Indium Corporation

Flip-Chip Flux WS-688 is a halogen-free water-soluble dipping flux suitable for use with both eutectic, tin, & tin-silver solder bumps & copper-pillar microbumps. It is designed to be useful in high temperature application environments, such as thermocompression bonding. Indium Corporation will introduce Flip-Chip Flux WS-688 at Semicon West, July 10-12, in San Francisco Read more...

More Product Announcements from Indium Corporation
Alpha Assembly Solutions

No-clean, water soluble, low VOC, halogen-free fluxes meet the challenges of both tin-lead and lead-free processes. Read more...

More Product Announcements from Alpha Assembly Solutions
Indium Corporation

Indium Corporation - Since the NanoBond®process is almost instantaneous, fluxes are not used. (They just don’t have enough time to heat up to their activation temperature and remove oxides.) So, because this is a fluxless soldering application, surface choice and preparation become very important. Read this article in the series on Nanofoil® thin... Read more...

More Product Announcements from Indium Corporation
Alpha Assembly Solutions

ALPHA® EF 2100VOC-Free, Halide-Free Flux Designed to Meet Current REACH and RoHS Legislation Read more...

More Product Announcements from Alpha Assembly Solutions
Indium Corporation

Indium Corp. - Solder joint voiding is tough to deal with. When attaching components, such as power amplifiers/transistors or QFNs, the larger the footprint the bigger the challenge. For some time now I have been suggesting the use of a preform with flux coating as an approach to help reduce voiding. Logically, if you introduce less flux you entrap less... Read more...

More Product Announcements from Indium Corporation
Indium Corporation

Indium Corporation - The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping tray. Solder spheres (solder balls) are then placed into the deposits and the whole assembly is reflowed. BGA fluxes are usually water soluble, while PGA fluxes are often very reactive no-clean materials. Read more...

More Product Announcements from Indium Corporation