Indium Corporation

Indium Corporation has expanded its flux portfolio with a robust flux designed to provide a simple solution to complicated applications, especially those with a single cleaning step for both BGA ball-attach and flip-chip processes. Read more...

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Indium Corporation

Fluxes and solder pastes are specially engineered materials formulated with various applications in mind. The differences in the chemical formulations are such so that specific characteristics of a flux or solder paste can be achieved. You may require ultra-low or near zero residue amounts after reflow, or an enhanced oxygen barrier formulation. Read more...

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Indium Corporation

Flip-Chip Flux WS-688 is a halogen-free water-soluble dipping flux suitable for use with both eutectic, tin, & tin-silver solder bumps & copper-pillar microbumps. It is designed to be useful in high temperature application environments, such as thermocompression bonding. Indium Corporation will introduce Flip-Chip Flux WS-688 at Semicon West, July 10-12, in San Francisco Read more...

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Indium Corporation

Indium Corp. - Solder joint voiding is tough to deal with. When attaching components, such as power amplifiers/transistors or QFNs, the larger the footprint the bigger the challenge. For some time now I have been suggesting the use of a preform with flux coating as an approach to help reduce voiding. Logically, if you introduce less flux you entrap less... Read more...

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