UL’s Yellow Card database allows OEMs to verify certified laminates and PCB fabricators. Investing in UL certification enhances credibility, expands market access, and reduces risks from substandard materials or processes. (read more)

UL certification is a critical requirement for PCB manufacturers that want to ensure safety, reliability, and compliance with industry standards. Whether for consumer electronics, industrial equipment, medical devices, or aerospace applications, UL-recognized PCBs provide assurance of fire resistance, electrical integrity, and regulatory compliance. (read more)

Selecting the best PCB material depends on design requirements such as signal speed, channel loss budget, thermal environment, and manufacturability. Engineers should balance performance with cost while documenting requirements to ensure consistent builds across suppliers. (read more)

The selection of PCB materials is critical to achieving optimal electrical performance for high-frequency data transmission, RF systems, and telecommunications infrastructure. Choosing the right material also requires alignment with applicable IPC design, material, and performance standards. (read more)

Summit Interconnect builds advanced printed circuit boards that power aerospace and defense systems where performance, precision, and compliance are essential. From radar and avionics to satellites and secure communications, our facilities are engineered to deliver consistent, reliable quality at any altitude. (read more)

• Improved reliability by reducing the risk of trapped air or liquids
• Tighter BGA pitches and higher density interconnects by allowing for via-in-pad instead of dog bone designs.
• Reliable filled & stacked via constructions.
• Planar copper surfaces above filled via for more reliable surface mounts & increased assembly yields.
• Enhanced....

Backdrilling is a cost-effective method to improve signal integrity without adding costly additional sub-lamination structures. This process removes the unneeded portion of a via barrel that can cause signal reflections at high speed data rates, or on high frequency RF designs. (read more)

Whether you need 2 or 4-layer boards or have a complex HDI designs, Summits's integrated network of fabrication facilities have the experience necessary to manufacture your rigid PCB designs to exact specifications. (read more)

Using Blind, Buried, and Stacked Vias on Complex Designs
Incorporating High Density Interconnect (HDI) structures is commonly utilized on advanced designs as a way to overcome space issues resulting from high I/O, fine pitch components. (read more)

In Jurassic World: Rebirth, chaos breaks loose when systems fail under pressure. With PCB fabrication, that’s not an option. From radar to RF to high-speed defense systems, your electronics demand reliability, precision, and durability, no matter how hostile the environment. (read more)

From prototype runs to low-to-mid production volumes, aligning quote requests with IPC guidelines (e.g., IPC-A-610, IPC-2612, IPC-1752) helps ensure consistent communication and expectations between OEMs and contract manufacturers. (read more)

Proper file preparation is critical for successful PCB fabrication, ensuring accuracy, efficiency, and manufacturability. Before production, manufacturers require specific design files that provide information about layers, drill holes, component placement, and routing. (read more)

Printed circuit boards for mission-critical applications must be manufactured to reliably tolerate harsh environments. (read more)

Our innovative software-backed facilities feature advanced technologies and extensive capabilities designed to fabricate all of your designs, from quick-turn boards to complex, high-layer count boards with blind and buried vias. (read more)

RF/microwave PCBs from Summit Interconnect
Manufacturing RF/microwave PCB designs requires advanced equipment and experience. Summit has made significant investments in the technology, processes and people required to accurately fabricate these complex PCBs. (read more)

Backdrilling is a cost-effective method to improve signal integrity without adding costly additional sub-lamination structures. This process removes the unneeded portion of a via barrel that can cause signal reflections at high speed data rates, or on high frequency RF designs. (read more)

There are many considerations when integrating RF onto PCBs, including tight-component densities, multiple surface finish possibilities, board thickness considerations, wide ranges of reliability requirements, and even substrate-material choices. (read more)

30+ Years of Experience

Our teams work alongside customers to push the boundaries of what is possible, helping to create truly astonishing electronic products. (read more)

As experts in rigid-flex and flex manufacturing, we handle rigid-flex, bookbinder, multilayer, adhesiveless & adhesive, stiffeners, laser ablation, thin flex laminates, assembly options and more. (read more)

Automated Test Equipment (ATE) boards are used for testing highly complex semiconductor chips. ATE board designs are typically highly complexity with an emphasis on high performance, The boards have an extremely high-layer count (40 to 60 ). (read more)

Summit offers both the fastest prototype turn times AND the most extensive advanced technology capabilities.

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