A full portfolio of acid copper products that meet all applications, from ultra aspect ratio conformal plating down to filling the smallest blind microvias.

Production Proven Processes

Our through hole filling can improve thermal conductivity and enhance structural integrity of advanced designs. Plating high aspect ratio through holes, conformal plated blind microvias, stacked filled vias, and filling through holes for high density interconnect technology are just some of the challenges of PCB manufacturing environment. The reliability of these constructions is only as good as the copper plating within them. Today’s requirements call for higher standards of mechanical properties, process control and flexibility.

Electrolytic Copper for IC Substrates

Within the metallization offering for the IC substrate market, the MacDermid Enthone brand has industry proven electrolytic copper processes. The Systek™ UVF Series is specifically designed for the 2 in 1 RDL plating of IC substrate features. The system can fill blind microvias and X-vias while also plating fine lines, pads, and other surface features with high coplanarity and low trace profiles. The Systek THF Series are copper through hole filling metallization processes that can plate solid copper through hole structures in a wide range of substrate thicknesses and hole sizes. Systek ETS is an advanced DC acid copper pattern plating process specifically formulated to plate fine lines and pads in embedded trace substrates. To learn more visit our Copper Electroplating for IC Substrates page.