ALPHA® OM-377 is a no-clean solder paste engineered for ultra-fine feature printing in advanced electronics assemblies. Designed to support long-term electrochemical reliability, the formulation helps manufacturers reduce warpage-induced defects and improve process consistency as component geometries continue to shrink. (read more)

MacDermid Alpha Electronics Solutions will showcase advanced attach material solutions at PCIM Europe 2026 designed to address reliability and manufacturing challenges in next-generation power electronics. Featuring ALPHA® Argomax® sintering materials and ALPHA® TrueHeight® solder preforms, these solutions support thermal performance, process control, and high-volume manu... (read more)

MacDermid Alpha Electronics Solutions will debut ATROX^® CD 560-1, a zero-PFAS conductive die attach paste, at SEMICON Southeast Asia 2026, May 5–7, in Kuala Lumpur, Booth 2423. (read more)

MacDermid Alpha Electronics Solutions, a business of Element Solutions Inc, is pleased to announce that Dr. Ravi Bhatkal, Vice President of Strategy, has been elected Vice Chairman of the Board of Directors of the International Electronics Manufacturing Initiative (INEMI).

Bhatkal was elected as part of INEMI’s 2026 Board of Directors and will serve alongside the consortium

Affinity™ Flex is a cyanide-free ENIG process developed to improve the reliability of flex and rigid-flex PCBs while supporting safer, more sustainable manufacturing. Installed at Shenzhen Moker in China, the technology helps reduce cracking, copper damage, and open-circuit risk in increasingly thin, high-density PCB designs. (read more)

MacDermid Alpha Electronics Solutions will showcase how integrated materials strategies across soldering, die attach, thermal management, and protection can strengthen reliability, improve process stability, and advance sustainability. Visit us at Productronica China 2026 to explore solutions for EV, automotive, consumer, and high-performance computing applications.... (read more)

Element Solutions Inc (ESI) announced the completion of its acquisition of the Micromax conductive pastes and inks business, effective February 2, 2026. Micromax will operate within MacDermid Alpha Electronics Solutions, part of ESI’s Electronics segment. (read more)

Master the complete screen making process for screen printing with the Autotype® How to Guide Series from MacDermid Alpha Electronics Solutions. This 11-part resource delivers practical steps to help you design a contamination-free workflow, improve efficiency, and achieve consistent, high-quality results. (read more)

The award-winning NOVAFAB Fine Grain Copper represents the latest innovation in our Fine Grain portfolio, designed to address key challenges in heterogeneous integration and hybrid bonding. (read more)

MacDermid Alpha Electronics Solutions, a global leader in chemicals and materials for electronic manufacturing, today announced the opening of its expanded laboratory in Bangkok, Thailand. (read more)

Macdermid Alpha has been awarded for innovation: driving process optimization and efficiency with major Indian EMS provider. (read more)

Discover why material selection—not just design—is the key to long-term electronics reliability. (read more)

As the demand for faster, smaller, and more energy-efficient devices grows, the semiconductor industry is under increasing pressure to innovate—not just for performance, but for sustainability.

This article dives into the cutting-edge materials and manufacturing strategies that are enabling next-generation chips while reducing environmental impact. (read more)

MacDermid Alpha Electronics Solutions Expands Singapore Production Facility to Meet Growing Global Demand for Argomax^® Silver Sintering Paste. (read more)

MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is delighted to introduce Shadow^® Plus. This ultra-stable, graphite-based direct metallization technology addresses the automotive and electronics industries’ need for increased functionality and reliability... (read more)

In an era where high-performance and sustainable manufacturing practices are crucial, MacDermid Alpha Electronics Solutions is redefining industry standards with the launch of ALPHA® HiTech® CF31-4026. (read more)

MacDermid Alpha Electronics Solutions, a global leader in integrated technologies and materials for the electronics and automotive industries presents its latest innovation, XtraForm 3D Matt. (read more)

MacDermid Alpha has unveiled its latest formable hardcoated film, XtraForm^® 3D Matt, which offers a highly durable matt finish with a softer, luxury appearance, with a velvety smooth touch and feel.

This expands the portfolio of deep-formable hardcoated XtraForm films for automotive interiors. (read more)

Clark Dai, one of MacDermid Alpha’s EV Technology market managers, explores market technologies and the automotive sector, while highlighting the role our products play in supporting the critical needs of the industry. He delves into its applications, benefits, and the transformative impact, propelling OEMs into a new era of technological excellence. (read more)

Semiconductor fabricators are looking for solutions that deliver high performance and enhanced reliability for advanced packages. MacDermid Alpha's MICROFAB SC-40 PLUS next-generation acid copper electroplating process represents a leap forward in semiconductor manufacturing, providing fabricators with a transformative solution that combines precision, efficiency, and ease of use. (read more)

To address these rapidly growing reliability demands of complex circuit board assemblies, MacDermid Alpha is excited to introduce new technologies to the market. (read more)

With rapid advancements in automotive technology, the pursuit of solutions that enhance performance, reliability, and efficiency for electric vehicles (EVs) is constant. Innovative technology, introduced to the market by MacDermid Alpha Electronics Solutions, offers enhanced performance for EVs and contributes to the creation of more sustainable and environmentally safe automotive systems. (read more)

In the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. We are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies. (read more)

MacDermid Alpha Electronics Solutions Launches MICROFAB TS-650 NXG for the growing requirements of the Wafer Level Packaging industry. Designed with enhanced uniformity to meet the semiconductor industry's demand for precision, reliability, and performance. (read more)

Introducing a new packaging option for the ALPHA Argomax sinter paste that allows customers more manufacturing options, enables the facilitation of high-volume implementation and supports customer needs for automatic sinter paste dispensing on a stencil. (read more)

MacDermid Alpha Electronics Solutions announces the launch of ALPHA HiTech AD13-9910B ultra-low temperature adhesive, designed to mitigate defects on very temperature sensitive parts and substrates. (read more)

With rapid advancements in automotive electronics technology, the pursuit of solutions that enhance performance, reliability, and efficiency is constant. Silver sintering has emerged as a pioneering technology, revolutionizing the manufacturing processes within the automotive industry. (read more)

MacDermid Alpha Electronics Solutions introduces ALPHA^® SF828-MBB. Designed for soldering small surface areas of wire and delivering excellent peel force and high machine cleanliness, this is our latest liquid flux for the photovoltaic market. (read more)

ALPHA OM-362 is the next-generation ultra-low voiding solder paste. This lead-free, zero-halogen, no-clean paste can deliver less than 10% voiding on Bottom Termination Components (BTCs). Low-voiding solder pastes are an important material in improving board level reliability by reducing this effect. (read more)

IC substrates: critical interfaces between the semiconductor chip and the printed circuit board. (read more)

A full portfolio of acid copper products that meet all applications, from ultra aspect ratio conformal plating down to filling the smallest blind microvias. (read more)

MacDermid Alpha Electronics Solutions announces the release of ALPHA HRL3 Solder Sphere, a lead-free, high reliability, low temperature alloy for ball mount applications. (read more)

ALPHA OM-565 is a zero-halogen, low temperature flux chemistry, developed specifically for the HRL3 alloy to enable target peak reflow of 175 °C for minimized warpage induced defects and enhanced product reliability compared to existing low temperature solutions. (read more)

MacDermid Alpha Electronics Solutions, announces the release of CircuEtch 300, a high performance anisotropic final etch for circuit formation in Semi-Additive and modified-Semi-Additive processes (SAP/mSAP) utilized in IC substrate and substrate-like HDI manufacturing. (read more)

ALPHA OM-220 is a new, ultra-low temperature solder paste paired with ALPHA ULT1 alloy for soldering of temperature-sensitive components and substrates. This innovative chemistry enables peak reflow temperatures below 150°C, making it ideal for soldering heat sensitive components and sub-assemblies. (read more)

MacDermid Alpha Electronics Solutions, a global leader in specialty materials for electronics, announces the release of MacuSpec VF-TH 300, a new addition to the award-winning VF-TH series electroplating processes widely utilized in mSAP HDI manufacturing.

As the 5G standard is growing outward from the highest tier smartphones, board manufacturers of these devices need to increase... (read more)

MacDermid Alpha has high reliability material solutions for electronic assemblies used in a broad range of 5G related equipment; from wearable and handheld mobile devices to antennas and high speed infrastructure hardware. Download new brochure. (read more)

ALPHA^® tensoRED^® Master Tensioning Frame is the latest development in Alpha’s stencil range of state-of-the-art printing stencils. ALPHA^® tensoRED^® has been designed to reduce the total cost of ownership of stencils compared to other systems by creating tension without the need of air pressure being applied to t... (read more)

ALPHA^® Exactalloy^® Preforms in tape and reel packaging are used with solder paste to selectively increase solder volume using standard pick and place equipment.

The preform is placed directly into the solder paste prior to assembly reflow. Alpha Solder Preform Tape & Reel packaging provides you with a time-to-market advantage, solving y... (read more)

MacDermid Alpha Electronics Solutions has released Systek UVF 100, a single step micro via filling and fine line plating process for 2 in 1 RDL applications. This product is part of the larger Systek family of IC Substrate manufacturing solutions. (read more)

Our Surface Preparation Solutions for both innerlayer and outerlayer cleaning address the challenges confronted by PCB fabricators, including the complex processing of increased layer counts, as well as the demands posed by harsh mechanical cleaning methods. (read more)

Alpha® offers a full line of technologically advanced solder pastes developed to provide high throughput and yield, and lowest cost of ownership for a wide range of applications. (read more)

Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, has recently introduced ALPHA^® AccuFlux™ BTC-578 Solder Preforms, designed to enhance reliability and heat transfer through the reduction of voiding under bottom termination components (BTC). (read more)

Alpha is extremely well positioned for the growing trend towards increased electrification of the automotive powertrain, enabling the highest efficiency power electronics, while achieving a reduced form factor, lower cost and an unprecedented increase in reliability. (read more)

Alpha advances automotive electronics technology - Our goal is to help you improve automotive electronics reliability and reduce your warranty costs. (read more)

MacuSpec THF 100 is a single step copper through hole filling process that enables improved thermal and structural designs for IC substrates. (read more)

ALPHA^® TrueHeight™ Spacer Blocks are burr free, non-collapse copper discs coated with a barrier layer of nickel, and finish coated with flash gold. TrueHeight™ Spacer Blocks are designed to be automatically placed and reflowed onto a printed circuit board pad printed with a nominal amount of solder paste. (read more)

ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg & low CTE underfill with excellent reliability. It also has a good thermal cycling performance because of its low Coefficient of Thermal Expansion. (read more)