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Epoxy Adhesive Applications Guide

From Epoxy Technology

This guide is an educational tool designed to assist adhesive users in
gaining a more thorough understanding of adhesive properties and testing.

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Products & Services
Encapsulants and Potting Compounds
Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
Electrical Insulation and Dielectric Materials
Electrical insulation and dielectric materials includes various forms of materials that surround and protect electrical conductors and prevent unwanted current flow, leakage or crosstalk.
Electrical and Electronic Resins
Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
Thermal Compounds and Thermal Interface Materials
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Product Announcements
Epoxy Technology - Epoxy Adhesive Application Guide
Epoxy Technology offers our newest educational tool designed to assist adhesive users in gaining a more thorough understanding of adhesive properties and testing. (read more)
Epoxy Technology - EPO-TEK® PCB Applications Guide
Epoxy Technology announces its latest offering for epoxy adhesive selection, our PCB Applications Guide. This interactive tool allows users to select applications within a PCB in order to view each... (read more)
Epoxy Technology - Tech Tip 13 - Surface Preparation
Properly preparing a surface for bonding can increase reliability by optimizing a substrates' ability to accept the adhesive. (read more)
Master Bond, Inc. - Medical Grade Electrically Conductive Epoxy
Silver-filled EP21TDCS-Med meets USP Class VI requirements and is widely used where biocompatibility is of paramount importance. The resistance is exceptional, less than 1 milliohm-cm. It has... (read more)
General Carbide Corporation - Designer's Guide to Tungsten Carbide
This is a reference for designers and end users of tungsten carbide. It is a compilation of recommendations derived from practical experience, theoretical stress analysis, proven application... (read more)
Master Bond, Inc. - Vertical Bonding Medical Adhesive
Master Bond's USP Class VI certified EP42HT‑2ND2 medical adhesive has a paste like consistency and facilitates the adhesive's application when bonding vertical surfaces. It cures readily at... (read more)
Epoxy Technology - Tech Tip 16 - Understanding Epoxy Resin Bleed
Epoxy Technology announces a new tech tip that provides an overview of resin bleed, ways to avoid it and is meant as a general guideline for epoxy adhesive users. (read more)
 
Topics of Interest

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