- Trained on our vast library of engineering resources.
MINTEQ® International Inc, Pyrogenics Group

  • Discover a thermal management material solution that provides thermal conduction without the "diamond" price
  • Understand why Pyroid® HT material solutions are ideal for high-volume production and provide economic value at the device assembly level
  • Learn how to optimize heat sinks and spreaders with the Pyroid® HT software modeling tool
Read more...

More Product Announcements from MINTEQ® International Inc, Pyrogenics Group
TONGYU Technology Co., Ltd.

Enhance your PC's cooling performance with the TY-C03 CPU Liquid Cooler. Crafted from high-quality C1100 copper, this cooler ensures optimal heat dissipation and longevity. No oxidation, clean surfaces, and impurity-free design guarantee reliability. Customizable for unique requirements. Read more...

More Product Announcements from TONGYU Technology Co., Ltd.
MINTEQ® International Inc, Pyrogenics Group

A Pyroid HT pyrolytic graphite thermal heat sink was designed for the same fin efficiency to replace the existing heat sink. Pyroid HT provides 10X the thermal conductivity of aluminum, offering significant thermal transfer benefits along the heat sink fin length. Read more...

More Product Announcements from MINTEQ® International Inc, Pyrogenics Group
MINTEQ® International Inc, Pyrogenics Group

Metallize the surface of Pyroid® HT pyrolytic graphite heat spreaders to provide particle containment and solderability to a material with four times the thermal conductivity of copper! Various electronic grade coating schemes available. Read more...

More Product Announcements from MINTEQ® International Inc, Pyrogenics Group
Boyd

Boyd works with EV industry leaders to provide engineered material solutions and fully integrated thermal systems that enable safer, more reliable, higher-performing batteries and battery applications in electric, hybrid, and autonomous vehicles. Read more...

More Product Announcements from Boyd
MINTEQ® International Inc, Pyrogenics Group

Heat is the enemy of electronic circuits and devices. It limits performance and leads to premature failure. We are introducing a new weapon in the ongoing battle against thermal problems. Discover how the heat spreading ability of a new material solution — Pyroid® HT®... cuts size, weight, and cost from electronics packaging. Read more...

More Product Announcements from MINTEQ® International Inc, Pyrogenics Group
MINTEQ® International Inc, Pyrogenics Group

With heat issues limiting power device performance and growth, we have developed a derivative of our material branded as Pyroid® HT Pyrolytic Graphite material that offers heat spreaders and sink thermal conductivity up to 4 times (1700 W/m°K) that of copper at only a quarter of the weight. Read more...

More Product Announcements from MINTEQ® International Inc, Pyrogenics Group
Boyd

Boyd Hi-Contact™ Tube Liquid Cold Plate

Liquid Cold Plates with Optimized Surface Contact Read more...

More Product Announcements from Boyd
Boyd

Liquid Cooling offers highly efficient thermal management for high heat loads. Try Boyd's quick and easy tool for determining the best cold plate for your application requirements. Read more...

More Product Announcements from Boyd