Automatic Semiconductor Wire and Wedge Bonders
2 Results
EFO Wands
from Suntech Applied Materials (Hefei) Co.,Ltd
from Suntech Applied Materials (Hefei) Co.,Ltd
Material Made up of Iridium, platinum , Iridium alloy & Stainless Steel. Features The EFO wand is essential in applications requiring high precision and controlled energy delivery for precise bonding and wire placement in microelectronic components. Superior electrode material assures the lifespan... [See More]
- Automation: Automatic Wire Bonder
- Wire Bonder Type: Wedge Bonder
Fine Wire Wedge and Ribbon Bonder -- Palomar 9000
from Palomar Technologies, Inc
from Palomar Technologies, Inc
Overview. The Palomar 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder with optional interchangeable clamps for 45-60 ° and 90 ° deep access bonding on a single machine. The large 304 x 152mm work area provides users flexibility to work with many different work holder... [See More]
- Automation: Automatic Wire Bonder
- Wire Bonder Type: Wedge Bonder