KEY PRODUCT MESSAGING

Superior Thermal Resistance

• Improved thermal resistance over most traditional thermal technologies
• Near-zero plate gap in the thermal bridge construction for improved compression and thermal transfer.
• Improved for applications using cold plates with liquid cooling or heat pipes, ganged heat sinks or direct chassis conduction applications with little to no airflow.

Better Reliability and Durability

• Consistent, long-lasting thermal performance with an elastic compression design that is resistant to set and relaxation over time.
• Low and consistent compression force between cold plate and input/output (I/O) plug.

Improved Application Serviceability

• Lasts longer than traditional thermal technologies to help reduce component replacements needed during servicing.

TARGET APPLICATIONS

• High Performance Computing
• Ethernet Switches
• 5G/Wireless
• Servers
• Ethernet SP Routing
• Chip Set Cooling