The USUSTK AI Server Copper Skived-Fin Heat Sink is designed for component-level thermal management in AI servers, data center hardware, power electronics, laser systems and semiconductor equipment.

The heat sink is available in C11000 or C10200 high-thermal-conductivity copper. Precision skiving forms the cooling fins directly from the copper base, creating an integral fin-and-base structure without bonded or soldered fin interfaces. This continuous copper construction provides a direct thermal path from the heat-generating component to the cooling fins.

The high-density skived-fin structure increases the available heat-dissipation surface within a compact installation area. Depending on the system airflow and thermal requirements, the heat sink can support natural-convection or fan-assisted forced-air cooling.

Precision CNC machining is used to produce thermal contact surfaces, mounting holes, flange structures and other customized assembly features. Anti-oxidation treatment or copper passivation is available to help reduce surface oxidation and discoloration during handling and operation.

Copper grade, base dimensions, fin thickness, fin pitch, fin height, mounting-hole layout and overall structure can be customized according to customer drawings and thermal-management requirements.

Key Specifications:

• Product type: High-density copper skived-fin heat sink
• Material: C11000 or C10200 copper
• Cooling method: Natural-convection or fan-assisted air cooling
• Manufacturing processes: Precision skiving and CNC machining
• Surface treatment: Anti-oxidation treatment or passivation, optional
• Structure: Integral skived fins and copper base
• Applications: AI servers, data centers, power electronics, laser systems and semiconductor equipment
• Customization: Available according to customer drawings