The Benefits of Via Fill
Service Detail from Summit Interconnect
Via Fill
Create Space for Pads and Improve Reliability
Via in pad with non-conductive epoxy improves signal performance for high speed digital and RF microwave applications. Summit also has experience with conductive epoxy filled vias and plated solid with copper. Summit can assist you with a cost effective method to meet your high speed, thermal management needs. Utilizing the latest via fill equipment, Summit can achieve epoxy fill for 8 mil vias, and is capable of filling a 15:1 aspect ratios with a drill diameter of 0.010” or greater. To fill microvias, plated shut copper vias is our preferred approach. Here are some things to keep in mind when incorporating filled vias in your design:
- Specify epoxy instead of metal based fill
- Specify copper fill on external layer microvias
- Design with low starting foil to reduce copper buildup throughout the sequential plating processes
Benefits of Via Fill
- Improved reliability by reducing the risk of trapped air or liquids
- Tighter BGA pitches and higher density interconnects by allowing for via-in-pad instead of dog bone designs. Summit Interconnect can support .25mm BGA requirements.
- Reliable filled and stacked via constructions.
- Planar copper surfaces above filled via for more reliable surface mounts and increased assembly yields.
- Enhanced thermal dissipation.
Technology Insights
Our teams have been manufacturing PCB's for more than 30 years. Here are some of the best practice guidelines and design resources to assist you in the design process.
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Summit Interconnect,
Summit Interconnect is one of the leading providers of complex, rigid, and flexible printed circuit boards in North America, offering solutions ranging from advanced prototyping to high mix, low-to-mid volume production. Summit serves customers across the aerospace, defense, and other highly demanding commercial sectors and has facilities in California, Illinois, and Toronto, Canada. Summit is a recognized industry leader in quick-turn manufacturing and has expertise with a wide range of materials like high-speed digital, RF/microwave, and mixed constructions.