EP40ND is a two component epoxy system, designed for bonding, sealing and coating applications. It is a non-drip, toughened system with an easy to use 1:1 mix ratio by weight or volume. EP40ND meets NASA low outgassing specifications and has a high elongation. (read more)

Featuring an extraordinary combination of properties, EP3SP5FL is a one component epoxy offering snap cures of 1-2 minutes at 300°F. It has high strength properties, superior electrically insulation and is readily reworkable. (read more)

Master Bond MasterSil 151TC is a two component silicone for use primarily in thermal management applications, for bonding or smaller gap filling. (read more)

Master Bond EP36FR is a one component, B-staged epoxy for potting, encapsulation, coating and bonding. It meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. (read more)

One component, silver filled epoxy features extraordinary electrical and thermal conductivity. (read more)

Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required. (read more)

Master Bond EP30-4Med is an optically clear, two component epoxy system for high performance bonding, coating, sealing and casting. (read more)

Master Bond MasterSil 323 is a two component silicone for high performance bonding, sealing, and encapsulating. It does not require air when polymerizing and does not outgas while curing. (read more)

Master Bond EP35AOLV is a two component thermally conductive, electrically isolating epoxy for bonding, sealing and potting. (read more)

Master Bond EP5G-80 is a one component, graphite filled epoxy paste for bonding, sealing and coating applications. It is electrically and thermally conductive. (read more)

Infographics library presents engineers with a variety of materials that cover topics ranging from product properties to industrial highlights, from "how-to" guides to innovations in adhesive technology, and more. Browse through our library for a look at what Master Bond has to offer. (read more)

Master Bond LED405FL3 is a flexible one component, LED curing adhesive system with excellent optical clarity. (read more)

Master Bond EP21AOLV-2Med is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, coating and encapsulant. (read more)

Master Bond MasterSil 153AO is an addition cured two part silicone with a self priming property. It has a high tensile lap shear strength, especially for a silicone. The system is thermally conductive and electrically insulating. (read more)

EP51CC is a high performance epoxy for bonding and sealing. Part A is colored white, Part B is black, and when fully mixed, it turns a uniform gray. (read more)

Master Bond EP21NS is a two part epoxy that may be used for bonding, coating, sealing and potting/encapsulating. (read more)

Toughened NASA Low Outgassing Epoxy Derived from Sustainable Ingredients (read more)

Fast Curing, Silver Filled Epoxy Meets ISO 10993-5 Cytotoxicity Standards. Master Bond EP77M-FMed is a two part epoxy adhesive and sealant designed for use in the assembly of medical devices. It meets the ISO 10993-5 requirements and is not considered to have a cytotoxic effect. (read more)

Free flowing EP4EN-80 is suitable for bonding, small potting and encapsulations up to about a ¼ inch thick in some applications. (read more)

Master Bond UV15X-6Med-2LV is a UV curable, non-cytotoxic adhesive that features optical clarity and abrasion resistance. It can be utilized for bonding, sealing, coating, and encapsulating. (read more)

Master Bond offers USP Class VI approved one and two component adhesives, sealants and coatings formulated for the assembly of medical devices. These specialty compounds are designed to adhere to dissimilar substrates, resist exposure to sterilization and for easy application. Watch Now (read more)

EP40Med resists sterilization to gamma, EtO, chemicals, and liquid disinfectants. It is recommended for use in medical device manufacturing and repair for both disposable and reusable instruments. (read more)

Master Bond EP17HTS-DA is a one part, electrically conductive die attach epoxy that offers high temperature resistance. (read more)

Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. (read more)

Silicone adhesive systems have several important performance characteristics that distinguish them from other adhesive families. Learn more about their unique combination of flexibility, high temperature resistance, and more specialized engineering properties. (read more)

NASA low outgassing approved epoxy, Master Bond Supreme 121AO, may be used for bonding, sealing and potting applications. (read more)

With the proliferation of handheld and other small electronic devices, unintentional EMI/RFI interference has become an increasingly important issue. Shielding of these interferences is critical and coatings can be successfully applied as protection on the materials used. (read more)

Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses.

It can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required. (read more)

Two component, room temperature curing epoxy for bonding, coating, sealing and potting (read more)

Offering the highest levels of electrical conductivity, silver filled adhesives are ideal for a variety of applications where conductivity is of the utmost importance. This convenient brochure offers our top silver conductive systems at a glance. (read more)

Dual Curing Epoxy Meets Biocompatibility and Cytotoxicity Requirements (read more)

Master Bond EP30NG is a two part epoxy adhesive system developed for applications that require high thermal conductivity. (read more)

One component, toughened, silver conductive epoxy system featuring good electrical conductivity and physical strength properties. (read more)

Master Bond Super Gel 9 cures readily at room temperature to form a soft, resilient, gel-like system with excellent dimensional stability. Extremely low viscosity and exotherm enable it to be cast in larger sections up to 2-3 inches thick. Super Gel 9 is deal for use in a variety of applications, especially the encapsulation of sensitive electronic parts and sealing delicate optical comp... (read more)

Master Bond LED401 is a unique single component compound that cures rapidly upon exposure to 405 nm light. This formulation has a low viscosity, high bond strength and superior electrical insulation properties. (read more)

Master Bond EP93AOFR is a two part, flame retardant epoxy that may be used in encapsulation and potting applications, as well as in bonding, sealing and coating. It fully complies with FAR standard 14 CFR 25.853(a) for flame retardancy. (read more)

Master Bond LED405Med is a one part, nanofilled system that cures quickly upon exposure to a 405 nm LED light without requiring a UV light source. (read more)

Well suited for underfill applications, Master Bond EP3UF-1 is a one part, low viscosity epoxy adhesive that cures rapidly at elevated temperatures. It offers thermal conductivity, electrical insulation and dimensional stability. (read more)

Engineers often want to know whether an adhesive is low outgassing or generic. And while there are cases when nothing but a low outgassing product will do, the truth is that many so-called generic adhesives inherently have low outgassing levels. (read more)

Master Bond EP41S-6 is a new two component epoxy system that meets UL 1203, which is defined by Underwriters Laboratories as the “Standard for Explosion-Proof and Dust-Ignition-Proof Electrical Equipment for Use in Hazardous (Classified) Locations”. (read more)

Master Bond EP30LTE-2 can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required. (read more)

Master Bond EP62-1LPSPMed is a two component, high performance epoxy system featuring biocompatibility for bonding, sealing, coating, encapsulating and impregnation. (read more)

Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity (read more)

Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient of thermal expansion. (read more)

Master Bond UV22DC80-10F is a nanosilica filled, UV dual cure system with high dimensional stability. It may be used for high tech aerospace, electronics, optical and specialty OEM applications. (read more)

Master Bond Supreme 34CA is a two part epoxy system recommended for bonding, sealing and coating applications. (read more)

Featuring a low coefficient of thermal expansion (CTE) of 15-20 x 10^-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications. (read more)

Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for bonding and sealing. (read more)

Two component, thermally conductive, electrically insulative, room temperature curing epoxy resin system (read more)

This specialty non-halogenated system can be used for bonding, sealing and encapsulating applications in aircraft . (read more)

Master Bond EP62-1BF protects against many aggressive chemicals, even at
elevated temperatures. It is a two component epoxy system that has a very long working life at room temperature and requires curing at moderately elevated temperatures. (read more)

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. (read more)

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. It is serviceable over the wide temperature range of -60°F to +250°F. (read more)

Master Bond EP3HTND-2Med Black is a high strength, fast curing epoxy for use in the assembly of medical devices. It fully meets USP Class VI specifications. It is a one part system that combines easy processing with excellent physical strength and bonding properties. This epoxy has a paste consistency and is formulated not to flow while curing. (read more)

NASA Low Outgassing Epoxy Has Superior Heat Dissipation Properties (read more)

Elastomeric adhesive system, X5TC delivers thermal conductivity of 10-12 BTU•in/ft2•hr•°F [1.44-1.73 W/m•K] while maintaining excellent electrical insulation properties. (read more)

Widely used in the electronic, aerospace, optical and specialty OEM industries, Master Bond EP126 excels in high temperature applications up to +600°F. (read more)

The most special feature of EP30-2LB is its optical transmission profile. It blocks UV light from 200 nm to about 400 nm and transmits well from 450-900 nm and above. EP30-2LB has a number of other appealing attributes such as its excellent physical strength properties. It is a strong and reliable adhesive. It bonds well to a wide variety of substrates including metals, composites, glass... (read more)

Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10^-6 K•m²/W. (read more)

Two component, thermally conductive, electrically insulative epoxy system particularly suited for large potting and encapsulation applications (read more)

Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electronic, microelectronic and optical industries. (read more)

Master Bond MasterSil 910Med is a one part acetoxy type silicone system that meets USP Class VI specifications for biocompatibility and ISO 10993-5 testing for cytotoxicity. This translucent paste also withstands many sterilization methods, including liquid sterilants, gamma radiation and EtO. (read more)

Master Bond Supreme 3HTND-2CCM is a rapid curing, toughened, multifunctional, one part epoxy system that can be used for bonding, sealing, coating, potting and glob topping. (read more)

Master Bond UV15X-6NM-2 is a one component, UV curing urethane acrylate system featuring flexibility, toughness and superior abrasion resistance. (read more)

Visible light curable adhesives feature high bond strength, thermal stability, chemical and water resistance and excellent surface cure. (read more)

Master Bond EP21TCHT-1 is a heat resistant polymer system formulated for high performance bonding and sealing applications. It features high thermal conductivity and superior electrical insulation properties with a service operating temperature range of 4K to 400°F. EP21TCHT-1 is NASA low outgassing certified and is therefore highly recommended for use in vacuum environments. (read more)

Master Bond Supreme 18TC is a cutting edge material pertaining to the thermal management of epoxies. This system utilizes a special blend of highly thermally conductive filler material that is capable of being applied in bond lines as thin as 10-15 microns. Supreme 18TC maintains high bond strength properties even when exposed to hostile environmental conditions, including elevated tempe... (read more)

Featuring a non-halogenated filler, EP21FRNS-2 is a two component, room temperature curing epoxy offering low smoke generation for potting, encapsulating and casting applications. As per the UL 94V-0 specification, this system is serviceable over the wide temperature range of -60°F to 200°F. It is remarkably resistant to thermal cycling and many chemicals. (read more)

Formulated for specialty aviation applications, EP90FR-V is a two component epoxy system meeting FAR standard 14 CFR 25.853(a) for flame retardancy. The most noteworthy applications include interior panels, door frame lining and floor/door assemblies. Since it is a superior electrical insulator, it is also a candidate for electronic potting and sealing applications. (read more)

Low viscosity MB250NT is a single component ethyl cyanoacrylate that cures exceptionally fast at room temperature. This high strength, non-toxic system meets ISO 10993-5 standard for cytotoxicity. It is often used in high speed production of disposable medical devices and also has first rate resistance to EtO and gamma sterilization processes. (read more)

Cryogenically serviceable Supreme 12AOHT-LO combines superior thermal conductivity with reliable electrical insulation properties in an easy to use, no mix system. (read more)

Master Bond EP30HV is a lower viscosity, two component epoxy system for high performance bonding, sealing, coating and potting. (read more)

Suitable for large castings, EP21LVSP6 is a room temperature curing system with a long open time and a low viscosity. This epoxy features a convenient one to one mix ratio and can also be used in bonding, sealing and coating applications. It has very good physical strength properties as well as being an excellent electrical insulator. (read more)

Master Bond EP42HT-2LTE is widely used for a variety of bonding, sealing, coating and select casting applications in the electronic, aerospace, optical and specialty OEM industries. This two component epoxy has a flowable paste consistency that enables precise alignment with minimal fixturing. It cures at room temperature or more quickly with the addition of heat. (read more)

Offering impressive toughness, UV15-42C is a very high strength, one part, translucent adhesive that can withstand thermal and mechanical shocks while retaining excellent dimensional stability. It is a competent electrical insulator and has exceptionally low shrinkage upon curing. UV15-42C is not oxygen inhibited and will cure in thicknesses up to ¼ inch. (read more)