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Discover the innovative solutions available to optimize your PCB assemblies to provide the performance for today''s rapidly changing electronics landscape.
MacDermid Alpha offers: Innovative High Performance Lead-Free Alloys Cutting edge low temperature assembly solutions Solder Paste & Preforms for Harsh Environments Adhesives, Underfills, & Edgebond for increased reliability Proven capabilities to increase sustainability

MacDermid Alpha Electronics Solutions has the advantage of an integrated product offering combined with cross-functional solutions in the circuitry, assembly, and semiconductor segments of the electronics industry. We believe having a strong foothold in every step of the electronics supply chain is crucial to our ability to help our customers succeed.

ALPHA Exactalloy Preforms provide a time-to-market advantage, solving your solder volume issues during assembly verification. These preforms are designed to overcome these solder deficiencies, enhancing the solder joint strength and reliability.

Phil Kinner, Global Technology Director for Electrolube, discussed latest trends for Electrolube solutions and products.

ALPHA OM-565 HRL3 low temperature solder paste is designed to mitigate warpage induced defects in temperature sensitive chip-scale packages. The solder paste enables peak reflow temperatures of 175 °C and superior wettability to minimize post reflow defects such as Non-Wet-Open (NWO) and Head-in-Pillow (HIP).

The ALPHA OM-565 chemistry enhances electrochemical performance over existing low melt point solders and provides excellent compatibility when used in combination with alternative ALPHA solutions for contact rework applications.

EMSNow discusses the applications and advantages of low temperature solder with Paul Salerno, Global Portfolio Manager, MacDermid Alpha. These advanced solder formulas reduce defects and enable new packaging configurations. They also satisfy the requirements of corporate sustainability initiatives to reduce energy use in the SMT process. The two discuss these and other innovations in solder paste technology.