Dual-Cure Encapsulant for Shadow Areas

Featured Product from Dymax

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9014 is Dymax's advanced dual-cure encapsulant designed for robust PCB assembly. The product cures in seconds primarily with UV light and its secondary moisture curing function ensures complete solidification in shadowed areas on printed circuit boards.

For manufacturers working with chip-on-board, chip-on-flex, chip-on-glass, and wire bonding assemblies, this material provides excellent flexibility, enhanced durability, and superior resistance on PCBs.

9014 encapsulant provides moisture and corrosion protection of critical components found in electronic applications.