Announcements

Master Bond, Inc. has promoted these products / services:

Master Bond, Inc. - Two component silicone for thermal management

Master Bond MasterSil 151TC is a two component silicone for use primarily in thermal management applications, for bonding or smaller gap filling. (read more)

Master Bond, Inc. - USP Class VI Epoxy-Urethane Blended System

EP30DPBFMed is a two part, flexibilized epoxy-urethane hybrid system that can be used for bonding, sealing, coating, and encapsulation. It is formulated for disposable and reusable medical devices. (read more)

Master Bond, Inc. - High temperature resistant die attach epoxy

Master Bond EP17HTS-DA is a one part, electrically conductive die attach epoxy that offers high temperature resistance. (read more)

Master Bond, Inc. - One part toughened epoxy for bonding and sealing

Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. (read more)

Master Bond, Inc. - White Paper Spotlight on Silicones

Silicone adhesive systems have several important performance characteristics that distinguish them from other adhesive families. Learn more about their unique combination of flexibility, high temperature resistance, and more specialized engineering properties. (read more)

Master Bond, Inc. - Toughened Potting Compound

NASA low outgassing approved epoxy, Master Bond Supreme 121AO, may be used for bonding, sealing and potting applications. (read more)

Master Bond, Inc. - Conductive Coatings Protect Circuitry EMI/RFI/ESD

With the proliferation of handheld and other small electronic devices, unintentional EMI/RFI interference has become an increasingly important issue. Shielding of these interferences is critical and coatings can be successfully applied as protection on the materials used. (read more)

Master Bond, Inc. - Low CTE Epoxy for Precise Alignment

Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses.

It can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required. (read more)

Master Bond, Inc. - Optically Clear Epoxy Is Highly Flexible

Two component, room temperature curing epoxy for bonding, coating, sealing and potting (read more)

Master Bond, Inc. - Top 5 Silver Filled Adhesives Brochure

Offering the highest levels of electrical conductivity, silver filled adhesives are ideal for a variety of applications where conductivity is of the utmost importance. This convenient brochure offers our top silver conductive systems at a glance. (read more)

Master Bond, Inc. - UV22DC80-1Med

Dual Curing Epoxy Meets Biocompatibility and Cytotoxicity Requirements (read more)

Master Bond, Inc. - EP30NG: Graphene Filled Epoxy

Master Bond EP30NG is a two part epoxy adhesive system developed for applications that require high thermal conductivity. (read more)

Master Bond, Inc. - Silver Conductive, One Part Epoxy Cures at 80°C

One component, toughened, silver conductive epoxy system featuring good electrical conductivity and physical strength properties. (read more)

Master Bond, Inc. - Urethane Modified Epoxy Gel System

Master Bond Super Gel 9 cures readily at room temperature to form a soft, resilient, gel-like system with excellent dimensional stability. Extremely low viscosity and exotherm enable it to be cast in larger sections up to 2-3 inches thick. Super Gel 9 is deal for use in a variety of applications, especially the encapsulation of sensitive electronic parts and sealing delicate optical comp... (read more)

Master Bond, Inc. - High Performance LED Curable Compound

Master Bond LED401 is a unique single component compound that cures rapidly upon exposure to 405 nm light. This formulation has a low viscosity, high bond strength and superior electrical insulation properties. (read more)

Master Bond, Inc. - Thermally Conductive, Flame Retardant Encapsulant

Master Bond EP93AOFR is a two part, flame retardant epoxy that may be used in encapsulation and potting applications, as well as in bonding, sealing and coating. It fully complies with FAR standard 14 CFR 25.853(a) for flame retardancy. (read more)

Master Bond, Inc. - Nanosilica Filled LED Curable Adhesive

Master Bond LED405Med is a one part, nanofilled system that cures quickly upon exposure to a 405 nm LED light without requiring a UV light source. (read more)

Master Bond, Inc. - EP3UF-1: Thermally Conductive Underfill Epoxy

Well suited for underfill applications, Master Bond EP3UF-1 is a one part, low viscosity epoxy adhesive that cures rapidly at elevated temperatures. It offers thermal conductivity, electrical insulation and dimensional stability. (read more)

Master Bond, Inc. - White Paper: Low Outgassing Adhesives

Engineers often want to know whether an adhesive is low outgassing or generic. And while there are cases when nothing but a low outgassing product will do, the truth is that many so-called generic adhesives inherently have low outgassing levels. (read more)

Master Bond, Inc. - EP41S-6 UL 1203 Certified Epoxy

Master Bond EP41S-6 is a new two component epoxy system that meets UL 1203, which is defined by Underwriters Laboratories as the “Standard for Explosion-Proof and Dust-Ignition-Proof Electrical Equipment for Use in Hazardous (Classified) Locations”. (read more)

Master Bond, Inc. - Structural Adhesive Features Long Pot Life

Master Bond EP21ND-LP was created for structural bonding applications involving large surface areas. (read more)

Master Bond, Inc. - EP30LTE-2

Master Bond EP30LTE-2 can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required. (read more)

Master Bond, Inc. - Biocompatible Epoxy for Medical Electronics

Master Bond EP62-1LPSPMed is a two component, high performance epoxy system featuring biocompatibility for bonding, sealing, coating, encapsulating and impregnation. (read more)

Master Bond, Inc. - MasterSil 170 Gel

Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity (read more)

Master Bond, Inc. - Thermally Conductive Potting Compound

Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient of thermal expansion. (read more)

Master Bond, Inc. - UV Curing Epoxy: UV22DC80-10F

Master Bond UV22DC80-10F is a nanosilica filled, UV dual cure system with high dimensional stability. It may be used for high tech aerospace, electronics, optical and specialty OEM applications. (read more)

Master Bond, Inc. - Supreme 34CA

Master Bond Supreme 34CA is a two part epoxy system recommended for bonding, sealing and coating applications. (read more)

Master Bond, Inc. - Epoxy Offers Low Coefficient of Thermal Expansion

Featuring a low coefficient of thermal expansion (CTE) of 15-20 x 10-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications. (read more)

Master Bond, Inc. - Epoxy for Die Attach Applications

Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for bonding and sealing. (read more)

Master Bond, Inc. - EP39MAOHT: Thermally Conductive Epoxy

Two component, thermally conductive, electrically insulative, room temperature curing epoxy resin system (read more)

Master Bond, Inc. - Two part epoxy system meets Airbus standards

This specialty non-halogenated system can be used for bonding, sealing and encapsulating applications in aircraft . (read more)

Master Bond, Inc. - EP62-1BF: Low Viscosity Epoxy, Chemical Resistance

Master Bond EP62-1BF protects against many aggressive chemicals, even at
elevated temperatures. It is a two component epoxy system that has a very long working life at room temperature and requires curing at moderately elevated temperatures. (read more)

Master Bond, Inc. - Addition Cured Silicone

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. (read more)

Master Bond, Inc. - Low Viscosity, Optically Clear Epoxy Compound

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. It is serviceable over the wide temperature range of -60°F to +250°F. (read more)

Master Bond, Inc. - Non-Drip Epoxy Resists Repeated Sterilizations

Master Bond EP3HTND-2Med Black is a high strength, fast curing epoxy for use in the assembly of medical devices. It fully meets USP Class VI specifications. It is a one part system that combines easy processing with excellent physical strength and bonding properties. This epoxy has a paste consistency and is formulated not to flow while curing. (read more)

Master Bond, Inc. - EP46HT-2AO Black

NASA Low Outgassing Epoxy Has Superior Heat Dissipation Properties (read more)

Master Bond, Inc. - One Part, Thermally Conductive Elastomeric System

Elastomeric adhesive system, X5TC delivers thermal conductivity of 10-12 BTU•in/ft2•hr•°F [1.44-1.73 W/m•K] while maintaining excellent electrical insulation properties. (read more)

Master Bond, Inc. - EP126: Chemical Resistant Epoxy Features High Tg

Widely used in the electronic, aerospace, optical and specialty OEM industries, Master Bond EP126 excels in high temperature applications up to +600°F. (read more)

Master Bond, Inc. - Two component, optically clear epoxy

The most special feature of EP30-2LB is its optical transmission profile. It blocks UV light from 200 nm to about 400 nm and transmits well from 450-900 nm and above. EP30-2LB has a number of other appealing attributes such as its excellent physical strength properties. It is a strong and reliable adhesive. It bonds well to a wide variety of substrates including metals, composites, glass... (read more)

Master Bond, Inc. - Epoxy for Underfill Applications

Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10-6 K•m2/W. (read more)

Master Bond, Inc. - EP29LPAO

Two component, thermally conductive, electrically insulative epoxy system particularly suited for large potting and encapsulation applications (read more)

Master Bond, Inc. - EP3HTS-LO

Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electronic, microelectronic and optical industries. (read more)

Master Bond, Inc. - MasterSil 910Med

Master Bond MasterSil 910Med is a one part acetoxy type silicone system that meets USP Class VI specifications for biocompatibility and ISO 10993-5 testing for cytotoxicity. This translucent paste also withstands many sterilization methods, including liquid sterilants, gamma radiation and EtO. (read more)

Master Bond, Inc. - Supreme 45HTQ-4

Master Bond Supreme 45HTQ-4 is a two component, toughened, silicon carbide filled epoxy for high performance bonding, sealing and casting. (read more)

Master Bond, Inc. - Supreme 3HTND-2CCM

Master Bond Supreme 3HTND-2CCM is a rapid curing, toughened, multifunctional, one part epoxy system that can be used for bonding, sealing, coating, potting and glob topping. (read more)

Master Bond, Inc. - UV15X-6NM-2: UV Curable System

Master Bond UV15X-6NM-2 is a one component, UV curing urethane acrylate system featuring flexibility, toughness and superior abrasion resistance. (read more)

Master Bond, Inc. - LED Light Curable Adhesives

Visible light curable adhesives feature high bond strength, thermal stability, chemical and water resistance and excellent surface cure. (read more)

Master Bond, Inc. - Room Temp Curing Epoxy Serviceable Up To 400°F

Master Bond EP21TCHT-1 is a heat resistant polymer system formulated for high performance bonding and sealing applications. It features high thermal conductivity and superior electrical insulation properties with a service operating temperature range of 4K to 400°F. EP21TCHT-1 is NASA low outgassing certified and is therefore highly recommended for use in vacuum environments. (read more)

Master Bond, Inc. - Epoxy Adhesive With Very Low Thermal Resistance

Master Bond Supreme 18TC is a cutting edge material pertaining to the thermal management of epoxies. This system utilizes a special blend of highly thermally conductive filler material that is capable of being applied in bond lines as thin as 10-15 microns. Supreme 18TC maintains high bond strength properties even when exposed to hostile environmental conditions, including elevated tempe... (read more)

Master Bond, Inc. - Flame Resistant Epoxy System

Featuring a non-halogenated filler, EP21FRNS-2 is a two component, room temperature curing epoxy offering low smoke generation for potting, encapsulating and casting applications. As per the UL 94V-0 specification, this system is serviceable over the wide temperature range of -60°F to 200°F. It is remarkably resistant to thermal cycling and many chemicals. (read more)

Master Bond, Inc. - EP90FR-V: Passes Vertical Burn Test

Formulated for specialty aviation applications, EP90FR-V is a two component epoxy system meeting FAR standard 14 CFR 25.853(a) for flame retardancy. The most noteworthy applications include interior panels, door frame lining and floor/door assemblies. Since it is a superior electrical insulator, it is also a candidate for electronic potting and sealing applications. (read more)

Master Bond, Inc. - EP21AOLV-2Med: Two component epoxy compound

Master Bond EP21AOLV-2Med is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, coating and encapsulant. (read more)

Master Bond, Inc. - Non-Toxic Cyanoacrylate for Bonding Applications

Low viscosity MB250NT is a single component ethyl cyanoacrylate that cures exceptionally fast at room temperature. This high strength, non-toxic system meets ISO 10993-5 standard for cytotoxicity. It is often used in high speed production of disposable medical devices and also has first rate resistance to EtO and gamma sterilization processes. (read more)

Master Bond, Inc. - Supreme 12AOHT-LO: NASA Low Outgassing Adhesive

Cryogenically serviceable Supreme 12AOHT-LO combines superior thermal conductivity with reliable electrical insulation properties in an easy to use, no mix system. (read more)

Master Bond, Inc. - EP3SP5FL: One component “snap cure” epoxy adhesive

Featuring an extraordinary combination of properties, EP3SP5FL is a one component epoxy offering snap cures of 1-2 minutes at 300°F. It has high strength properties, superior electrically insulation and is readily reworkable. (read more)

Master Bond, Inc. - Epoxy system for indirect food applications

Master Bond EP30HV is a lower viscosity, two component epoxy system for high performance bonding, sealing, coating and potting. (read more)

Master Bond, Inc. - Two Part Epoxy with Very Low Exotherm

Suitable for large castings, EP21LVSP6 is a room temperature curing system with a long open time and a low viscosity. This epoxy features a convenient one to one mix ratio and can also be used in bonding, sealing and coating applications. It has very good physical strength properties as well as being an excellent electrical insulator. (read more)

Master Bond, Inc. - Ultra Low Coefficient of Thermal Expansion Epoxy

Master Bond EP42HT-2LTE is widely used for a variety of bonding, sealing, coating and select casting applications in the electronic, aerospace, optical and specialty OEM industries. This two component epoxy has a flowable paste consistency that enables precise alignment with minimal fixturing. It cures at room temperature or more quickly with the addition of heat. (read more)

Master Bond, Inc. - UV Curable Compound with a Non-Drip Viscosity

Offering impressive toughness, UV15-42C is a very high strength, one part, translucent adhesive that can withstand thermal and mechanical shocks while retaining excellent dimensional stability. It is a competent electrical insulator and has exceptionally low shrinkage upon curing. UV15-42C is not oxygen inhibited and will cure in thicknesses up to ¼ inch. (read more)

Master Bond, Inc. - Thermally Conductive Silicone

Featuring superb electrical insulation properties Master Bond MasterSil 156 is a two component, low viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, thermal conductivity along with meeting UL 94V-0 for flame retardancy. (read more)

News articles and press releases for Master Bond, Inc.:

05/28/2020

EP42-2LV Black is a two part epoxy that can be used for bonding, sealing, coating and casting, where a strong chemical resistance profile is required.

04/02/2020

Master Bond EP35SP is a two part epoxy system for bonding and sealing applications, providing resistance to many chemicals such as oils, acids, bases, water, fuels, and especially petrochemicals.

03/05/2020

Master Bond EP17HTS-DA is a one component, no mix, die attach epoxy that is electrically conductive and withstands high temperatures

12/20/2019

Master Bond EP30DPBFMed is a two part, flexibilized epoxy-urethane hybrid system that can be used for bonding, sealing, coating, and encapsulation. It is formulated for disposable and reusable medical devices, meeting USP Class VI requirements.

10/14/2019

Master Bond Supreme 121AO is a NASA low outgassing approved epoxy suitable for bonding, sealing and potting applications.

10/01/2019

Master Bond Supreme 112 is a new two part epoxy for bonding, sealing, potting, and impregnation applications.

09/01/2019

Master Bond UV10TK40M is a one part UV curable system, which is not oxygen inhibited, and can be used for bonding, sealing and coating applications.

07/23/2019

Master Bond EP21TP-2NV is a two part epoxy polysulfide formulated for use as an adhesive, sealant and potting system.

06/25/2019

Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is a new single component epoxy initially designed for glob top and chip coating applications.

06/06/2019

“This thermally stable formulation has a high glass transition temperature of 410°F (210°C) and retains its bond strength at elevated temperatures,” says Rohit Ramnath, senior product engineer.

04/23/2019

Master Bond UV22DC80-1Med is a single component, nanosilica filled compound featuring a UV and heat curing mechanism.

04/08/2019

Master Bond EP30NG is a two part epoxy adhesive system developed for applications that require high thermal conductivity.

03/13/2019

Master Bond Supreme 3HTS-80 is a one part, silver filled epoxy adhesive that is not premixed and frozen and features an unlimited working life at room temperature.

02/26/2019

Master Bond EP93AOFR is a two part, flame retardant epoxy that may be used in encapsulation and potting applications, as well as in bonding, sealing and coating.

02/05/2019

Master Bond LED405Med is a one part, nanofilled system that cures quickly upon exposure to a 405 nm LED light. It does not require a UV light source.

01/09/2019

EP3UF-1 is a single component epoxy that is not premixed and frozen. It delivers high bond strength and dimensional stability.

10/01/2018

Master Bond EP41S-6 is a new two component epoxy system that meets UL 1203, which is defined by Underwriters Laboratories as the “Standard for Explosion-Proof and Dust-Ignition-Proof Electrical Equipment for Use in Hazardous (Classified) Locations”.

08/06/2018

Master Bond EP70CN is a two part, thermally stable epoxy adhesive formulated using a natural, renewable and sustainable ingredient.

07/26/2018

Master Bond EP21ND-LP was created for structural bonding applications involving large surface areas.

06/27/2018

Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses.

06/06/2018

Master Bond Supreme 62-1 has superior toughness, which makes it suitable for bonding substrates with different coefficients of thermal expansion.

05/14/2018

Silver filled epoxy adhesive system Master Bond EP3HTSDA-2 was developed for crucial thermal management applications.

04/04/2018

Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy that has a mixed viscosity of 150-300 cps.

03/07/2018

Master Bond MasterSil 170 Gel is a two component system with excellent flowability for potting and encapsulation applications.

01/30/2018

Master Bond EP42HT-3AO is a two component, moderate viscosity epoxy system with good flow properties. It is ideal for small to moderate size encapsulating, potting and casting applications.

01/09/2018

Master Bond UV22DC80-10F is a single component, nanosilica filled compound featuring a UV and heat curing mechanism.

12/12/2017

Master Bond Supreme 34CA is a high strength structural epoxy adhesive featuring superior resistance to aggressive chemicals such as acids, bases, solvents and oils.

11/27/2017

Master Bond MasterSil 151TC was developed to improve thermal management for electronic assemblies in bonding and gap filling applications.

10/10/2017

Developed for potting, sealing, encapsulation and casting applications, Master Bond EP110F8-5 is dimensionally stable and has low shrinkage upon cure.

09/19/2017

Featuring a low coefficient of thermal expansion (CTE) of 15-20 x 10-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications.

08/29/2017

Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for bonding and sealing.

08/09/2017

Master Bond X21Med is a one part system that can be used for bonding and priming polyolefinic surfaces.

06/08/2017

Two component epoxy system meets Airbus standards

05/18/2017

Master Bond EP62-1BF protects against many aggressive chemicals, even at elevated temperatures.

02/21/2017

Master Bond EP30LP-2 is a two component epoxy with a low viscosity and a volume resistivity of over 1014 ohm-cm, making it well suited for potting and encapsulation applications. This high performance system can also be used for bonding and sealing.

01/31/2017

Formulated for use in demanding thermal management applications, Master Bond EP30TC is a two component epoxy that contains a robust thermally conductive filler with very fine particle sizes.

01/10/2017

Master Bond EP3HTND-2Med Black is a high strength, fast curing epoxy for use in the assembly of medical devices.

12/13/2016

Certified to meet ASTM E595 NASA low outgassing standards, Master Bond EP46HT-2AO Black is well suited for the aerospace, electronic, opto-electronic industries and can be used vacuum environments.

11/21/2016

Master Bond X5TC is an elastomeric system that has a thermal conductivity of 10-12 BTU•in/ft2•hr•°F [1.44-1.73 W/m•K] while maintaining solid electrical insulation properties.

10/31/2016

Widely used in the electronic, aerospace, optical and specialty OEM industries, Master Bond EP126 excels in high temperature applications up to +600°F.

09/12/2016

Formulated for specific optical applications, Master Bond EP30-2LB blocks UV light from 200-400 nm and allows the transmission of visible light from 450-900 nm.

08/22/2016

Featuring a nickel filler, Master Bond EP21TDCN-LO is an electrically conductive two component adhesive/sealant that is particularly effective for grounding, shielding and static dissipation applications.

08/02/2016

Formulated for bonding, sealing, coating and encapsulation applications, Master Bond EP41S-5 is a room temperature curing epoxy that combines a high strength profile, superior electrical insulation values and exceptional chemical resistance.

07/11/2016

Master Bond EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance of 5-7 x 10-6 K•m2/W.

06/20/2016

Master Bond UV22DC80 is a one component, low viscosity, nanosilica filled epoxy based system for bonding, sealing and coating with the ability to cure under UV light and/or with heat.

05/09/2016

Master Bond EP3HTS-LO is a single component epoxy for demanding bonding, sealing and coating applications.

04/25/2016

Master Bond EP113 is a nanosilica filled epoxy that delivers enhanced dimensional stability and exceptionally low shrinkage upon curing.

03/16/2016

Master Bond Supreme 45HTQ-4 is a two component, toughened, silicon carbide filled epoxy for high performance bonding, sealing and casting.

01/11/2016

Master Bond Supreme 18TC is a cutting edge material pertaining to the thermal management of epoxies.

12/14/2015

Developed for high tech bonding and sealing applications, Master Bond Supreme 11HTLP is a two part epoxy that combines user friendly processing with a high physical strength profile.

11/23/2015

MasterSil 972TC-LO is capable of transferring heat while retaining superior dielectric properties. It passes the rigorous requirements for low outgassing per ASTM E595 specifications.

11/02/2015

Master Bond UV15DC80Med is a special dual cure epoxy based system that offers a primary cure using UV light along with a secondary heat curing mechanism. This extraordinary compound also meets USP Class VI specifications and passes ISO 10993-5 testing.

10/13/2015

One component epoxy system for potting, encapsulation, bonding and sealing applications with a curing temperature of 200-220°F or higher.

09/24/2015

One part, fluorosilicone system for high performance bonding, sealing & coating with enhanced chemical resistance

08/31/2015

Master Bond EP21NDCL is a unique two component epoxy system that cures optically clear in thin sections, even though Part A is translucent and Part B is light amber.

08/10/2015

One component epoxy system for bonding, sealing, potting and encapsulation applications featuring curing temperatures of 175-180°F or higher.

07/23/2015

Widely used for applications in the aerospace, electronic and OEM industries, Master Bond EP121CL-LO is a high performance epoxy that passes ASTM E595 testing for NASA low outgassing specifications.

06/29/2015

Serviceable up to +500°F, EP13SPND-2 is a one part epoxy paste for structural bonding applications.

06/09/2015

MasterSil 912Med is a specially formulated RTV silicone system for bonding, sealing and coating primarily for medical devices.

05/18/2015

Master Bond EP21TPFL-1AO is an electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m•K)].

04/27/2015

Master Bond Supreme 10HTF-1 combines very fast curing and simple handling properties with a superior performance profile. It has a smooth paste consistency and is easy to apply.

04/06/2015

Master Bond EP48TC is a breakthrough material pertaining to thermal management applications of epoxies. It utilizes a unique combination of special high thermal conductive fillers and is capable of being applied in bond lines as thin as 10-15 microns.

03/16/2015

MasterSil 920-LO is a specialty type, high performance, RTV silicone for sealing, coating and small encapsulations.

02/23/2015

Two component epoxy system meeting FAR standard 14 CFR 25.853(a) for flame retardancy

02/16/2015

Featuring an exceedingly low coefficient of thermal expansion of 9-12 x 10-6 in/in/°C, EP42HT-2LTE is a two component epoxy for bonding, sealing, coating and select casting applications.

01/30/2015

Two component, high performance epoxy system features convenient handling along with excellent temperature and chemical resistance.

09/07/2010

Combining the benefits of epoxy resins and polyurethanes, Master Bond Polymer System EP30D-7 offers superior strength, flexibility, abrasion resistance and toughness.