Product Announcements:
Wire Cutting Machines

SVI 250-80 is an ultra-large diamond wire saw designed for precision cutting of graphite, ceramics, and carbon-based materials, supporting both slicing and complex profile machining without cutting fluid. Read more...

Vimfun manufactures CNC diamond wire saws with endless diamond wire technology for precision cutting of glass, ceramics, gemstones, semiconductor materials, and other hard brittle materials. Read more...

The SG 15 desktop CNC diamond wire saw combines high-precision cutting, CNC automation, and endless diamond wire technology for processing hard and brittle materials in laboratory, research, and precision manufacturing applications. Read more...

SH200-R diamond wire saw enables high-speed, high-precision cutting of brittle materials such as quartz, featuring closed-loop wire technology for improved surface quality, reduced material loss, and stable performance in industrial processing applications. Read more...

Large-size diamond wire cutting machine enables high-speed, continuous cutting of oversized hard and brittle materials, delivering improved efficiency, precision, and surface quality for industrial and advanced material processing. Read more...

The SGSM 40 is a swinging diamond cutting system with adjustable oscillation, designed for fast, stable, and high-surface-quality cutting of superhard materials such as sapphire, quartz, and optical glass. Read more...

This optical glass cutting machine uses diamond wire technology to cut and slice brittle glass materials with stable motion and controlled kerf width. It is commonly used for optical glass blanks, research samples, and small batch production where edge quality and thickness consistency are important. Read more...

Compact four-axis CNC diamond wire saw for precision cutting of optical glass, ceramics, and brittle materials, ideal for labs, prototyping, and small-part processing. Read more...

High-precision diamond wire cutting machine for large graphite, ceramics, and carbon materials, with dual cutting systems and intelligent remote diagnostics for efficient, reliable production. Read more...

High-efficiency multi-wire cutting machine for wafer slicing, delivering low kerf loss, stable surface quality, and slurry-free processing for semiconductor and advanced material production. Read more...