Case Study: Electronics Printed Circuit Board
Zatkoff Provides PCB Manufacturer with Automated Solution & Improved Reliability
Zatkoff identified that a printed circuit board (PCB) manufacturer was using a thermal pad for heat dissipation. The manually-assembled thermal pad was being placed between the IC case and the heat sink components. It was also verified that the current thermal pad was not providing enough thermal conductivity, not allowing for necessary heat conduction out of the PCB system and causing premature failure. Zatkoff solved its customer’s problem by recommending the Chomerics THERM-A-GAP™ GEL 30 and dispensing it through a fully-automated system. This thermal interface material (TIM) is easily dispensable and provides low thermal impedance and high thermal conductivity. It’s also fully cured, which prevents pump out and has ultra-low compression force. These characteristics provided a more efficient heat dissipation, secured the integrity of the PCB components, and reduced the customer’s labor costs through assembly automation.