This lead-free, zero-halogen, no-clean paste can deliver less than 10% voiding on Bottom Termination Components (BTCs). The design characteristics of BTCs create void removal challenges during the soldering process, which can lead to ineffective thermal dissipation and mechanical strength in post-reflow applications. Low-voiding solder pastes are an important material in improving board level reliability by reducing this effect.   

ALPHA OM-362 complies with the IPC Class III for voiding on BGA components.

• Ultra-Low voiding performance
• Excellent electromigration characteristics
• Good coalescence and wetting performance
• Excellent solder joint and flux residue cosmetics
• Zero-halogen, No halogens intentionally added

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