Flexible / Dampening Polysulphide Adhesives and Sealants
from Master Bond, Inc.
Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room... [See More]
- Features: Flexible
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
from Master Bond, Inc.
Master Bond Polymer Adhesive EP21TP-2 is a two component polysulfide/epoxy based adhesive/sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than lOOO psi at room... [See More]
- Features: Flexible
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
from Master Bond, Inc.
Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F which gives it a higher resistance to elevated temperatures than most polysulfide systems. [See More]
- Features: Non-corrosive; Flexible
- Gap Fill: 0.0040 to 0.0060
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
from Master Bond, Inc.
Master Bond Polymer Adhesive EP21TPLV is a two component low viscosity, exceptionally tough epoxy polysulfide composition formulated to cure quickly at ambient temperature and even more rapidly at elevated temperatures with a noncritical, user-friendly one-to-one mix ratio, weight or volume. It... [See More]
- Features: Flexible
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood