Dymax light?curable encapsulants help simplify PCB assembly while improving reliability and long?term performance.

Key advantages include:

• • Faster throughput and less rework using UV or LED light?curing that becomes tack?free in seconds
  • Improved protection and yield in glob top and electronic encapsulation of bare die, wire bonds, and integrated circuits
  • Reduced stress on sensitive components for designs on rigid and flexible PCB platforms, including flex and glass
  • More complete cure in shadowed areas with secondary moisture or heat?cure options in select formulations
  • Greater confidence in demanding environments using formulations resistant to moisture, thermal cycling, and abrasion
  • Material options tailored for specific applications, including IBOA?free encapsulants for consumer wearables

Explore the encapsulant product portfolio