Fuji Electric Corp. of America

Fuji Electric has developed a compact high capacity intelligent power module (IPM) which is ideally suited for larg capacity air conditioning systems, industrial inverters, and servo systems. Read more...

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Fuji Electric Corp. of America

The IPM and specifically the DIP-IPM has gained a lot of market acceptance in applications where size and performance are a design metrics. In a package that’s about an inch wide by a little less than two inches long by about a quarter of an inch thick it really greatly reduces the footprint. Read more...

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Fuji Electric Corp. of America

Fuji Electric provides Power Semiconductors enabling high-efficiency energy usage in various fields such as industrial machinery, automobile, railroad, social infrastructure, renewable energy, consumer electronics and information equipment in order to achieve decarbonized society. Read more...

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Fuji Electric Corp. of America

Fuji Electric is a global manufacturer and supplier of IGBT modules, inverters, and power semiconductor products for a variety of industrial applications. Read more...

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ROHM Semiconductor GmbH

New 600V IGBT IPMs Deliver Class-Leading Low Noise with Low Loss

Reducing power consumption and design load in compact industrial equipment and home appliances Read more...

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Fuji Electric Corp. of America

Fuji Electric’s Discrete IGBTs are used in applications such as UPS, power conditioning subsystems, communication equipment, servers, and EV chargers Read more...

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Infineon Technologies AG

In standard through-hole packages, as for instance TO-220 or TO-247, each lead pad resembles a parasitic inductance. The TO-247 4pin package has an extra Kelvin emitter connection. This 4pin known also as Kelvin emitter terminal, bypasses the emitter lead inductance on the gate control loop, enhancing the IGBT's switching speed and decreasing the switching energy. Read more...

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Infineon Technologies AG

Highest current density up to 75 A 1200 V IGBT or 120 A 600 V IGBT copacked with a diode in TO-247 footprint, 20% lower Rth(jh), 15% better heat dissipation, fast clip assembly. Read more...

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