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Supplier: Shiu Li Technology Co., Ltd
Description: Thermal Conductive Putty | LiPOLY H-putty is a tolerance filled, thermally conductive putty that maintains high compressibility with low stress, high reliability, and will not flow vertically. Our H-putty can replace thermals pads in design gaps of 0.1mm-3.0mm.
- Compound Type: Thermal Compound / Heat Conductive
- Dielectric Strength: 300 kV/in
- Features: UL Approved
- Industry: Electronics
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Supplier: Shiu Li Technology Co., Ltd
Description: Thermal Conductive Putty | LiPOLY S-putty is a thermally conductive putty that is great for filling small air gaps. The thermal conductivity is between 2.0~6.0 W/m*K. The high deformation material can fill gaps closely, cover high tolerance, overcome issues with overflow and
- Compound Type: Thermal Compound / Heat Conductive
- Dielectric Strength: 300 kV/in
- Features: UL Approved
- Industry: Electronics
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Thermal Compounds and Thermal Interface Materials - Non-Silicone Thermal Conductive Putty -- N-PuttySupplier: Shiu Li Technology Co., Ltd
Description: LiPOLY N-putty series is silicone-free and dispensable thermally conductive material. With a thermal conductivity from 3.5 W/m*K, this product can be used successfully to remove manufacturing tolerances. It is ideally suited for dispensing using the N-putty dispensing robot.
- Chemical / Polymer System Type: Specialty / Other
- Dielectric Strength: 300 kV/in
- Industry: Electronics
- Material Type: Specialty / Other
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY S-putty5-s is a one-part dispensable material with thermal conductivity 10.0 W/m*K. It also can overcome overflow and drying problems to increase the thermal conductivity. S-putty5-s is a great alternative to thermal grease and ideally suited for dispensing using the dispensing
- Compound Type: Thermal Compound / Heat Conductive
- Dielectric Strength: 305 kV/in
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV
- Thermal Conductivity: 10 W/m-K
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Supplier: Allied Electronics, Inc.
Description: 1-1/4 Oz. Weight, High Voltage Puttys Silicone rubber compound with excellent insulating characteristics. It will never harden, will not shrink and has good adhesive properties. Supplied in strips which are approximately 1" wide and 1/4" thick (approximately 18" length). (Approx. 550
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Supplier: Allied Electronics, Inc.
Description: 1/2 lbs. Weight, High Voltage Puttys Silicone rubber compound with excellent insulating characteristics. It will never harden, will not shrink and has good adhesive properties. Supplied in strips which are approximately 1" wide and 1/4" thick (approximately 18" length). (Approx. 550
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Supplier: Fujipoly® America Corp.
Description: SARCON® PG65A from Fujipoly® is one of the industry’s newest high-performance thermal interface materials that is extremely compressible. This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extremely low material
- Chemical / Polymer System Type: Silicone
- Dielectric Constant (Relative Permittivity): 7.6 to 9.5
- Dielectric Strength: 229 kV/in
- Industry: Electronics, Aerospace, Automotive, OEM / Industrial
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Supplier: RS Components, Ltd.
Description: A one-component high temperature acetoxy silicone sealant. Withstands temperatures of up to 250°C long term & 300°C short term. To 93/112/EC, 67/548/EEC, 88/379/EEC standards. Meets requirements of FDA regulation number 21CFR177.2600 for use in areas where food contact is likely
- Chemical / Polymer System Type: Silicone
- Use Temperature: 599 F
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Supplier: Fujipoly® America Corp.
Description: SARCON ® Silicone Putty is a highly conformable, thermally conductive, non-flammable interface materials. The surface consistency is excellent for filling small air gaps and uneven mating surface, making reliable contact with various shapes and sizes of components.
- Applied Thickness / Gap Fill: 0.0394 to 0.0787 inch
- Chemical / Polymer System Type: Silicone
- Dielectric Constant (Relative Permittivity): 7.77 to 8.58
- Features: UL Approved
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Supplier: Fujipoly® America Corp.
Description: Fujipoly® introduces Sarcon® PG45A its newest high-performance, putty-like thermal interface material. This extremely low modulus gap filler exhibits a thermal resistance as low as 0.02°C•in2/W at 43.5 PSI with a thermal conductivity of 4.5 W/m°K. Sarcon® PG45A
- Applied Thickness / Gap Fill: 0.0591 to 0.0984 inch
- Chemical / Polymer System Type: Silicone
- Dielectric Constant (Relative Permittivity): 7.17 to 7.31
- Industry: Electronics, Semiconductors / IC Packaging
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Silicone & Non-Silicone Thermal Putty Up to 10W/m*K Thermal Putty is a gap filler material with high deformation amount, low thermal resistance, flexible gap adaptation, and excellent (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Shiu Li Technology Co., Ltd -
N-putty2 Datasheet Non-Silicone Thermal Conductive Putty LiPOLY’s N-putty series is a non (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Shiu Li Technology Co., Ltd -
like pastes, putty and grease is pump-out, or the expansion and contraction of the interface surfaces with rapidly changing temperatures causes the pastes to be squeezed or “pumped out” of the gap. Silicone TIMs generally have a higher thermal expansion (that is also higher with (read more)
Browse Heat Transfer Fluids and Thermal Oils Datasheets for Shiu Li Technology Co., Ltd -
, or putty-like materials. The pictured Sanitary Double Planetary Mixer Model DPM-4S and Sanitary Discharge System Model DS-4S are fully customized and engineered for efficient processing of medical-grade silicone formulations in a portable workstation. The heavy-duty 4-gallon Double (read more)
Browse Planetary Mixers Datasheets for Charles Ross & Son Company
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CENTRIFUGE MODELLING STUDY OF CONTRASTING
STRUCTURAL STYLES IN THE SALT RANGE AND THE
POTWAR PLATEAU, PAKISTAN
These stratigraphic units of alternating competence, composed of thin layers of plasticine modelling clay and silicone putty , rest on a rigid base plate that represents the crystalline basement of the Indian plate.
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Artificial muscle technology applied towards treating ischemic mitral regurgitation caused by left ventricular remodeling
3.3.3 Silicone Putty Molding .......................................................................................................................
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Single Stage Silicone Border Molded Closed Mouth Impression Technique—Part II
Silicone putty can be added along the border of the tray in sufficient quantity without slumping as compared to low fusing compound while recording the functional width of the sulcus.
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Esthetic and Functional Management of Diastema
direct mock-up with the temporary filling material using silicone putty in a single visit .
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North Aegean core complexes, the gravity spreading of a thrust wedge
The experiments were performed in a Plexiglas box using feldspar sand and silicone putty for the brittle and ductile layers of the crust, respectively.
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CBCT ‐based volume of simulated root resorption – influence of FOV and voxel size
Volumetric measurements were validated using IRR silicone putty casts.
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The dynamic range of TMJ sounds
Bilateral recordings of 249 TMJ clickings were made from three subjects, using sampling rates of 48 or 96 kHz and 24 bits A/D conversion, with and without the ear canals sealed by Silicone putty .
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Fracture at elevated temperature
The true upper bound of ductility is in- finity for a strain rate sensitivity of 1, but a practical upper bound is obtained by measuring hole growth in silicone putty which has a strain-rate sensitivity of about 0.75.
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Centrifuge modelling of deformation of a multi-layered sequence over a ductile substrate: 1. Style and 4D geometry of active cover folds during layer-parallel ...
Introduction of this low-density material avoids the use of barium sulphate and acids, commonly used to increase the density of silicone putties but which can significantly change the rheology of the materials (ten Grotenhuis et al. 2002).
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The surface tectonics of mantle lithosphere delamination following ocean lithosphere subduction: Insights from physical‐scaled analogue experiments
The 1.3 cm thick proplate mantle lithosphere is modeled by a Newtonian viscous silicone putty (Rhodorsil Gomme + PBDMS + galena fillers) [Funiciello et al., 2003, 2006; Bellahsen et al., 2005].