Heat transfer plates are ideally and economically produced using our roll forming processes. Critical to home and industrial heating systems, PEX is fast becoming the chosen alternative to rigid metal tubing and heat transfer plates made by MP Metals are your best bet when increasing the efficiency of your heating systems. Read more...More Product Announcements from MP Metal Products
Zipper fins heat sinks are a great heat transfer solution. While Genie uses them in the simplest form, zipper fins have a wide range of application and design flexibility. Contact Boyd Design Engineers for assistance with your zipper fin heat sink design. Read more...More Product Announcements from Boyd Corporation
With heat issues limiting power device performance and growth, we have developed a derivative of our material branded as Pyroid® HT Pyrolytic Graphite material that offers heat spreaders and sink thermal conductivity up to 4 times (1700 W/m°K) that of copper at only a quarter of the weight. Read more...More Product Announcements from MINTEQ® International Inc, Pyrogenics Group
Ohmite now carries a line of heatsink solutions that are specifically designed for your BGA and PBGA applications. Ohmite's heatsinks provide a low-cost thermal solution for these specific packages in multiple sizes. Our heatsink solutions can be attached to devices with adhesive thermal tape, making installation as seamless as possible. Custom heatsinks are available upon request.More Product Announcements from Ohmite Manufacturing Co.
f you are using popular IXYS devices or the Ohmite CS10 series, look no further than the VR series extruded heatsinks to complete your design. Each heatsink is designed with a cam clips system ( Pat Pend) for these popular device types. The VR series also accomodates TO-220 and TO-247 devices. Remove the guess work involved for heatsink selection by choosing the VR series for your high w... Read more...More Product Announcements from Ohmite Manufacturing Co.
PYROID®HT Pyrolytic Graphite Thermal Management Material Heat Sink Application Read more...More Product Announcements from MINTEQ® International Inc, Pyrogenics Group
There are multiple high power heatsinkable devices on the market. Most if not all require pastes, materials, or grease between the heatsink and the device to meet its full potential. Turn to Ohmite for your Thermal Interface Material (TIM) solutions. Ohmite offers TIM's specifically cut to device footprints with no messy grease or paste. The Ohmite TIM's fill air voids and do not require... Read more...More Product Announcements from Ohmite Manufacturing Co.
In order to better satisfy our customers’ demand, it’s pleased to introduce you the latest Cooler series for AMD EPYC™ Embedded 3000 Processors: Read more...More Product Announcements from Rego Electronics Inc.