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Supplier: Barry Industries, Inc.
Description: Flip chip w/ back metallization
- Configuration: Single Resistor
- Category / Application: Automotive, Aerospace, General Use, Medical, Power Resistor
- Technology / Construction: Ceramic Composition, Metal Alloy, Thick Film
- Packing Method: Tape Reel
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RF and Wireless Chips (114 Companies)
Parts by Number for Flip Chip Top
|Part #||Distributor||Manufacturer||Product Category||Description|
|30-OHM-FLIP-CHIP||National Microchip||Not Provided||Not Provided||Not Provided|
|1020 FLIP CHIP||ASAP Semiconductor||ALTERA||Not Provided||Not Provided|
|30-OHM-FLIP-CHIP||National Microchip||TRX||Not Provided||Not Provided|
|30-OHM-FLIP-CHIP||ASAP Semiconductor||TRY||Not Provided||Not Provided|
|G7270||PLC Radwell||Digital Equipment||PLCs/Machine Control, PLC Module & Rack||FLIP CHIP|
|G7270||PLC Radwell||Dec||PLCs/Machine Control, PLC Module & Rack||FLIP CHIP|
Conduct Research Top
Flip Chip Bonder (Embedded)
Embedding an Industrial PC with image processing board into a Flip Chip Bonder. CONTEC A Focus on Quality. A Commitment to Our Environment. Global | - Region - Japan China. Change Home Sitemap. Search. Products. Industrial Computers. Board Computers. Data Acquisition & Control. DAQ
Study of RF Flip-Chip Assembly with Underfill Epoxy (.pdf)
Flip-chip assembly technology is becoming more and more important to radio frequency (RF) MCM with the following advantages: automated assembly, compact size, low cost, low cross talk, and low insertion loss. However, flip-chip assembly also demands carful evaluation of solder joint reliability.
Advanced Thermal Interface Materials for Enhanced Flip Chip BGA
Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient
The Drive to Miniaturize - 0201 Flip Chip Silicon Schottky Diodes
be directly mounted. to a printed circuit board. (PCB) with automated assembly. equipment. ./9957fdcd-ca89-4f4a-a531-7865675465c6 PAGE 1 • NOVEMBER 2009. FEATURE ARTICLE. www.MPdiGEst.cOM. The Drive to Miniaturize - 0201 Flip Chip Silicon Schottky. Diodes. by Rick Cory, Skyworks Solutions, Inc
Simulation and Measurement of High Speed Serial Link Performance in a Dense, Thin Core Flip Chip Package
, like Hyper Transport, Infiniband, PCI Express, RapidIO and SATA, are driving new speed and density specifications for differential signals. This paper will show how to meet these product requirements with a thin core, flip chip, organic package which uses a standard, reasonable-cost, reliable FR-4
Thermal Enhancement of Systems using Organic Flip-Chip Packages (FC-PBGA) with an Alternate Cooling Path through the Printed Wiring Board
The thermal performance characteristics of organic flip-chip packages (FC-PBGA) incorporating thin (0.5mm), high interconnect density (dense-core) organic substrates has been studied using 1-D calculations and 3-D numerical analysis. Of particular interest is the ability of the substrate to provide
Medical Device Link .
Flip-Chip Processes Affect Size, Cost, and Reliability by Albert P. Kretz and Donald Styblo Flip-chip processes allow miniaturization of electronic circuitry by utilizing integrated circuit (IC) chips without the conventional plastic packaging that adds a great deal of bulk. Combined with tiny
Medical Device Link .
types. Although flip chips can sometimes be difficult to work with, when they are properly designed and executed, they are very reliable. A flip chip package design eliminates the problems associated with solder balls being missing, bridged, cracked, or voided. In addition, the underfill material fills
Engineering Web Search: Flip Chip Top
PAGE 1 ? NOVEMBER 2009 FEATURE ARTICLE www.MPdiGEst.cOM The...
2009 FEATURE ARTICLE www.MPdiGEst.cOM The Drive to Miniaturize - 0201 Flip Chip Silicon Schottky Diodes by Rick Cory, Skyworks Solutions, Inc.
- SKYWORKS : Products - GaAs Flip Chip Schottky Diodes
XAPP426: Implementing Xilnx Flip Chip BGA Packages
Note: Packaging R Implementing Xilinx Flip-Chip BGA Packages XAPP426 (v1.3) March 3, 2006 Summary Xilinx flip-chip BGA package is offered for Xilinx
Flip Chip Assembly | Automated Assembly CorporationAutomated...
High volume flip chip on flexible circuitry is routine at Automated Assembly. The original roll-to-roll process developed at AAC was created
Thin Film Flip Chip - What does TFFC stand for? Acronyms and...
(redirected from Thin Film Flip Chip) 0.01 sec. Thin Film Flip Chip (technology to mount a semiconductor)
2013 ? FlipChip International (FCI), the global technology leader in flip chip bumping and Wafer Level Packaging announced today its Elite? OPM
Flip chip - Wikipedia, la enciclopedia libre
Empaquetado de un procesador PowerPC con Flip-Chip, se ve el chip de silicio. Flip chip De Wikipedia, la enciclopedia libre
Puce retournée - Wikipédia
Flip chip Câblage par fil Dans le domaine des semi-conducteurs, la puce retournée