As AI workloads drive higher rack densities and increased thermal loads, material selection has become a critical factor in data center performance, reliability, and efficiency. Pexco's latest engineering guide explores the polymer materials used in modern data center infrastructure, with a focus on liquid cooling, fluid handling, cable management, and leak prevention.

What are the best materials for data center cooling and fluid handling?
The guide answers one of the most common questions engineers and designers face: which materials offer the best combination of chemical resistance, temperature performance, purity, and long-term reliability for liquid-cooled data centers. It compares PFA, PTFE, FEP, and PVDF materials, along with sealing solutions such as silicone, EPDM, and TPE-based elastomers. 

Our blog details:

• Material selection for direct-to-chip and immersion cooling systems
• High-purity fluid handling solutions for AI and HPC environments
• The role of thermoplastic piping materials, including PVC, CPVC, PVDF, and PFA
• Cable management and heat shrink solutions for high-density infrastructure
• Critical seal and gasket materials for leak prevention
• Compliance standards commonly specified for data center components 

As liquid cooling adoption accelerates across hyperscale, cloud, and AI facilities, understanding the strengths and limitations of various polymer materials is essential for designing reliable and scalable infrastructure. 

About Pexco
Pexco delivers engineered polymer solutions for data center applications, including Altaflo® fluoropolymer tubing, custom extrusions, Insultab® heat shrink products, precision seals and gaskets, injection molded components, and machined parts designed for demanding thermal management and fluid handling environments.