Enhance Power Device Efficiency with Advanced Cooling Solutions

Power devices require effective cooling strategies to ensure optimal performance, longevity, and efficiency. The following solutions offer innovative approaches to thermal management:

• Ceramic Substrate Materials

  • Zirconia reinforced aluminum nitride composite ceramics balance thermal conductivity and mechanical strength.
  • An effective compromise between aluminum nitride and silicon nitride, providing a reliable substrate material.
  • Ideal for enhancing device performance without compromising on material durability.

• Copper Clip Bonding

  • Copper clip bonding reduces both electrical resistance and thermal resistance.
  • The increased overcurrent section and shorter conduction distance enhance heat dissipation significantly.
  • Improved switching efficiency by reducing high-frequency parasitic impedance, leading to better device performance in high-frequency applications.

• Double-Sided Cooling Package Structure

  • Symmetrical chip connections with upper and lower base plates ensure efficient heat dissipation from both sides.
  • The double-sided structure improves heat dissipation efficiency by over 40% compared to traditional wire bonding.
  • This structure is particularly beneficial for applications where high thermal management is critical for performance.

These solutions are tailored to help professionals in power device industries reduce thermal issues, optimize device performance, and extend the life cycle of their products.