Dissimilar Substrates Polysulphide Adhesives and Sealants
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Cure / Technology: Thermoset; Single Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
- Features: Non-corrosive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer Adhesive EP21TPND is a two component polysulfide/epoxy based adhesive/ sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than 1000 psi at room... [See More]
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: Flexible
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
from Master Bond, Inc.
Master Bond Polymer Adhesive EP21TP-2 is a two component polysulfide/epoxy based adhesive/sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than lOOO psi at room... [See More]
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: Flexible
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
from Master Bond, Inc.
Master Bond Polymer System EP30LV is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a five (5) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Use Temperature: -65 to 200
from Master Bond, Inc.
Master Bond EP21TPFL-1AO is an electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 9-10 BTU •in/ft2 •hr • °F [1.30-1.44 W/(m •K)]. As a polysulfide based system, it has very good chemical resistance, particularly to fuels, oils, hydraulic... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: Non-corrosive
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F which gives it a higher resistance to elevated temperatures than most polysulfide systems. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Features: Non-corrosive; Flexible
- Gap Fill: 0.0040 to 0.0060
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
from Master Bond, Inc.
Master Bond Polymer Adhesive EP21TPLV is a two component low viscosity, exceptionally tough epoxy polysulfide composition formulated to cure quickly at ambient temperature and even more rapidly at elevated temperatures with a noncritical, user-friendly one-to-one mix ratio, weight or volume. It... [See More]
- Cure / Technology: Thermoset; Two Component
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Features: Flexible
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
from Master Bond, Inc.
Master Bond Polymer Adhesive EP21FLV is a fast curing two component epoxy adhesive for general purpose bonding, sealing, and coating formulated to cure at room temperature with a one-to-one mix ratio, weight or volume. It quickly develops a high bonding strength of more than 3000 psi at room... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Dissimilar Substrates
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Thermal Conductivity: 0.2880 to 0.4320