The FTI-1000 is designed for high-coverage wafer-level testing of semiconductor devices and wide-bandgap technologies, with strong suitability for multisite probe applications.
FTI-1000 addresses the characterization needs of DC and AC parameters directly at wafer probe, supporting both engineering characterization and high-volume wafer testing. Thanks to its modular Tester-per-Channel Board architecture, users can configure independent resources into a single flexible and scalable platform tailored to any wafer-level test requirement.

Control is managed through FTI Studio, an intuitive graphical interface that simplifies probe-card bring-up, test-program development, and debug, making the system equally accessible to designers and test engineers.