AMPLIMITE D-subminiature cable assemblies are part of the complete line of AMPLIMITE D-subminiature connectors which have been widely used by the electronics industry for their rugged design and ease of application. The cable assembly product line adds a selection of off-the-shelf, preassembled cable configurations that require no assembly. (read more)

TE Connectivity’s (TE) Industrial Scientific Medical (ISM) band 868/915 MHz FPC antennas for LoRaWAN and Internet of Things (IoT) applications address the growing demand for ISM band antennas that utilize a single frequency rather than broadband antennas. Multiple FPC shapes are available to address a variety of products/applications. (read more)

High-density BNC cable assemblies from TE Connectivity (TE) expand our high-density BNC portfolio to include a variety of cable solutions for use in large video transmission systems, industrial camera systems, broadcast systems, and video signal applications

High-density BNC connectors provide a compact design solution for large video transmission systems. (read more)

TE Connectivity's (TE) Dual In-Line Package (DIP) sockets and Single In-Line Package (SIP) Sockets provide a separable electrical and mechanical connection between an electronic component and a printed circuit board (PCB). DIP sockets enable easy replacement of components received by such sockets. (read more)

TE Connectivity's (TE) LGA 4710 socket for next-generation server processors adopts the same form-factor as for LGA 4677 and provide more connections between the main board and the processor. Designed for the needs of server-grade top processor players, these sockets support 8-channel DDR5 and PCIe 5.0 technologies. (read more)

SPLATCH 5G/LTE CELLULAR WIDEBAND AND L1/L5 MICRO SPLATCH GNSS CHIP ANTENNAS

TE Connectivity (TE) Splatch 5G/LTE cellular wideband and L1/L5 micro Splatch GNSS chip antennas are the latest addition to the TE surface mount chip antenna portfolio. The high efficiency, economic cost, and adaptability of these Splatch antennas make them well suited for many Internet of Things (I... (read more)