Products & Services
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Supplier: Win Source Electronics
Description: Status: Vendor Undefined
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Supplier: Win Source Electronics
Description: Status: Vendor Undefined
- Device Type: Sensor Interface
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Supplier: Win Source Electronics
Description: 1 MSL Level: 3 (168 Hours) REACH Status: Vendor Undefined
- Architecture: RISC
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1086069-PSB2163NV3.1G Category: Integrated Circuits (ICs)>Audio Special Purpose Series: * Package: Bulk Standard Package: 1,000 ECCN: 5A991B1 Fake Threat In the Open Market: 71 pct. MSL Level: 3 (168 Hours) REACH Status: Vendor Undefined HTSUS: 8542.39.0001 Mfr:
- Features: Audio Amplifiers
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Supplier: Broadcom Inc.
Description: This fourth-generation SAS RAID-on-Chip (ROC), based on its Fusion-MPT architecture, integrates the latest enhancements in SAS and PCIe technology. For OEMs and server vendors looking to build enterprise-class data protection and throughput into their entry to mid-range servers, the
- Maximum Data Transfer Rate: 12,000 MB/Sec
- On-board Processor Speed: 1,200 MHz
- Maximum Cache: 512 MB
- Number of Channels: 16
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Supplier: Broadcom Inc.
Description: This fourth-generation SAS RAID-on-Chip (ROC), based on its Fusion-MPT architecture, integrates the latest enhancements in SAS and PCIe technology. For OEMs and server vendors looking to build enterprise-class data protection and throughput into their entry to mid-range servers, the
- Maximum Data Transfer Rate: 12,000 MB/Sec
- On-board Processor Speed: 1,200 MHz
- Maximum Cache: 512 MB
- Number of Channels: 24
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Supplier: Broadcom Inc.
Description: The latest server designs and solid state drives continue to drive demands for optimum storage performance. For OEMs and server vendors looking to build enterprise-class data protection and throughput into their entry to mid-range servers the SAS 3108 RAID-on-Chip (ROC) is a natural
- Maximum Data Transfer Rate: 12,000 MB/Sec
- Features: Other
- RAID Level Supported: RAID 1, RAID 10, RAID 5, RAID 50, RAID 0
- Disk Channel: SATA
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Supplier: TechInsights Inc.
Description: communications chips, network processors, access processors, broadband interface chips, and much more. We help clients understand the market for these devices, the strategies of the vendors, key differentiators for each product, and how to select the right device or product
- Discipline: Biomedical Engineering, Computer Engineering, Electronic Engineering, Software Engineering
- Management Services: Business Consulting, Communication Services, Project Management
- Features: Canada Only, Other Regional Preference
- Industry Served: Computer Systems, Electrical / Electronics, Network / Communications
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: HPE 3.84TB SAS 12G Read Intensive SFF SC Multi Vendor SSD Product overview: P49034-B21 from Hewlett Packard Enterprise is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for
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Supplier: Microchip Technology, Inc.
Description: twisted-pair receiver with on-chip adaptive equalizer and baseline wander (BLW) correction, clock and data recovery, and Media Independent Interface (MII). The LAN83C185 is fully compliant with IEEE 802.3/802.3u standards and supports both 802.3u-compliant and vendor-specific register
- Operating Temperature: 70 C
- Supply Voltage: 3.3 volts
- Features: Other
- Package Type: Surface Mount Technology (SMT)
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Supplier: Infineon Technologies AG
Description: 1x1 Single-band Wi-Fi 4 (802.11n) + Bluetooth® 5.2 combo Infineon’s AIROC™ CYW43364 features 1x1 single-band 2.4 GHz Wi-Fi 4 (802.11n). When coupled with external MCUs from popular vendors or Linux on application processors the CYW43364 implements a complete Wi-Fi system. Summary of Features
- TJ: -30 to 70 C
- Technology: Bluetooth
- Features: Other, RoHS Compliant, SPI
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Supplier: Richardson RFPD
Description: The AD-FMCOMMS2-EBZ is a high-speed analog module designed to showcase the AD9361, a high performance, highly integrated RF transceiver intended for use in RF applications, such as 3G and 4G base station and test equipment applications, and software defined radios. Its programmability and
- Category: Development Board
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Supplier: Microchip Technology, Inc.
Description: +95°C. In addition, this device has an internal 256 Byte EEPROM which can be used to store memory module and vendor information. Additional Features Meets JEDEC Specification JC42.4 Temperature Sensor + 2 Kbit Serial EEPROM EEPROM for Serial Presence Detect (SPD) Optimized for Voltage Range:
- Operating Temperature: -40 to 125 C
- Memory Category: EEPROM
- Features: Other
- Package Type: SSOP
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Supplier: Microchip Technology, Inc.
Description: configurable via hardware and software, supporting both IEEE 802.3-2005 compliant and vendor-specific register functions via SMI. The LAN8810/LAN8810i implements Auto-Negotiation to automatically determine the best possible speed and duplex mode of operation. HP Auto-MDIX support allows the
- Operating Temperature: -40 to 85 C
- Supply Voltage: 1.2 volts
- Features: Other
- Package Type: Surface Mount Technology (SMT)
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Supplier: Advanced Assembly, LLC.
Description: the top component and board suppliers in the industry, so we can streamline your entire PCB process. Our turnkey PCB assembly process means: No need for multiple vendors, pieces or parts. One purchase order and one price. No worrying whether you have the right number of parts. Smoother, more
- Testing Services: Agency Compliance Testing, Analytical Laboratory Testing, Functional Testing
- Manufacturing: Flexible Printed Circuit Board Assembly, Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Surface Mount Assembly, Through Hole Assembly
- Production Capabilities: High Volume, Mid Volume, Prototype / Low Volume, Quick Turn
- Features: North America, Other, United States Only
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Cornell Dubilier’s XMPL Series Polymer Chip Capacitor series has been expanded to match applications requiring higher voltage and/or capacitance requirements. With very low ESR and robust ripple current ratings, they will easily outperform surface mount (read more)
Browse Capacitors Datasheets for Cornell Dubilier -
equipment, barcode scanners, advanced metering boxes, and battery backup systems. The MOSFETs can balance two to four supercaps with very small voltage differences and dissipate no power beyond the actual leakage current differences between the two cells. When VIN = 3.0 V is (read more)
Browse Metal-Oxide Semiconductor FET (MOSFET) Datasheets for Advanced Linear Devices, Inc. -
ML3G is a non-contact tool measurement system designed to control any type of tool directly on machine. The main feature of a “non-contact” tool setter is that the measurement is performed by interrupting a laser beam instead of mechanical contact with a stylus. This (read more)
Browse Optical Micrometers and Laser Micrometers Datasheets for Marposs Corp -
XMWT80L1G is a flip-chip, surface-mountable 50 Ω termination with a power rating of 0.5 Watts (AVG) and a peak-to-average ratio of 12 dB. This thick film ALN component has industry-leading bandwidth of DC-81 GHz and is (read more)
Browse RF Terminations Datasheets for Richardson RFPD -
With the launch of the IEP3, FAULHABER expands its product line with an incremental encoder which, thanks to the latest chip technology, achieves a very high resolution and accuracy. With a diameter of just 8 mm, the IEP3 is very lightweight and compact yet still (read more)
Browse Incremental Rotary Encoders Datasheets for FAULHABER MICROMO -
are RTD Platinum sensors without leads suitable for automatic assembling on PCB by soldering and bonding. Depending on the connection process and the required temperature range you could choose between the different types: FlipChip 0402 -> 3FC (read more)
Browse Temperature Sensor Chips Datasheets for Innovative Sensor Technology IST USA Division -
filter constructions that replace larger form factor circuit board constructions. Tight fabrication tolerances allow for less unit-to-unit variation than traditional filter technologies. The MFBP-00081CSP3 is available in our 3.5 x 3.5mm CSP3 chip scale package (read more)
Browse RF Band Pass Filters Datasheets for Marki Microwave LLC -
Sumida launches the WCNFC Series of wound chip structured DC common mode choke coils, featuring very low profile and compact SMD designs ranging from 1.4 x 1.2 x 0.9mm to 4.7 x 3.4 x 3.0mm. These choke coils deliver superior EMI suppression with minimal impact on high-speed differential data (read more)
Browse Inductors, Coils, and Chokes Datasheets for New Yorker Electronics Co., Inc. -
Vishay Intertechnology has introduced the Sfernice S2F and S3F thin film chip fuse series, designed to deliver low resistance, dependable circuit continuity, and precise overload protection. Available in 0402, 0603, and 1206 case sizes, the UL 248-14 compliant fuses support currents from 0.315 A (read more)
Browse Fuses Datasheets for New Yorker Electronics Co., Inc. -
Cornell Dubilier’s XMPL Series Polymer Chip Capacitors deliver high-performance energy storage in a compact SMD footprint (7.3×4.3×1.9mm). Available in 6.8µF to 470µF values and up to 35VDC, they feature solid polymer dielectric for very low ESR, robust ripple (read more)
Browse Capacitors Datasheets for New Yorker Electronics Co., Inc.
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Using Serial RapidIO (R) to Optimize Baseband Interconnect in DSP-based 3G Base Stations
. The standard interface between network elements creates a more open competitive environment, driving down costs. The constant pressure to reduce the cost of 3G infrastructure has also provided a catalyst for interface standardization within the Node B, and specifically on the baseband card, which represents
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
chip markets. The RF chip maker is also reportedly working on a 3G chip with Motorola. U.K. academics invent form of "spintronic " logic Researchers from Imperial College London, Durham University and the University of Sheffield have developed a technology they have named "magnetic domain-wall logic
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
annual growth rates in the next four years, according to some analysts. Qualcomm rolls out chip set for entry-level 3G handsets SAN DIEGO -- Qualcomm Inc. here rolled out an entry-level chip set for third-generation (3G) handsets, based on code-division multiple access (CDMA) technology. Based
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
disk drive chip business for $100 million North America is key to Israeli DSL supplier Metalink's Q4 revenue growth Intel forum to map three-front battle for processor platforms Amkor, suppliers tackle testing bottlenecks for 5-GHz chip package Ericsson, Intel to define new flash memories for 3G cell
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Ericsson readies a common 3G platform, urges China to award licenses Future Horizons goes back to 18% growth forecast for ICs The Week in Review: November 23 to 29 Dubai pulls the plug on German foundry, says report Citigroup reportedly offers $430 million for non-memory Hynix Strong October chip
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
announced an agreement to acquire the smart card subsidiary of Groupe Bull S.A. for $325 million. Qualcomm announces chip for W-CDMA, but then blasts the 3G standard SAN FRANCISCO -- Qualcomm Inc. here announced one of the world's first digital-cellular chip sets for wideband code-division multiple
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
two years, according to the Associated Press. Some 14,000 jobs would be slashed in Japan, while the remaining positions would be cut overseas, the report said. In total, Toshiba employs about 190,000 workers. Heard on the Street (Aug. 24) Heard on the Street (Aug. 24) Wiscon to supply chip sets
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Designs Ltd., a small UK start-up with a massively parallel approach to 3G baseband processing, already claims to have its PC101 chip in evaluation with at least one "tier one " supplier of 3G basestations. However as Intel steps forward with its own reconfigurable and parallel baseband
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Comsys Unveils Novel Architecture for W-CDMA base-band Intellectual Property
LiteCore Enables Chip Vendors to Produce Lower Cost 3G Chips .
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TTPCom and ARM colloborate on complete IP Platforms for Multimode, 3G Baseband Designs
The new platforms will significantly reduce engineering effort and time-to-market for semiconductor vendors developing 3G system-on- chip (SoC) solutions.
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4G/LTE chips coming . . . but first, a little chaos
Gone are the days when baseband chip vendors could continuously hold onto their existing 3G /2G solutions -- many of them hard-wired.
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TTPCom announces complete technology suite for the development of 3G terminals
For silicon vendors TTPCom offers 3G intellectual property (IP) in the form of baseband and radio chip designs.
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Market Focus: DSP makers' forward spin on the market
Chipset vendors are sanguine about 3G technology because it will require more powerful, more expensive chips , said Andy Fuertes, an analyst at Allied Business Intelligence, Oyster Bay, N.Y.
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Spreadtrum Communications Licenses ParthusCeva High Performance TeakLite DSP Core Technology
The company provides 2.5G, 3G base band chip set, protocol stack software, application software, and total solution for wireless equipment manufactures, mobile terminal vendors , and semiconductor companies.
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Spreadtrum Launches World's First Chinese 3G Chipset Powered By CEVA-Teak DSP Core
The company provides 2G, 2.5G, 3G base band chip set, protocol stack software, application software, and total solutions for wireless equipment manufactures, mobile terminal vendors , and semiconductor companies.
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Spreadtrum Commences Shipments Of GSM/GPRS Chip Powered By CEVA-TeakLite DSP Core To Chinese Market
The company provides 2.5G, 3G base band chip set, protocol stack software, application software, and total solution for wireless equipment manufactures, mobile terminal vendors , and semiconductor companies.