Nexperia is proud to introduce application-specific MOSFETs with enhanced dynamic current sharing. Offering up to 50% lower current delta between parallel devices, a tighter VGS(th) window, and low RDS(on). (read more)

Nexperia today announced the launch of their new AEC-Q101 qualified 100 V MOSFETs, in compact CCPAK1212 (12 x 12 mm) copper-clip packaging. These devices deliver ultra-low conduction losses with on-resistance (R_DS(on)) as low as 0.99 mΩ, and enable safe current above 460 A. (read more)

Nexperia today introduced its first portfolio of 40-100 V automotive MOSFETs in industry standard micro-lead packages designed for use in body control, infotainment, reverse battery protection and LED lighting applications. (read more)

Nexperia extend the 650 V IGBT portfolio with the release of 15 & 30 A discrete IGBTs in TO220-FP & D2PAK packages. (read more)

The Nexperia new Motor Driver Evaluation Kit is now available. Developed with Würth Electronics, it gives engineers a quick, practical way to test Nexperia MOSFETs & gate drivers in motor applications. The board is ready to use out of the box, reducing setup time & simplifying performance comparisons. (read more)

60 V MLPAK33 MOSFETs, enhancing the power MOSFET portfolio with high-performance, cost-effective, devices for high-volume applications such as chargers, battery management systems (BMS), and power supplies. (read more)

80/100 V AEC-Q101 leaded (LFPAK) trench MOSFETs, for low-power 48 V automotive applications, such as fuel injectors & LED lighting. Housed in robust copper-clip LFPAK packages, they deliver the ideal balance of efficiency & performance in high-frequency, low-power 48 V applications. (read more)

Nexperia today announced the launch of 16 new 80 V and 100 V power MOSFETs in the innovative copper-clip CCPAK1212 package, delivering industry-leading power density and outright performance. (read more)

Nexperia is proud to announce the release of our next-generation AEC-Q101 80 V trench MOSFET technology, featuring ultra-low R_DS(on) for high-power 48 V automotive applications. Housed in robust copper-clip leaded packages, this portfolio is designed to meet the growing demand for power efficiency in automotive systems. (read more)

Single and dual footprints offer superior thermal performance than
legacy packages (read more)

Optimized for low RDSon, low spiking and high efficiency in switching applications (read more)

Stay ahead in the dynamic collaborative robot and robotics industry by integrating reliability and efficiency in your motor control applications. Find the ideal MOSFET for your device by using the simple MOSFETS selector tool for BLDC motor drives. (read more)

Short explanation video (3:35min) that shows how Nexperia's 200 V high-end hyperfast PNE series can make the difference in switch-mode power supplies by demonstrating the diodes’ performance in a DC-DC-converter. (read more)

Nexperia, the essential semiconductor expert, today announced the release of next-generation interactive datasheets to accompany. By manipulating interactive sliders within the datasheets, users can manually adjust the voltage, current, temperature and other conditions for their circuit application and watch how the operating point of a device dynamically responds to these changes. (read more)

Nexperia’s Logic Application Handbook provides a better understanding of Logic products, their features and properties, timing and interfacing aspects as well as get an overview of application insights. (read more)

You are invited to the second session of Nexperia’s Power Rectifier Webinar Series on June 14th, 10:00AM CET and 5:00PM CET, where Nexperia will explain the importance of the power rectifier in switching applications, like a DCDC converter. (read more)

Short explanation video (4:04min) that shows how Nexperia's high power Bipolar Junction Transistors (BJT) are utilized as a high voltage current source in an LED lighting application. (read more)

Bringing 20 years’ expertise in high-quality, robust SMD packaging to the GaN FET portfolio, adopting proven technology to give industry-leading performance. CCPAK's copper-clip cascode design optimizes electrical and thermal performance, improves device reliability and reduces parasitic losses. Offered in both top-side (CCPAK1212i) and bottom-side cooled (CCPAK1212) package designs. (read more)

Nexperia's new portfolio includes two ≤ 150 V rated devices in WLCSP8 and FCLGA packages, as well as five 650 V rated devices, with R_DS(on) values between 80 mΩ - 190 mΩ, in a choice of DFN 5x6 mm and DFN 8x8 mm packages. (read more)

Nexperia introduces the first application-specific MOSFETs (ASFETs) for hotswap in SMD copper-clip LFPAK88 packaging for 60% reduced footprint. (read more)

This article discusses various automotive Ethernet standards before considering the stringent electrostatic protection (ESD) and electromagnetic compatibility (EMC) standards they are required to comply with. Finally, it presents a range of components from Nexperia which automotive OEMs can use to ensure that vehicle networks are fully protected against ESD events. (read more)

New Nexperia 600 V IGBTs. Ideally suited for industrial motor drive applications, including industrial motor drives like servo motors, robotics, elevators, operating grippers, in-line manufacturing, power inverters, UPS, photovoltaic strings, EV-charging, and induction heating and welding. The portfolio leads with devices across 30 - 75 A. (read more)

Short explanation video (2:56min) about best practices for performing surge tests and the importance of the clamping voltage for system-level robustness. (read more)

Short explanation video (1:31min) about what capacitance matching is and why it is important to ESD. (read more)

Nexperia's smallest MOSFET package at 0.63 x 0.33 x 0.25 mm. Featuring best-in-class low R_DS(on) ideal for the most stringent space constrained applications, such as smart watches, hearing aids, fitness trackers and many more mobile applications (read more)

Announcing the launch of 50/55 V ASFETs for 36 V DC motors. The 50/55V ASFET range now offers products in the highly robust LFPAK56E and LFPAK88 packages. Allowing for industry leading continuos current capability of 410 A, optimised SOA of 8.1 A and the extremely rugged avalanche rating of 7400 mJ, making LFPAK88 the perfect fit in the ever demanding 36 V motor application space. (read more)

This handbook provides useful guidance on common topics and issues that the design engineer is likely to encounter. Engineers interested in thermal properties, packaging, reliability, and applications will gain practical insights. The handbook is intended as a ‘go-to’ reference, for those looking for technical information, fundamentals and design ideas. (read more)

Short explanation video (3:31min) about how important system-level protection is for data transmission protocols. (read more)

Short explanation video (1:27min) about the importance of the dynamic resistance and how you can gain first insights for the performance with one parameter (read more)

Short explanation video (4:04min) in which, Nexperia's Trench Schottky diode's efficiency advantages vs state-of-the-art competitors are shown by using a double pulse test board with an input voltage of 48V. (read more)

Announcing the launch of LFPAK56D Power MOSFETs in 40, 60 and 100 V, for use in motor control and DC/DC conversion applications. (read more)

Announcing the launch of Automotive ASFETs for airbag, with enhanced SOA for improved linear mode performance, which is vital in the specialized needs of automotive airbag IC controllers. The choice of MOSFET has previously been limited to much larger, older silicon DPAK packages, Automotive ASFETs for airbag are housed in the space saving, power dense LFPAK33 and LFPAK56 packages. (read more)

Announcing the launch of our two new DSN packages, DSN1006 & DSN1010. 2 ultra-compact wafer-level packages provide designers more flexibility of choice within mobile and portable applications. With RDS(on) up to 25% better than competing devices in the market, the packages minimise energy losses, increase efficiency and reduce self heating. (read more)

Ensure robust ESD protection for your design. Follow the IEC61000-4-2 standard and explore now TLP testing for valuable insights. (read more)

Nexperia, the expert in essential semiconductors, today announced the latest additions to its rapidly expanding portfolio of Clip-bonded FlatPower (CFP) packaged diodes for industrial and automotive applications. (read more)

Drivers and vehicles now rely more heavily on Advanced Driver Assistance Systems (ADAS). However, ADAS in vehicles also relies heavily on high-quality video imagery. As vehicles become more autonomous, the quality of the video streams becomes more important. From a design aspect, high-speed video link design needs to consider how to maintain the signal integrity needed in such a harsh en... (read more)

Short explanation video (2:48min) that shows why ESD protection for data lines with several Gbps should be chosen by S-parameters rather than device capacitance. (read more)

Short explanation video (1:13min) about why in some cases the clamping voltage is lower than the break down voltage? (read more)

Nexperia, the expert in essential semiconductors, today introduced an AEC-Q101 qualified portfolio with six ESD protection devices (PESD2CANFD36XX-Q)designed to protect bus lines in automotive in-vehicle networks (IVN) such as LIN, CAN, CAN-FD, FlexRay and SENT from damage caused by electrostatic discharge (ESD) and other transients. (read more)

Engineers can optimize the efficiency of their power designs by carefully selecting the correct type of recovery rectifier diode. For the 200 V domain, Nexperia’s high-end hyper-fast PNE series can make the difference in switch-mode power supplies. In this article, a DC-DC converter is used to demonstrate the difference the diode could make. (read more)

Nexperia, the expert in essential semiconductors, today announced the expansion of its portfolio of Clip-bonded FlatPower (CFP) packaged diodes for industrial and automotive applications. (read more)

Small on size – big on power (read more)

Nexperia announced a broadening of package options for its NextPower 80/100 V MOSFETs portfolio, previously only available in LFPAK56E, to now also include LFPAK56 and LFPAK88 packaging. These devices have been designed to combine high efficiency with reduced spiking behavior in telecommunications, server computing, industrial, power supply, fast charging, USB-PD, and motor control appli... (read more)

Nexperia, the expert in essential semiconductors, today announced an extension to its portfolio of extremely low clamping and ultra-low capacitance ESD protection diodes. (read more)

Short explanation video (1:47min) about how to improve accuracy of AOI in PCB production by using modern package technology. (read more)

Announcing ASFETs for Hotswap and Soft Start with enhanced SOA. New 80 & 100 V products in LFPAK56E minimize derating and improve current sharing for optimum performance, high reliability and reduced system cost. The products also deliver improved SOA of 166% and space efficiency of 80% compared to earlier generations in D2PAK (read more)

The second edition to the hugely popular MOSFET application handbook, the updated version is a unique collection of technical materials and application notes providing essential and up-to-date information for anybody tasked with integrating MOSFETs and GaN FETs into real-world systems. (read more)

USB Type-C® has extended the options for the USB interface
significantly. This versatility comes with an increase of
complexity, especially three main challenges - signal integrity,
system-level ESD robustness and footprint. (read more)