Non-Drip Epoxy Features High Glass Transition Temperature Master Bond Supreme 121AOND is a toughened adhesive offering chemical resistance and a glass transition temperature (Tg) of 200-210°C. It also meets NASA low outgassing specifications. (read more)

Master Bond Supreme 11AOHTLP is a thermally conductive, electrically insulative adhesive that withstands thermal cycling and offers a wide service temperature range from -112°F to +400°F (-80°C to 204°C). (read more)

Master Bond Supreme 11AOHT-LO is a thermally conductive, electrically insulating epoxy for high performance bonding and sealing that withstands temperatures up to +400°F and meets NASA low outgassing requirements. (read more)

Master Bond EP21LSCL-2Med is a non-cytotoxic epoxy that resists yellowing and can be used for bonding, sealing, coating, and potting in imaging applications and medical devices. (read more)

Master Bond EP21AOLV-2Med is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, coating and encapsulant. (read more)

UV23FLDC-80TK is a moderate viscosity, dual curing, cationic type system. (read more)

EP53TC is a two-component epoxy designed for bonding, sealing, coating, and small potting applications where efficient heat dissipation is crucial. (read more)

EP51CC is a high performance epoxy for bonding and sealing. Part A is colored white, Part B is black, and when fully mixed, it turns a uniform gray. (read more)

Cryogenically serviceable Supreme 12AOHT-LO combines superior thermal conductivity with reliable electrical insulation properties in an easy to use, no mix system. (read more)

With the proliferation of handheld and other small electronic devices, unintentional EMI/RFI interference has become an increasingly important issue. Shielding of these interferences is critical and coatings can be successfully applied as protection on the materials used. (read more)

Featuring an extraordinary combination of properties, EP3SP5FL is a one component epoxy offering snap cures of 1-2 minutes at 300°F. It has high strength properties, superior electrically insulation and is readily reworkable. (read more)

Key Features:

• Rigid bonds
• Outstanding chemical resistance
• Optically clear
• Excellent physical strength properties
• Passes NASA low outgassing tests
• Meets FDA Chapter 1, Section 175.105 for indirect food applications

Two component, room temperature curing epoxy compound featuring an ultra low coefficient of thermal expansion

Product Advantages

• Non-critical 100 to 40 mix ratio by weight or 100 to 50 by volume
• Cryogenically serviceable
• High degree of dimensional stability
• Desirably low shrinkage
• Extraordinarily low coefficient...

Master Bond EP54TC is a thermally conductive, electrically insulating two part epoxy that combines good physical properties and the ability to transfer heat rapidly and effectively. (read more)

Master Bond LED401 is a unique single component compound that cures rapidly upon exposure to 405 nm light. This formulation has a low viscosity, high bond strength and superior electrical insulation properties. (read more)

Master Bond EP21TCHT-1 is a heat resistant polymer system formulated for high performance bonding and sealing applications. It features high thermal conductivity and superior electrical insulation properties with a service operating temperature range of 4K to 400°F. EP21TCHT-1 is NASA low outgassing certified and is therefore highly recommended for use in vacuum environments. (read more)

Two Component, Toughened Epoxy System
Master Bond Supreme 11ANHT-2 is a thermally conductive, electrically insulating epoxy for bonding, coating and sealing. It has small particle size aluminum nitride filler, resulting in low thermal resistance. (read more)

UV17Med is a low viscosity, UV curable system with an affinity for bonding to a wide array of thermoplastic urethanes. (read more)

Master Bond EP21ARHTND-2 is a two part epoxy adhesive, designed to withstand prolonged exposure to a wide range of chemicals. (read more)

Featuring a non-halogenated filler, EP21FRNS-2 is a two component, room temperature curing epoxy offering low smoke generation for potting, encapsulating and casting applications. As per the UL 94V-0 specification, this system is serviceable over the wide temperature range of -60°F to 200°F. It is remarkably resistant to thermal cycling and many chemicals. (read more)

Master Bond MasterSil 323S-LO is an addition cured silicone that is electrically and thermally conductive. (read more)

Toughened, high strength, two component epoxy for bonding and sealing, meets ISO 1099305 for non-cytotoxicity. (read more)

Master Bond UV15RCL is a red colored, high strength, low viscosity epoxy based UV system for bonding, sealing and coating. (read more)

EP42HT-2FG Black is a two part, moderate heat cured epoxy with high temperature resistance that complies with FDA 21 CFR 175.105 for indirect food contact applications. (read more)

Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (T_g), and extremely high modulus. (read more)

Toughened, One Component Epoxy Features High Glass Transition Temperature (read more)

One component, silver filled epoxy features extraordinary electrical and thermal conductivity. (read more)

Supreme 3DM-85 is a thixotropic paste material formulated to serve as the damming compound in dam-and-fill encapsulation applications. (read more)

Master Bond LED415DC90 is a one part system that cures rapidly upon exposure to LED light at 405 nm followed by heat curing at 90-95°C for 30-45 minutes. (read more)

Master Bond MB297FLNT is a rubber toughened, single component ethyl cyanoacrylate system used primarily in applications where ISO 10993-5 is specified. (read more)

This specialty non-halogenated system can be used for bonding, sealing and encapsulating applications in aircraft . (read more)

EP40ND is a two component epoxy system, designed for bonding, sealing and coating applications. It is a non-drip, toughened system with an easy to use 1:1 mix ratio by weight or volume. EP40ND meets NASA low outgassing specifications and has a high elongation. (read more)

Master Bond MasterSil 151TC is a two component silicone for use primarily in thermal management applications, for bonding or smaller gap filling. (read more)

Master Bond EP36FR is a one component, B-staged epoxy for potting, encapsulation, coating and bonding. It meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. (read more)

Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required. (read more)

Master Bond MasterSil 323 is a two component silicone for high performance bonding, sealing, and encapsulating. It does not require air when polymerizing and does not outgas while curing. (read more)

Master Bond EP35AOLV is a two component thermally conductive, electrically isolating epoxy for bonding, sealing and potting. (read more)

Master Bond EP5G-80 is a one component, graphite filled epoxy paste for bonding, sealing and coating applications. It is electrically and thermally conductive. (read more)

Master Bond LED405FL3 is a flexible one component, LED curing adhesive system with excellent optical clarity. (read more)

Master Bond MasterSil 153AO is an addition cured two part silicone with a self priming property. It has a high tensile lap shear strength, especially for a silicone. The system is thermally conductive and electrically insulating. (read more)

Master Bond EP21NS is a two part epoxy that may be used for bonding, coating, sealing and potting/encapsulating. (read more)

Toughened NASA Low Outgassing Epoxy Derived from Sustainable Ingredients (read more)

Fast Curing, Silver Filled Epoxy Meets ISO 10993-5 Cytotoxicity Standards. Master Bond EP77M-FMed is a two part epoxy adhesive and sealant designed for use in the assembly of medical devices. It meets the ISO 10993-5 requirements and is not considered to have a cytotoxic effect. (read more)

Free flowing EP4EN-80 is suitable for bonding, small potting and encapsulations up to about a ¼ inch thick in some applications. (read more)

Master Bond UV15X-6Med-2LV is a UV curable, non-cytotoxic adhesive that features optical clarity and abrasion resistance. It can be utilized for bonding, sealing, coating, and encapsulating. (read more)

EP40Med resists sterilization to gamma, EtO, chemicals, and liquid disinfectants. It is recommended for use in medical device manufacturing and repair for both disposable and reusable instruments. (read more)

Master Bond EP17HTS-DA is a one part, electrically conductive die attach epoxy that offers high temperature resistance. (read more)

Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. (read more)

NASA low outgassing approved epoxy, Master Bond Supreme 121AO, may be used for bonding, sealing and potting applications. (read more)

Two component, room temperature curing epoxy for bonding, coating, sealing and potting (read more)

Dual Curing Epoxy Meets Biocompatibility and Cytotoxicity Requirements (read more)

Master Bond EP30NG is a two part epoxy adhesive system developed for applications that require high thermal conductivity. (read more)

Master Bond EP93AOFR is a two part, flame retardant epoxy that may be used in encapsulation and potting applications, as well as in bonding, sealing and coating. It fully complies with FAR standard 14 CFR 25.853(a) for flame retardancy. (read more)

Master Bond LED405Med is a one part, nanofilled system that cures quickly upon exposure to a 405 nm LED light without requiring a UV light source. (read more)

Well suited for underfill applications, Master Bond EP3UF-1 is a one part, low viscosity epoxy adhesive that cures rapidly at elevated temperatures. It offers thermal conductivity, electrical insulation and dimensional stability. (read more)

Master Bond EP41S-6 is a new two component epoxy system that meets UL 1203, which is defined by Underwriters Laboratories as the “Standard for Explosion-Proof and Dust-Ignition-Proof Electrical Equipment for Use in Hazardous (Classified) Locations”. (read more)

Master Bond EP30LTE-2 can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required. (read more)

Master Bond EP62-1LPSPMed is a two component, high performance epoxy system featuring biocompatibility for bonding, sealing, coating, encapsulating and impregnation. (read more)

Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity (read more)

Master Bond UV22DC80-10F is a nanosilica filled, UV dual cure system with high dimensional stability. It may be used for high tech aerospace, electronics, optical and specialty OEM applications. (read more)

Featuring a low coefficient of thermal expansion (CTE) of 15-20 x 10^-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications. (read more)

Two component, thermally conductive, electrically insulative, room temperature curing epoxy resin system (read more)

Master Bond EP62-1BF protects against many aggressive chemicals, even at
elevated temperatures. It is a two component epoxy system that has a very long working life at room temperature and requires curing at moderately elevated temperatures. (read more)

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. (read more)

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. It is serviceable over the wide temperature range of -60°F to +250°F. (read more)

Widely used in the electronic, aerospace, optical and specialty OEM industries, Master Bond EP126 excels in high temperature applications up to +600°F. (read more)

Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10^-6 K•m²/W. (read more)

Two component, thermally conductive, electrically insulative epoxy system particularly suited for large potting and encapsulation applications (read more)

Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electronic, microelectronic and optical industries. (read more)

Master Bond MasterSil 910Med is a one part acetoxy type silicone system that meets USP Class VI specifications for biocompatibility and ISO 10993-5 testing for cytotoxicity. This translucent paste also withstands many sterilization methods, including liquid sterilants, gamma radiation and EtO. (read more)

Master Bond Supreme 3HTND-2CCM is a rapid curing, toughened, multifunctional, one part epoxy system that can be used for bonding, sealing, coating, potting and glob topping. (read more)

Master Bond UV15X-6NM-2 is a one component, UV curing urethane acrylate system featuring flexibility, toughness and superior abrasion resistance. (read more)

Visible light curable adhesives feature high bond strength, thermal stability, chemical and water resistance and excellent surface cure. (read more)

Master Bond Supreme 18TC is a cutting edge material pertaining to the thermal management of epoxies. This system utilizes a special blend of highly thermally conductive filler material that is capable of being applied in bond lines as thin as 10-15 microns. Supreme 18TC maintains high bond strength properties even when exposed to hostile environmental conditions, including elevated tempe... (read more)

Low viscosity MB250NT is a single component ethyl cyanoacrylate that cures exceptionally fast at room temperature. This high strength, non-toxic system meets ISO 10993-5 standard for cytotoxicity. It is often used in high speed production of disposable medical devices and also has first rate resistance to EtO and gamma sterilization processes. (read more)