A new study conducted with the Rochester Institute of Technology reveals how thermocouple attachment methods impact reflow profiling accuracy. Results show Dymax 9037-F UV-curable adhesive provides stronger, more repeatable thermocouple holds than solder, aluminum tape, or polyimide tape, especially in high-density PCB applications.

Key findings include:

• Higher accuracy and repeatability in thermal data
• More secure attachment for demanding PCB layouts
• Comparative testing across multiple attachment methods
• Guidance for improving process control in advanced electronics manufacturing

An essential read for engineers optimizing reflow profiling or HDI assembly processes.