Diamond Chemical Mechanical Planarization (CMP) Slurries

The Lapmaster range of diamond slurries has been formulated for use on many different types of lapping plates and polishing pads. The slurries can be hand sprayed onto the lapping/polishing platen or applied by an electronic dispensing system to control cost and reduce waste. Many Lapmaster diamond... [See More]

• Compound / Abrasive Type: Diamond
• Form: Slurry

• Type: Lapping; CMP / Wafer Planarization
• Grit Size: 0.1000 to 45