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Filter Type:

Filter Order:

Applications:

Operating Temperature:

Cutoff or Center Frequency (Fc):

Bandwidth:

Package Type:

Pin Count:

Number of Devices in Package:

Standards and Certifications:

Help with SAW Filters specifications:

General Characteristics
   Filter Type       
   Your choices are...         
   All Pass       All pass filters (phase shift filters) do not affect the amplitude of the signal. Instead, they change the phase of the signal without changing its amplitude. 
   Band Pass       Bandpass filters are used to attenuate frequencies above and below a range of frequencies called the bandwidth or passband of the filter. Any signal with a frequency within the bandpass range passes through the filter. Any signal with a frequency outside the bandpass is reduced. 
   Band Reject       Band reject filters (band stop filters, notch filters) are used to attenuate a range of frequencies and allow all other frequencies to pass. 
   High Pass       High pass filters attenuate frequencies above a particular frequency called the cut-off frequency. Frequencies higher than the cut-off frequency pass easily through the filter. 
   Low Pass       Low pass filters attenuate frequencies below a particular frequency called the cut-off frequency. Frequencies below the cut-off frequency pass easily through the filter 
   Universal / Programmable       Universal filters can be configured by the user to function as a low pass, high pass, band pass, or band stop filter. 
   FIR       Finite impulse response (FIR) filters are digital filters whose response to a unit step function eventually results in a zero output. 
   IIR       Infinite impulse response (IIR) filters are digital filters whose response to a unit step function is not zero over an infinite time interval. 
   Biquad       Biquad filters are special digital filters with two poles and two zeroes. 
   Other       Other unlisted filter types. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Filter Order       
   Your choices are...         
   1st Order         
   2nd Order         
   3rd order         
   4th Order         
   5th Order         
   6th Order         
   7th Order         
   8th Order         
   Other       Other unlisted orders. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Applications      The industrial field in which the device will be used. 
   Your choices are...         
   General       Filters are suitable for general-purpose applications. 
   Audio/Video       Filters are designed for audio or video applications. 
   Automotive       Filters are designed for automotive applications. 
   Avionics       Filters are designed for avionics applications. 
   Commercial       Filters are designed for commercial applications. 
   Communications       Filters are designed for communications applications. 
   Computers       Filters are designed for computers. 
   Data Acquisition       Filters are designed for data acquisition applications. 
   EMI Filtering       Filters are designed for electromagnetic immunity (EMI) or electromagnetic compliance (EMC) filtering systems. 
   Industrial       Filters are designed for industrial applications. 
   Medical       Filters are designed for medical equipment and medical applications. 
   Military       Filters are designed for military applications. 
   Portable Devices       Filters are designed for portable devices such as portable digital assistants (PDA), digital cameras, and cell phones. 
   Ripple Attenuator       Filters are designed to trim or filter the ripple voltage produced at the output of AC-DC or DC-DC converters. 
   Other       Other unlisted applications. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Filter Performance
   Operating Temperature       Operating temperature is the value specified by a level (minTypMax) of the ambient temperature (in °C) in which this item was designed to operate. 
   Search Logic:      User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.
   Cutoff or Center Frequency (Fc)       The filter type determines the specified frequency (Fc). For band pass and band reject filters, the specified frequency is the center frequency. For low pass filters, the specified frequency is the cut-off frequency. For high pass filters, the specified frequency is the cut-on frequency. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Bandwidth       Bandwidth is the range of frequencies that filters pass with minimal attenuation or, in the case of band reject filters, maximum attenuation. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Package Characteristics
   Package Type       
   Your choices are...         
   DIP       Dual in-line package (DIP) is a type of semiconductor component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. The pins are distributed into two parallel lines along opposite site of the rectangular package. There are several types of DIP packages, such as Ceramic Dual in-line package (CDIP), Plastic Dual in-line package (PDIP), and Shrink Plastic Dual in-line package (SPDIP). 
   CDIP       Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade. 
   PDIP       Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics, and telecommunications. 
   DPAK       DPAK refers to a type of transistor outline package (T0-252). 
   CSP       Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs.   
   SIP       SIP refers to a single inline package. 
   SOIC       SOIC refers to a small outline IC. 
   SSOP       SSOP refers to a shrink small outline package. 
   SOP       SOP is a small outline package. 
   MSOP       Mini small outline plastic package (MSOP) products are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. The carrier tape is made from dissipative polystyrene resin. The cover tape is a multilayer film composed of a polyester film, adhesive layer, heat-activated sealant, and anti-static sprayed agent. The reel is made of polystyrene plastic (anti-static coated or intrinsic) and individually bar-coded. Reels are placed inside barcode-labeled boxes for shipping. 
   SOT       SOT packaging refers to a small outline transistor. 
   SOT23       SOT23 is a rectangular, surface mounted, small outline transistor (SOT) package with three or more gull wing leads. SOT23 features a very small footprint and is optimized for the highest possible current. Because of its low cost and low profile, SOT23 is used in home appliances, office and industrial equipment, personal computers, printers, and communication equipment. 
   PSOP       PSOP refers to a power small outline package. 
   QFP       QFP is a quad flat package. 
   TO-220       Transistor outline (TO) is a standard package for discrete transistors. SOT package are JEDEC compliant. TO-220 is a TO package of size 220. 
   TO-3       Transistor outline (TO) is a standard package for discrete transistors. SOT package are JEDEC compliant. TO-3 is a TO package of size 3. 
   SC-70       SC-70 is one of the smallest available IC packages. It is used in cellular phones, PDAs, electronic games, laptops, and other portable and hand-held applications where space is extremely limited. 
   TSSOP       TSSOP refers to thin shrink small outline L-leaded packages. 
   QSOP       QSOP refers to a quarter size outline package. 
   PLCC       PLCC refers to a plastic leaded carrier. 
   UCSP       UCSP refers to an ultra chip scale package. 
   Other       Other unlisted, specialized or proprietary packages. 
   Search Logic:      Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.
   Pin Count       Pin count is the number of physical connection points (e.g., pins, pads, balls) on the package. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
   Number of Devices in Package       This refers to the number of devices in the package. 
   Search Logic:      User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
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Standards and Certifications
           
   Your choices are...         
   RoHS Compliant       Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl and polybrominated diphenyl ether. RoHS will become effective on July 1, 2006. 
   ELV Directive       End of Life Vehicles (ELV) Directive required that certain automotive products be free (except for trace impurities) of mercury, cadmium and lead by July 1, 2003. Lead can still be used as an alloying additive in copper, steel and aluminum; and in solderable applications. 
   Other       Other unlisted, specialized, or proprietary standard or certifications. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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