taking the singulated die from a wafer mounted on a wafer dicing tape, inverting ("flipping") them and placing them onto a substrate. The substrate may be a printed circuit board, a ceramic substrate, or (in the case of 2.5D and 3D assembly) an interposer.
- Fluxes & Cleaners: Soldering Flux / Rosin
Standards and Technical Documents - PERFORMANCE STANDARD FOR FLIP CHIP/CHIP SCALE BUMPS -- J-STD-028
Description: This standard establishes the construction detail requirements for bumps and other terminal structures on flip chips and chip scale carriers. All flip chip and chip scale device terminals shall meet the designated standards detailed in this document which includes such diverse terminations
Description: LOW CAPACITANCE DIODE, -000, Flip Chip; Diode Type:Low Capacitance; Power Dissipation Pd:60W; Diode Case Style:Flip Chip; No. of Pins:4
- Device Type: ESD Suppressor
- Mounting / Packaging: Flip Chip
Supplier: Skyworks Solutions, Inc.
Description: This series of Skyworks GaAs Schottky barrier flip chip diodes produces excellent high frequency performance up to millimeter wave range in a mechanically robust, small form factor. The series is comprised of a single junction device, DMK2790-000, and an antiparallel pair, DMK2308-000
- Diode Type: Schottky Barrier Diodes
- VF: 0.6500 to 0.7500 volts
Description: The TriQuint TGA4705-FC is a flip-chip low noise amplifier (LNA) designed to operate at frequencies that target the automotive radar market. The TGA4705-FC is designed using TriQuint's proven 0.13 µm pHEMT process and front-side Cu / Sn pillar technology for reduced source inductance
- Device Type: Other
Supplier: 1-Source Electronic Components
Description: LOW CAPACITANCE DIODE, -000, Flip Chip Diode Type:Low Capacitance Power Dissipation Pd:60W Diode Case Style:Flip Chip No. of Pins:4
Electronic Development Boards - flip chip version based mono class audio amplifier design -- 45P5427
Description: TS4962MEIJT flip chip version based mono class audio amplifier design; Silicon Manufacturer:ST Micro; Silicon Core Number:TS4962MEIJT; Kit Application Type:Amplifier; Application Sub Type:Audio Power Amplifier; Kit Contents:Board
- Category: Development Suite / Kit
- Manufacturer: Other
Supplier: Ohmite Manufacturing Co.
Description: High Voltage Film Flip Chip Power rating up to 1 watt Resistance up to 100 Gig 1% Tolerance standard High Voltage handling up to 3000 volts industry standard sizes 1206 and 2512 RoHS Compliant
- Configuration: Single Resistor
- Category / Application: High-Voltage Resistor
- Mounting / Packaging: Surface Mount (SMT / SMD)
- Resistance Range: 1000 to 1.00E11 ohms
Electronic Development Boards - STMICROELECTRONICS - STEVAL-CCA001V1 - TS4962MEIJT flip chip version based mono class audio amplifier d -- 628482Supplier: 1-Source Electronic Components
Description: TS4962MEIJT flip chip version based mono class audio amplifier design Silicon Manufacturer:ST Micro Silicon Core Number:TS4962MEIJT Kit Application Type:Amplifier Application Sub Type:Audio Power Amplifier Kit Contents:Board RoHS Compliant: Yes
Description: Temperature Sensor IC; IC Function:Temperature Sensor IC; Package / Case:Flip Chip
- Sensor Type: Temperature Sensor
Supplier: IHS Product Design
Description: IMPLEMENTATION OF FLIP CHIP AND CHIP SCALE TECHNOLOGY
Description: Diode; No. of Lines Protected Max:1; Operating Temperature Max:150°C; Operating Temperature Min:-55°C; Package / Case:Flip Chip 1005; Peak Surge Current:10A
- RoHS Compliant: Yes
Description: Driver IC; No. of Driver/Receivers:1; Output Current:350mA; Package / Case:Flip Chip; Program Memory Type:Linear Current Sensing IC Half-Bridge Driver; Voltage Rating:80V
- Device Type / Applications: Other
Light Emitting Diodes (LED) - Subminiature High Performance TS AlGaAs Red LED Lamps -- HLMP-Q106-R0011Supplier: Avago Technologies
Description: AlGaAs). This LED technology has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents (500 mA to 50 mA). The color is deep red at a dominant wavelength of 644 nm deep red. TS AlGaAs is a flip-chip LED technology, die attached to the anode lead
- Color: Red
- Peak Wavelength: 654 nm
- Forward Voltage: 1.9 volts
- Forward Current: 0.0300 amps
Description: Platinum RTD Temperature Sensor; Accuracy:+/- 2.0 % ( -200 C to +540 C ) % RH; Mounting Type:Through Hole; Operating Temperature Range:0°C to +25°C; Package / Case:SMT Axial Flip Chip; Supply Voltage Max:9V; Supply Voltage Min:4V
- Wire Wound Types: Platinum
Supplier: Photonic Science
Description: PSL delivers X-ray digital radiographic systems that detect porosity, inclusions, cracks and grain structure down to micrometer range at up to 60 keV. Ball Grid Arrays (BGA), Micro-Electro-Mechanical Systems (MEMS) and flip-chip devices, are imaged with up to x10 magnification in order to isolate
Supplier: ASTM International
Description: Fatigue Behavior of Solders Used in Flip-Chip Technology Volume 1, Issue 2 (March 1973) This paper surveys the mechanical fatigue behavior of 5/95 Sn/Pb solder and solder with copper, silver and palladium impurities at different temperatures and on-off cycling frequencies. Presence of copper
Supplier: Cymbet Corporation
Description: The EnerChip is the world’s first solid state thin film battery created on a silicon substrate. The CBC050-BDC can be placed directly on a PCB or inside a packaged part with other integrated circuits. It can be attached using standard wire bonds or solder bumps for flip chip assembly. During
- Voltage: 3.8 volts
- Operating Temperature: -4 to 158 F
- Standard Battery Sizes: Other
- Specialty Cells: Thin Film
Supplier: Applied Diamond, Inc.
Description: module packages Flip chip Diamond also has a low density for lighter weight applications of aircraft and space craft electronic systems, notebook computers and other mobile devices. Thermal Conductivity CVD Diamond has exceptional thermal conductivity and diffusivity. Applied Diamond offers thermal
Supplier: Atmel Corporation
Description: This application note describes how to perform the firmware upgrade of the megaAVR with USB products using the on-chip bootloader and FLIP software.
Supplier: IntelLiDrives, Inc.
Description: : - acceleration 10G - stroking frequency above 10 Hz - force control from grams to kilograms - soft touch with programmable push/pull force Applications - die eject and bond head (die bond and flip chip - stroking frequency above 10 Hz - IC placement and testing - high speed assembly and insertion
- Device Type: Rod Type
- Actuation Type: Electrical
- Stroke or X-Axis Travel: 0.9843 inch
- Motor Specifications: DC Brushless Servo
Electronic Design Automation (EDA) and Electronic Computer-aided Design Software (ECAD) - FloTHERM® PACK Automated Simulation Based IC PackageSupplier: Mentor Graphics Corporation
Description: manner Network Assembly support FloTHERM PACK now supports two-resistor and Delphi compact thermal models in the more advanced Network Assembly format in FLOTHERM Enhanced package families TO247 package is now supported, as are Delphi compact thermal models for SOT23 package. Flip-chip PBGA now
Supplier: Epoxy Technology
Description: . Adhesive for V-groove, fiber arrays or lens arrays. Bonding optical fibers into ferrules. Fibers of glass or plastic. Ferrules of glass, quartz, stainless steel, kovar, or ceramic. o Semiconductor: Recommended for underfilling of flip chips or SMDs on PCB; can also be used
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy
- Compound Type: Liquid
- Features: Optical Grade
Semiconductor Wet Process Equipment - High Performance, Stainless Steel Constructed In-line Cleaning System -- OmniJet/CBW 224®Supplier: Stoelting Cleaning Equipment
Description: cross-contaminants and minimizing carryover into wash. Wash and rinse stages deliver 120 psi of spray pressure, capable of cleaning the toughest PCBA, SMT, BGA, flip chip products. All stainless steel piping for top performance and reliability. Swivel nozzles for pinpoint accuracy and 1/4-turn quick release
Supplier: Epoxy Technology
Description: EPO-TEK® H20E-PFC is a two component, semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method.
- Substrate / Material Compatibility: Metal, Plastic
- Industry: Aerospace, Electronics, Semiconductors / IC Packaging
- Chemical / Polymer System Type: Epoxy (EP)
- Filled / Reinforced: Yes
Supplier: OSI Optoelectronics
Description: FCI-InGaAs-300B1XX series are multifunctional backside illuminated photodiode/arrays. They come standard in a single element diode or 4 - or 8- elements array with active area of 300µm. These back illuminated InGaAs photodiode/arrays are designed to be flip chip mounted (active area facing up
- PN, PIN, or Avalanche: PIN Photodiode
- Spectral Response: IR
- Array: Yes
- Sensitivity: 0.8500 A/W
Supplier: Perfect Parts Corporation
Description: 729 SERIES, POSITIVE EDGE TRIGGERED T FLIP-FLOP, COMPLEMENTARY OUTPUT, CQCC16
- Triggering: Positive-edge Triggered
- Output Characteristics: Complementary Output
- Operating Temperature: -40 to 185 F
- IC Package Type: Other
Supplier: Digi-Key Corporation
Description: IC D-TYPE NEG TRG SNGL 16QFN
- Type: D
- Triggering: Negative-edge Triggered
- Output Characteristics: Other
- Supply Voltage: Other
Supplier: American Microsemiconductor, Inc.
Description: D Flip/Flop Outputs
- Propagation Delay: 1.1 ns
- Operating Temperature: 32 to 185 F
- Supply Voltage: -4.5 V
- IC Package Type: QFP
Supplier: Semtech Corp.
Description: Protects 2 bidirectional or 3 unidirectional data or I/O lines.
- Device Type: ESD Suppressor, Other
- Configuration: Single Device
- Mounting / Packaging: Flip Chip
- Tj: -67 to 257 F
Supplier: Mettrix Technology Corporation
Description: coating Printed circuit board rework and repair Our surface mount (SMT) parts capabilities allow us to pick and place the full range of parts presently available, from 0201 two-terminal devices to full-size fine pitch devices including flip chips and micro BGAs.
- Design Services: Conceptual Product Development, Mechanical Design Services, Electrical Design Services, Other
- Testing Services: Functional Testing
- Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Microelectronic, Flip Chip, Microelectronic, Chip On Board, Optoelectronic Assembly, Through Hole Assembly, Surface Mount Assembly, System Assembly
- Production Capabilities: Prototype / Low Volume, Mid Volume, Quick Turn, Cabling
Description: Detailed Features System x3500 M3 servers are high-throughput, two-way, SMP-capable network servers with excellent performance scalability when you add memory and a second processor. They incorporate powerful Intel Xeon processors, model dependent. These flip-chips, land grid array 6 (FC-LGA6
- Form Factor: Tower
Supplier: RS Components, Ltd.
Description: Amplifier Type:Class-AB; Function:Speaker; Power Supply Type:Single; Input Signal Type:Differential; Output Signal Type:Differential; Output Type:1-Channel Mono; Typical Gain Bandwidth Product:2MHz; Minimum CMRR:90dB; Typical Single Supply Voltage:3, 5V; Supplier Package:Flip-Chip
- Type: Amplifier
- Amplifier Class: Class AB
Supplier: Umicore Materials
Description: Titanium for Semiconductor technology is used for front end applications as well as for advanced packaging, e.g. Flip-Chip technology, and in a variety of compounds. Umicore Titanium sputtering targets are available in several grades to match customers needs.
- Metal / Alloy Types: Refractory / Reactive (UNS R), Titanium / Titanium Alloy
- Applications: Electronics / RF-Microwave, Other
Find Suppliers by Category Top
Featured Products for Flip Chip Top
Advanced Interconnections Corp.
Flip-Top BGA Sockets Ease Device Test
The compact Flip-Top ™ Test Socket design matches your device footprint and uses less PC board space than typical test sockets because it requires no external screws, backing plates, or mounting holes in the PCB. The hinged clamp, with integral heat sink, makes insertion and removal of devices quick and easy while ensuring a reliable connection. A chip support plate, customized to your specific IC package, allows for inconsistencies in package coplanarity, thickness, or tolerance issues... (read more)
Browse IC Sockets and Headers Datasheets for Advanced Interconnections Corp.
Halogen-Free Water-Soluble Dipping Flux
Indium Corporation will introduce Flip-Chip Flux WS-688 at Semicon West, July 10-12, 2012, in San Francisco, California, USA. Flip-Chip Flux WS-688 is a halogen-free water-soluble dipping flux suitable for use with both eutectic, tin, and tin-silver solder bumps and copper-pillar microbumps. It is designed to be useful in high temperature application environments, such as thermocompression bonding. Flip-Chip Flux WS-688 reduces or eliminates voids, even in applications where damage... (read more)
Browse Fluxes Datasheets for Indium Corporation
Advanced Technical Ceramics Company
High Density (HD) Alumina for RF Applications
AdTech has designed a product line that combines thin film substrate qualities with multilayer HTCC structure, which allows the combination of high density thin film technology with the practicality of multilayer co-fire alumina. Demonstrated programs have included flip chip, copper metallization and cavities. (read more)
Browse IC Interconnect Components Datasheets for Advanced Technical Ceramics Company
EPO-TEK® PCB Applications Guide
Epoxy Technology announces its latest offering for epoxy adhesive selection, our PCB Applications Guide. This interactive tool allows users to select applications within a PCB in order to view each corresponding product recommendation. Each sheet provides mechanical and physical properties for each product to help in selecting the most appropriate epoxy. Applications include: Advanced IC Packaging, Ferrite Cores & Magnets, Flex PCB, Flip Chip, Glob Top, Glob Top Dam-N-Fill, LED, Photonic... (read more)
Browse Epoxy Adhesives Datasheets for Epoxy Technology
Advanced Technical Ceramics Company
High Density HTCC Alumina for Thin Film
AdTech Ceramics has developed a High Density Alumina Straight-Through Vias for Thin Film Applications. This product line combines thin film substrate qualities (5 micro inch or better surface finish) with multilayer HTCC structure and straight through hermetic vias, with the practicality of multilayer co-fire alumina. Demonstrated programs have included flip chip, copper metallization, and cavities. (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for Advanced Technical Ceramics Company
Mouser Electronics, Inc.
Philips Lumileds LUXEON Q White LEDs
Philips Lumileds LUXEON Q White LEDs deliver superior performance in a high-power emitter that serves as a direct drop-in replacement for products that use the standard 3535 surface mount package. LUXEON Q is the first high-power LED based on LUXEON Flip Chip die, Philips Lumileds high performance Chip Scale Package (CSP) device architecture. LUXEON Q takes advantage of a fully developed ecosystem for 3535 components, including optics, to speed the time-to-market for indoor and outdoor... (read more)
Browse Light Emitting Diodes (LED) Datasheets for Mouser Electronics, Inc.
EPO-TEK® Underfills Guide
What Are Underfills?. Underfills are used to fill space beneath a die and adhere to its carrier. They add structural. strength, increase impact resistance, bolster thermal cycling resistance and improve overall reliability. Underfills can be found in a wide variety of applications including flip-chip, fine pitch BGA, and chip scale packages. How Can Underfills Be Used?. Underfills are used most often in three distinct applications: • Capillary Underfills. • Non-Flow Thermally... (read more)
Browse Epoxy Adhesives Datasheets for Epoxy Technology
Build-to-print or design-to-spec LTCC packaging
on yours. (Download our LTCC brochure, equipment list, and design guide). The solutions you need. Whether your project requires a high-density LTCC circuit with embedded components or an Integrated Microwave Assembly (IMA) – Anaren stands ready to make your vision a reality with an exacting build-to-print or custom-designed solution. Our experience includes: > Frequency generation/ sources. > Packaging for next-gen modules (BGA, flip chip, etc.). receiver and exciter. > High... (read more)
Browse Wireless Systems Datasheets for Anaren, Inc.
ROHM Semiconductor USA, LLC
Hall Effect ICs
-40C to +85C. Applications. Portable switch applications. • Smartphone ON/OFF when removing from case. • Sliding cover on mobile phones or digital cameras. • Flip phone or laptop cover open/close. • Tablet PCs. • Track wheel positioning on MP3 players, toys and game controllers... (read more)
Browse IC Switching Voltage Regulators Datasheets for ROHM Semiconductor USA, LLC
Parts by Number for Flip Chip Top
|Part #||Distributor||Manufacturer||Product Category||Description|
|1020FLIP CHIP||ASAP Semiconductor||ALTERA||Not Provided||BGA|
|1020 FLIP CHIP||ASAP Semiconductor||ALTERA||Not Provided||Not Provided|
|30-OHM-FLIP-CHIP||National Microchip||Not Provided||Not Provided||Not Provided|
|30-OHM-FLIP-CHIP||National Microchip||TRX||Not Provided||Not Provided|
|30-OHM-FLIP-CHIP||ASAP Semiconductor||TRY||Not Provided||Not Provided|
|8031||Allied Electronics, Inc.||AIM PRODUCTS LLC.||Not Provided||Underfill FF35; 10cc; for Capillary Flow for Flip Chip; CSP; BGA and MICRO-BGA|
Conduct Research Top
Flip Chip Bonder (Embedded)
Embedding an Industrial PC with image processing board into a Flip Chip Bonder. CONTEC A Focus on Quality. A Commitment to Our Environment. Global | - Region - Japan China. Change Home Sitemap. Search. Products. Industrial Computers. Board Computers. Data Acquisition & Control. DAQ
Study of RF Flip-Chip Assembly with Underfill Epoxy (.pdf)
Flip-chip assembly technology is becoming more and more important to radio frequency (RF) MCM with the following advantages: automated assembly, compact size, low cost, low cross talk, and low insertion loss. However, flip-chip assembly also demands carful evaluation of solder joint reliability.
Advanced Thermal Interface Materials for Enhanced Flip Chip BGA
Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient
The Drive to Miniaturize - 0201 Flip Chip Silicon Schottky Diodes
be directly mounted. to a printed circuit board. (PCB) with automated assembly. equipment. ./add4c267-3089-4ad6-993d-e6fd25d05c87 PAGE 1 • NOVEMBER 2009. FEATURE ARTICLE. www.MPdiGEst.cOM. The Drive to Miniaturize - 0201 Flip Chip Silicon Schottky. Diodes. by Rick Cory, Skyworks Solutions, Inc
Simulation and Measurement of High Speed Serial Link Performance in a Dense, Thin Core Flip Chip Package
, like Hyper Transport, Infiniband, PCI Express, RapidIO and SATA, are driving new speed and density specifications for differential signals. This paper will show how to meet these product requirements with a thin core, flip chip, organic package which uses a standard, reasonable-cost, reliable FR-4
Thermal Enhancement of Systems using Organic Flip-Chip Packages (FC-PBGA) with an Alternate Cooling Path through the Printed Wiring Board
The thermal performance characteristics of organic flip-chip packages (FC-PBGA) incorporating thin (0.5mm), high interconnect density (dense-core) organic substrates has been studied using 1-D calculations and 3-D numerical analysis. Of particular interest is the ability of the substrate to provide
Medical Device Link .
Flip-Chip Processes Affect Size, Cost, and Reliability by Albert P. Kretz and Donald Styblo Flip-chip processes allow miniaturization of electronic circuitry by utilizing integrated circuit (IC) chips without the conventional plastic packaging that adds a great deal of bulk. Combined with tiny
Medical Device Link .
types. Although flip chips can sometimes be difficult to work with, when they are properly designed and executed, they are very reliable. A flip chip package design eliminates the problems associated with solder balls being missing, bridged, cracked, or voided. In addition, the underfill material fills
More Information on: Flip Chip Top
Advanced Flip Chip Packaging
Advanced Flip Chip Packaging .
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Reliability Data for BGA, Flip Chip BGA, and CSP .
Integrated Circuit Packaging, Assembly and Interconnections
7.1 — The COB Process..................................................................................94 7.2 — Flip Chip On Board (FCOB).................................................................98 7.3 — Summary.............................................................................................101 .
Solder Joint Technology
C-4 Flip Chip Technology .......................................
Materials for Advanced Packaging
Latest advances in several key packaging materials including lead-free solders, flip chip underfills, epoxy molding compounds, conductive adhesives, die attach adhesives/films, and Thermal Interface Materials (TIMs) are reviewed in great detail in Chapters 5, 9, 10, 11, 12, and 13, respectively.
Lead-free Solders: Materials Reliability for Electronics
Huang, Zhiheng, Conway, P.P., Liu, Changqing and Thomson, R.C. (2004) The effect of microstructural and geometrical features on the reliability of ultrafine flip chip microsolder joints.
Electrical Conductive Adhesives with Nanotechnologies
Currently, two types of first-level intercon- nection dominate the industry: (1) wire bonding and (2) flip chip attachment.
Fundamentals of Microsystems Packaging > FUNDAMENTALS OF IC ASSEMBLY
Flip Chip .