Innovacera Hot pressed ALN ceramic components purity is 99.5% aluminum nitride and its density is about 3.3g/cm3. The thermal conductivity is 140-170 W/(m·k). The forming way of hot-pressed aluminum nitride ceramics is vacuum hot pressing sintering.
After high temperature and high pressure, hot pressed ALN ceramic part mechanical strength and hardness are better than the tap-casting molding process and cold isostatic press method.
Innovacera can provide the maximum size of hot-pressed aluminum nitride ceramic part is Length 500 x width 500 x height < 350 mm and Outer diameter 500 x height < 500 mm

Hot- Pressed aluminum nitride ceramics material properties:

Hot- Pressed aluminum nitride ceramic components features:

• Excellent thermal conductivity
• High electrical insulation
• High dielectric strength
• Resist high temperature and corrosion
• Thermal expansion coefficient similar to Si, GaN, and GaAs semiconductors
• Suit for rigorous or abrasive environments
• Can’t be eroded by all kinds of molten metals and molten hydrochloric acid.

Hot- Pressed aluminum nitride ceramic part application:

• Semiconductor heaters
• Magnetic resonance imaging equipment
• Etching machine
• Integrated circuit part
• Structural packaging materials
• High-power heat dissipation insulating substrates
• Microwave window materials
• Compound semiconductor single crystal growth crucible

Innovacera can provide Hot Pressed Aluminum Nitride (HPALN) as customized size and welcome to send your inquiry for us.