Ohmite Manufacturing Co.

Operating temperature and thermal performance are directly related; the lower, the better – and the higher a device’s reliability. Thermal management is more critical than ever for electronic product design as semiconductor devices continue scaling smaller with higher power densities.

Heatsinks and other enhanced cooling solutions are an effective means of reducing pow... Read more...

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Shiu Li Technology Co., Ltd

With a thermal conductivity of 2.2 W/m*K, PK223DM provides high thermal conductivity and low thermal impedance. It is ideally suited for dispensing using the dispensing robot or by syringe. Read more...

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Boyd

Boyd Hi-Contact™ Tube Liquid Cold Plate

Liquid Cold Plates with Optimized Surface Contact Read more...

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Boyd

Liquid Cooling offers highly efficient thermal management for high heat loads. Try Boyd's quick and easy tool for determining the best cold plate for your application requirements. Read more...

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Boyd

Flat Tube Liquid Cold Plates

Low thermal resistance liquid cold plates in a compact, low profile form factor. Read more...

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Boyd

Extended Surface Liquid Cold Plates

Drastically increase heat transfer with additional surface area within the flow path of a liquid cold plate. Read more...

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Boyd

Liquid cold plates are a critical component of a liquid cooled system. Aavid has the broadest range of design and manufacturing liquid cold plate technologies in the industry Read more...

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Boyd

Zipper fins heat sinks are a great heat transfer solution. While Genie uses them in the simplest form, zipper fins have a wide range of application and design flexibility. Contact Boyd Design Engineers for assistance with your zipper fin heat sink design. Read more...

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MINTEQ® International Inc, Pyrogenics Group

With heat issues limiting power device performance and growth, we have developed a derivative of our material branded as Pyroid® HT Pyrolytic Graphite material that offers heat spreaders and sink thermal conductivity up to 4 times (1700 W/m°K) that of copper at only a quarter of the weight. Read more...

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Ohmite Manufacturing Co.

Ohmite now carries a line of heatsink solutions that are specifically designed for your BGA and PBGA applications. Ohmite's heatsinks provide a low-cost thermal solution for these specific packages in multiple sizes. Our heatsink solutions can be attached to devices with adhesive thermal tape, making installation as seamless as possible. Custom heatsinks are available upon request.

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