Summit offers both the fastest prototype turn times AND the most extensive advanced technology capabilities.

Whether you need 2 or 4-layer boards delivered in a few days or have a complex HDI design with IPC certifications, Summit’s integrated network of facilities have the experience necessary to manufacture your PCB designs on-time and on budget.

Mission-Critical prototype to production PCBs

Summit’s highly advanced manufacturing capabilities enable us to dependably build the most complex boards in the world. But we are never content with the status quo. Our teams work alongside customers to push the boundaries of what is possible, helping to create truly astonishing electronic products.

Looking to test your design before committing to a full PCB production run? At Summit Interconnect your small-quantity prototype PCBs are manufactured with the same state-of-the-art equipment and quality processes used to manufacture production PCBs.

High-Density Rigid PCB

Summit offers both the fastest prototype turn times AND the most extensive advanced technology capabilities.

Whether you need 2 or 4-layer boards delivered in a few days or have a complex HDI design with IPC certifications, Summit’s integrated network of facilities have the experience necessary to manufacture your PCB designs on-time and
on-budget.

A Full Service Offering

Mission-Critical prototype to production PCBs

Summit’s highly advanced manufacturing capabilities enable us to dependably build the most complex boards in the world. But we are never content with the status quo. Our teams work alongside customers to push the boundaries of what is possible, helping to create truly astonishing electronic products.

Looking to test your design before committing to a full PCB production run? At Summit Interconnect your small-quantity prototype PCBs are manufactured with the same state-of-the-art equipment and quality processes used to manufacture production PCBs.

High-Density (HDI) PCBs

Due to the growing complexity of design structures, high-density circuit boards (HDI) are becoming essential in today’s electronics. As products increase in functionality and decrease in size and weight, circuit board designers need new solutions to maximize the space on each board. For example, although blind and buried vias and vias-in-pad add complexity to the design, these features add more functionality without adding space.

Summit Interconnect has the expertise and HDI technology to route highest density designs.

Types of HDI

HDI designs typically include:

Through vias from surface to surface

Buried vias with through vias

Two or more HDI layers with through vias

Laser drill micro vias

Passive substrate with no electrical connection