Product Announcements:
Wire Cutting Machines

Vimfun manufactures CNC diamond wire saws with endless diamond wire technology for precision cutting of glass, ceramics, gemstones, semiconductor materials, and other hard brittle materials. Read more...

SVI 250-80 is an ultra-large diamond wire saw designed for precision cutting of graphite, ceramics, and carbon-based materials, supporting both slicing and complex profile machining without cutting fluid. Read more...

SGI 20 CNC diamond wire contour cutting machine for glass, sapphire, and silicon, enabling precise irregular-shape cutting with smooth surfaces and stable accuracy. Read more...

Precision diamond wire cutting machine for optical glass, sapphire, and ceramics, providing stable accuracy, smooth surfaces, and efficient processing for labs and production. Read more...

Compact lab wire saw for precise cutting of fragile crystals and substrates, featuring adjustable tension, flexible positioning, and low material loss for research and sample preparation. Read more...

The SVT 60-60 endless diamond wire saw enables precision cutting of cones, square tapers, internal holes, and complex contours in graphite, ceramics, composites, and other hard-to-machine materials. Combining multiple cutting functions in one platform, it delivers higher productivity and material utilization than conventional cutting methods. Read more...

Designed for semiconductor graphite cutting, this diamond wire saw uses an endless, one-way diamond wire to provide stable cutting forces and a narrow kerf. The continuous loop motion helps reduce vibration, edge chipping, and material loss, making it suitable for slicing and contour cutting of high-purity and isostatic graphite components. Read more...

High-precision diamond wire cutting machine for large graphite, ceramics, and carbon materials, featuring dual cutting systems and intelligent remote diagnostics for efficient, reliable operations. Read more...

Graphite wire saws are ideal for quickly and easily cutting graphite rods, sheets, and blocks. Read more...

High-efficiency multi-wire cutting machine for semiconductor wafers and advanced materials, offering low kerf loss, stable surface quality, and slurry-free precision slicing. Read more...