Product Announcements:
Fans and Electronic Cooling

The VC-90-90-3 vapor chamber offers superior thermal conductivity and heat distribution, ideal for electronics, telecommunications, automotive, and aerospace applications. Read more...

Our vapor chamber heatsinks, using patented technology, deliver superior thermal performance for electronics, LED lighting, and communication devices, preventing overheating and extending product lifespan. Read more...

3D Vapor Chamber (3DVC) delivers high thermal conductivity, low thermal resistance, and efficient 3D heat transfer for optical modules, electronics, telecom, automotive, and aerospace applications. Read more...

Manufactured from AL1060 aluminum using precision skiving technology, this skived fin heat sink delivers high thermal efficiency for photovoltaic inverters, energy storage PCS, and other high-power electronic applications. Read more...

Advanced thermal shields and cooling panels engineered for industrial heat protection, temperature control and energy efficiency. Custom pillow plate and liquid cooling solutions for furnaces, machinery and process systems. Read more...

Food grade tubular heat exchangers designed for hygienic processing of viscous, particulate, and sensitive fluids such as dairy, juice, sauces, and liquid foods. Ideal for high fouling applications where plate heat exchangers are not suitable. Read more...

Laser welded pillow plate heat exchanger for efficient heating and cooling of viscous, fouling, or corrosive fluids. Ideal for industrial tanks, wastewater treatment, food processing, and energy recovery systems. Read more...

AlSiC pin fin coolers deliver efficient heat dissipation for IGBT modules, combining high thermal conductivity and optimized airflow design to improve reliability and performance in high-power electronic systems. Read more...

Liquid cooling plates designed for Sunway CPUs provide efficient thermal management for data centers, HPC systems, and enterprise computing infrastructure. Read more...

High-performance heat dissipation materials for electronics, aerospace, and industrial applications. Includes diamond copper, diamond aluminum, and tungsten copper alloys for superior thermal conductivity and mechanical strength. Read more...