Product Announcements:
CPU Coolers

Tone Cooling FSW liquid cold plates deliver efficient thermal management for high-power electronic and industrial systems. Featuring large flow channels, leak-proof construction, and customizable designs, they provide reliable heat dissipation and long-term performance in demanding applications. Read more...

AlSiC pin fin coolers deliver efficient heat dissipation for IGBT modules, combining high thermal conductivity and optimized airflow design to improve reliability and performance in high-power electronic systems. Read more...

Liquid cooling plates designed for Sunway CPUs provide efficient thermal management for data centers, HPC systems, and enterprise computing infrastructure. Read more...

A tailored aluminum heat sink designed for NVIDIA A100 GPUs, delivering optimized cooling, enhanced performance, and extended lifespan in high-performance computing systems. Read more...

Custom liquid cooling plate for NVIDIA GB200 Superchip ensures efficient heat dissipation, peak GPU performance, and extended lifespan. Ideal for AI, HPC, and high-density computing environments requiring reliable thermal management. Read more...

Tailored heat sinks, liquid cooling, and thermal management solutions designed to optimize server performance and prevent overheating. Read more...

Efficient thermal dissipation for IGBT modules. Ideal for power electronics, automotive, and renewable energy systems. Available in various sizes to fit different configurations. Read more...

In the fields of high-performance computing, gaming, and content creation, NVIDIA GPUs are the preferred choice for many users due to their powerful graphics processing capabilities and exceptional performance. Read more...

FSW (Friction Stir Welding) liquid cold plates are designed for thermal management in high-power systems, providing efficient heat dissipation, structural reliability, and customizable cooling solutions. Read more...

Thin vapor chamber heat spreader for servers and electronics, delivering fast heat spreading, low thermal resistance, and reliable cooling for high-power, space-constrained systems. Read more...