Product Announcements:
Fluxes

Indium Corporation^® has introduced NC-809, a new halogen-free, ultra-low residue, flip-chip flux. Engineered with high-tack characteristics, NC-809 is designed to hold die or solder spheres in place without risk of die shift during the assembly process. Read more...

Indium Corporation has expanded its flux portfolio with a new liquid flux designed to meet process needs for low-temperature flip-chip applications. Read more...

Indium Corporation continues to expand its flux portfolio with WS-823—a proven, one-step ball grid array (BGA) ball-attach flux designed to eliminate the costly and warpage-inducing prefluxing step, especially on Cu-OSP substrate. Read more...

Indium Corporation has expanded its flux portfolio with a robust flux designed to provide a simple solution to complicated applications, especially those with a single cleaning step for both BGA ball-attach and flip-chip processes. Read more...

Fluxes and solder pastes are specially engineered materials formulated with various applications in mind. The differences in the chemical formulations are such so that specific characteristics of a flux or solder paste can be achieved. You may require ultra-low or near zero residue amounts after reflow, or an enhanced oxygen barrier formulation. Read more...

Flip-Chip Flux WS-688 is a halogen-free water-soluble dipping flux suitable for use with both eutectic, tin, & tin-silver solder bumps & copper-pillar microbumps. It is designed to be useful in high temperature application environments, such as thermocompression bonding. Indium Corporation will introduce Flip-Chip Flux WS-688 at Semicon West, July 10-12, in San Francisco Read more...

Indium Corp. - Solder joint voiding is tough to deal with. When attaching components, such as power amplifiers/transistors or QFNs, the larger the footprint the bigger the challenge. For some time now I have been suggesting the use of a preform with flux coating as an approach to help reduce voiding. Logically, if you introduce less flux you entrap less... Read more...