Silver / Silver Alloy Thick Film Materials
from MacDermid Alpha Electronics Solutions
Product Overview. LPHA Argomax 2010C Paste is a specially designed sintering paste for high-volume, low-pressure sintering die attach. It promotes consistent, uniform printing and long stencil life, even for large dies. Formulated for printing on Ag/Au surfaces and designed for die placement on... [See More]
- Material: Silver
- Applications: Die Bonding; Semiconductors
- Thick Film Type: Conductor
from MacDermid Alpha Electronics Solutions
Product Overview. The ALPHA ® Argomax ® 2020 Paste is a high-performance silver sinter paste used in applications that require excellent thermal and electrical conductivity. This paste is particularly suited for die-attach and power module assembly in industries such as automotive,... [See More]
- Material: Silver
- Applications: Die Bonding; Semiconductors
- Thick Film Type: Conductor
from MacDermid Alpha Electronics Solutions
Product Overview. Argomax ® AccuLam ™ is ideal for spacer attach applications lacking flat, sharp edges required for standard Die Transfer Film (DTF) processes. It offers typical Argomax reliability while enabling lower temperature and pressure lamination, which results in faster... [See More]
- Material: Silver
- Applications: Die Bonding; Semiconductors
- Thick Film Type: Conductor