Thermal Test Vehicle (TTV) Validation Solutions
Featured Product from Taiwan King Lung Chin PTC Co., Ltd.
Next-Generation Thermal Validation Solutions Designed for AI Chip, CPU/GPU, Cold Plate, Liquid Cooling and Two-Phase Cooling Validation
As AI servers, GPUs, CPUs, and high-performance computing (HPC) platforms continue to increase in power density, accurate thermal validation has become essential for developing reliable cooling systems. Thermal Test Vehicles are becoming an essential validation platform for next-generation AI cooling technologies, including Direct Liquid Cooling (DLC), Microchannel Cold Plates (MCCP), Microchannel Lid (MCL), and future two-phase cooling systems.
KLC provides comprehensive Thermal Validation Solutions, including Thermal Test Vehicles (TTVs), Cold Plate Validation, Liquid Cooling Testing, Two-Phase Cooling Testing, controllers, monitoring systems, and engineering support. Our solutions help engineers accurately simulate real chip heat loads, validate cooling performance, and accelerate product development from R&D to production.
TTV 2.0 is KLC’s next-generation Standardized Thermal Test Vehicle (TTV) — a Complete AI Chip Thermal Test Platform for AI Server Cooling Validation, GPU Thermal Validation Solution, CPU Thermal Simulation Module, and Cold Plate Performance Validation.
