Product Announcements:
Manufacturing and Process Equipment

High-efficiency multi-wire cutting machine for wafer slicing, delivering low kerf loss, stable surface quality, and slurry-free processing for semiconductor and advanced material production. Read more...

Large-size diamond wire cutting machine enables high-speed, continuous cutting of oversized hard and brittle materials, delivering improved efficiency, precision, and surface quality for industrial and advanced material processing. Read more...

SH200-R diamond wire saw enables high-speed, high-precision cutting of brittle materials such as quartz, featuring closed-loop wire technology for improved surface quality, reduced material loss, and stable performance in industrial processing applications. Read more...

The SG 15 desktop CNC diamond wire saw combines high-precision cutting, CNC automation, and endless diamond wire technology for processing hard and brittle materials in laboratory, research, and precision manufacturing applications. Read more...

Lithium fluoride is a tetragonal crystal system, the crystal growth can be single polycrystalline blocks or directional growth of single crystals.

Polycrystalline lithium fluoride is mostly used as protective windows; monocrystalline lithium fluoride is suitable for lenses, prisms and observation windows. Read more...

Vimfun manufactures precision diamond wire saws with high accuracy, low material loss, and efficient cutting performance for silicon, glass, sapphire, quartz, jade, and other hard brittle materials. Read more...

Innovacera’s high-voltage shielded vacuum feedthrough is a dedicated through-wall electrode designed for vacuum chamber power transmission. Read more...

High-precision ceramic chuck with precision-machined ring groove patterns for wafer clamping and backside gas cooling. Available in alumina and silicon carbide. Compatible with 150-300mm wafer etch, CVD, and PVD chambers. Read more...

Alumina and silicon carbide ceramic end effectors for semiconductor wafer handling in cleanroom and vacuum environments. Lightweight, high stiffness, wear-resistant surface. Compatible with 150-300mm wafer transfer robots. No outgassing, no particle generation. Read more...

Air bearing positioning tables with zero friction, no wear, and sub-micron accuracy. Used in wafer inspection, precision metrology, and laser processing. Travel range up to 1200mm per axis, load capacity up to 100 kg. Read more...