Considerations when integrating RF onto PCBs
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High-speed characteristics
RF/microwave signals are highly sensitive to the impact of noise, crosstalk, and power.
There are many considerations when integrating RF onto PCBs, including tight-component densities, multiple surface finish possibilities, board thickness considerations, wide ranges of reliability requirements, and even substrate-material choices. In addition, RF/microwave designs can require special manufacturing equipment. Fortunately, Summit has made significant investments in the equipment and field application engineering experience required for accurately manufacturing these PCBs.
Summit RF / microwave PCB capabilities:
- Wide range of high-speed, low-loss materials
- Shielding
- Combination surface finishes
- Hybrid material stackups
- Tight tolerance stripline
- HDI/PTH mode suppression
- Ticer/Ohmega resistors and filters
- Plated cavities and edges
- Controlled depth milling
- Bonded heat sinks
- View all capabilities
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Summit Interconnect,
Summit Interconnect is one of the leading providers of complex, rigid, and flexible printed circuit boards in North America, offering solutions ranging from advanced prototyping to high mix, low-to-mid volume production. Summit serves customers across the aerospace, defense, and other highly demanding commercial sectors and has facilities in California, Illinois, and Toronto, Canada. Summit is a recognized industry leader in quick-turn manufacturing and has expertise with a wide range of materials like high-speed digital, RF/microwave, and mixed constructions.