MacDermid Alpha Electronics Solutions, a leader in integrated technologies and materials for the electronics industry, will showcase its advanced solutions for die, package, and top-side attach at PCIM Asia. Held at the Shenzhen World Exhibition & Convention Center, August 28 to 30, MacDermid Alpha’s expertise and product portfolio will be on display in Hall 11, Booth F14. (read more)

MacDermid Alpha has unveiled its latest formable hardcoated film, XtraForm^® 3D Matt, which offers a highly durable matt finish with a softer, luxury appearance, with a velvety smooth touch and feel.

This expands the portfolio of deep-formable hardcoated XtraForm films for automotive interiors. (read more)

Clark Dai, one of MacDermid Alpha’s EV Technology market managers, explores market technologies and the automotive sector, while highlighting the role our products play in supporting the critical needs of the industry. He delves into its applications, benefits, and the transformative impact, propelling OEMs into a new era of technological excellence. (read more)

Join us on Thursday, June 27th, 3034 at 9AM EST for our exclusive webinar, "Driving Confidence: Overcoming Reliability Challenges in Vehicle Safety Electronics" where we will discuss the latest advancements in semiconductor packaging, exploring innovative materials and solutions that improve board-level reliability, thermomechanical resilience, and electrochemical performance. (read more)

Semiconductor fabricators are looking for solutions that deliver high performance and enhanced reliability for advanced packages. MacDermid Alpha's MICROFAB SC-40 PLUS next-generation acid copper electroplating process represents a leap forward in semiconductor manufacturing, providing fabricators with a transformative solution that combines precision, efficiency, and ease of use. (read more)

MacDermid Alpha Electronics Solutions, a leader in integrated technologies and materials for the electronics industry, showcased advanced solutions for die, package, and top-side attach at PCIM Europe.

Argomax^® AccuLam™, a breakthrough product for silver sintering, that delivers both higher throughput and larger area lamination compatibility, was be highlighted. (read more)

To address these rapidly growing reliability demands of complex circuit board assemblies, MacDermid Alpha is excited to introduce new technologies to the market. (read more)

With rapid advancements in automotive technology, the pursuit of solutions that enhance performance, reliability, and efficiency for electric vehicles (EVs) is constant. Innovative technology, introduced to the market by MacDermid Alpha Electronics Solutions, offers enhanced performance for EVs and contributes to the creation of more sustainable and environmentally safe automotive systems. (read more)

In the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. We are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies. (read more)

A supplier of PCB boards recently experienced hotspots on PCB assemblies for on-board chargers. Read this case study to learn how MacDermid Alpha worked with the manufacturer to achieve the most efficient production process. (read more)

MacDermid Alpha Electronics Solutions Launches MICROFAB TS-650 NXG for the growing requirements of the Wafer Level Packaging industry. Designed with enhanced uniformity to meet the semiconductor industry's demand for precision, reliability, and performance. (read more)

Introducing a new packaging option for the ALPHA Argomax sinter paste that allows customers more manufacturing options, enables the facilitation of high-volume implementation and supports customer needs for automatic sinter paste dispensing on a stencil. (read more)

MacDermid Alpha Electronics Solutions announces the launch of ALPHA HiTech AD13-9910B ultra-low temperature adhesive, designed to mitigate defects on very temperature sensitive parts and substrates. (read more)

Supply chain management plays a crucial role in meeting the demand for printed circuit boards (PCBs) in today’s global electronics marketplace. Many complex logistical issues must be considered when developing a robust supply chain strategy. From labor costs and lead times to geopolitical tensions and environmental impacts, the challenges are numerous. (read more)

With rapid advancements in automotive electronics technology, the pursuit of solutions that enhance performance, reliability, and efficiency is constant. Silver sintering has emerged as a pioneering technology, revolutionizing the manufacturing processes within the automotive industry. (read more)

MacDermid Alpha Electronics Solutions introduces ALPHA^® SF828-MBB. Designed for soldering small surface areas of wire and delivering excellent peel force and high machine cleanliness, this is our latest liquid flux for the photovoltaic market. (read more)

ALPHA OM-362 is the next-generation ultra-low voiding solder paste. This lead-free, zero-halogen, no-clean paste can deliver less than 10% voiding on Bottom Termination Components (BTCs). Low-voiding solder pastes are an important material in improving board level reliability by reducing this effect. (read more)

IC substrates: critical interfaces between the semiconductor chip and the printed circuit board. (read more)

A full portfolio of acid copper products that meet all applications, from ultra aspect ratio conformal plating down to filling the smallest blind microvias. (read more)

MacDermid Alpha Electronics Solutions announces the release of ALPHA HRL3 Solder Sphere, a lead-free, high reliability, low temperature alloy for ball mount applications. (read more)

ALPHA OM-565 is a zero-halogen, low temperature flux chemistry, developed specifically for the HRL3 alloy to enable target peak reflow of 175 °C for minimized warpage induced defects and enhanced product reliability compared to existing low temperature solutions. (read more)

MacDermid Alpha Electronics Solutions, announces the release of CircuEtch 300, a high performance anisotropic final etch for circuit formation in Semi-Additive and modified-Semi-Additive processes (SAP/mSAP) utilized in IC substrate and substrate-like HDI manufacturing. (read more)

ALPHA OM-220 is a new, ultra-low temperature solder paste paired with ALPHA ULT1 alloy for soldering of temperature-sensitive components and substrates. This innovative chemistry enables peak reflow temperatures below 150°C, making it ideal for soldering heat sensitive components and sub-assemblies. (read more)

MacDermid Alpha Electronics Solutions, a global leader in specialty materials for electronics, announces the release of MacuSpec VF-TH 300, a new addition to the award-winning VF-TH series electroplating processes widely utilized in mSAP HDI manufacturing.

As the 5G standard is growing outward from the highest tier smartphones, board manufacturers of these devices need to increase... (read more)

MacDermid Alpha has high reliability material solutions for electronic assemblies used in a broad range of 5G related equipment; from wearable and handheld mobile devices to antennas and high speed infrastructure hardware. Download new brochure. (read more)

ALPHA^® tensoRED^® Master Tensioning Frame is the latest development in Alpha’s stencil range of state-of-the-art printing stencils. ALPHA^® tensoRED^® has been designed to reduce the total cost of ownership of stencils compared to other systems by creating tension without the need of air pressure being applied to t... (read more)

ALPHA^® Exactalloy^® Preforms in tape and reel packaging are used with solder paste to selectively increase solder volume using standard pick and place equipment.

The preform is placed directly into the solder paste prior to assembly reflow. Alpha Solder Preform Tape & Reel packaging provides you with a time-to-market advantage, solving y... (read more)

MacDermid Alpha Electronics Solutions has released Systek UVF 100, a single step micro via filling and fine line plating process for 2 in 1 RDL applications. This product is part of the larger Systek family of IC Substrate manufacturing solutions. (read more)

Our Surface Preparation Solutions for both innerlayer and outerlayer cleaning address the challenges confronted by PCB fabricators, including the complex processing of increased layer counts, as well as the demands posed by harsh mechanical cleaning methods. (read more)

Alpha® offers a full line of technologically advanced solder pastes developed to provide high throughput and yield, and lowest cost of ownership for a wide range of applications. (read more)

The UltraStrip product line represents our most advanced, high-performance photoresist strippers. UltraStrip formulas have been optimized for over 50 different resists on the market today. The UltraStrip RS-215 Resist Stripping System is designed to strip fully-aqueous dry film photoresists from printed circuit boards. (read more)

Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, has recently introduced ALPHA^® AccuFlux™ BTC-578 Solder Preforms, designed to enhance reliability and heat transfer through the reduction of voiding under bottom termination components (BTC). (read more)

Alpha is extremely well positioned for the growing trend towards increased electrification of the automotive powertrain, enabling the highest efficiency power electronics, while achieving a reduced form factor, lower cost and an unprecedented increase in reliability. (read more)

Alpha advances automotive electronics technology - Our goal is to help you improve automotive electronics reliability and reduce your warranty costs. (read more)

MacuSpec THF 100 is a single step copper through hole filling process that enables improved thermal and structural designs for IC substrates. (read more)

ALPHA^® TrueHeight™ Spacer Blocks are burr free, non-collapse copper discs coated with a barrier layer of nickel, and finish coated with flash gold. TrueHeight™ Spacer Blocks are designed to be automatically placed and reflowed onto a printed circuit board pad printed with a nominal amount of solder paste. (read more)

ALPHA HiTech CU21-3240 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a high Tg & low CTE underfill with excellent reliability. It also has a good thermal cycling performance because of its low Coefficient of Thermal Expansion. (read more)

ALPHA OM-372 is designed for superior performance on assemblies with ultra-fine pitch components requiring excellent stencil transfer efficiency and high electrical reliability, such as those found in mobile and wearables, computing, and medical assemblies. (read more)