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Supplier: Win Source Electronics
Description: Win Source Part Number: 1349725-BMB2A1000BN3 Category: Filters - Ferrite Beads and Chips Series: BMB-B Package: Tape & Reel Size / Dimension: 0.079" L x 0.047" W (2.00mm x 1.20mm) Current Rating (Max): 200mA Standard Package: 4,000 Height (Max): 0.043" (1
- Bead Form Factor: Chip
- DCR: 0.8000 ohms
- Impedance Range: 1000 ohms
- Operating Temperature: -55 to 125 C
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Supplier: Win Source Electronics
Description: Win Source Part Number: 1038265-35503K3JT Category: Resistors>Chip Resistor - Surface Mount Series: 3550, CGS Package: Tape & Reel Height - Seated (Max): 0.047" (1.20mm) Standard Package: 1,000 Tolerance: ±5% Temperature Coefficient: ±100ppm/°C
- Operating Temperature: -55 to 155 C
- Power Rating: 5 watts
- Resistance Range: 3300 ohms
- Technology / Construction: Metal Film, Thick Film
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Supplier: Win Source Electronics
Description: Manufacturer: TE Connectivity Passive Product Win Source Part Number: 1326390-35404R3FT Category: Resistors>Chip Resistor - Surface Mount Packaging: Reel - TR Size / Dimension: 0.280" L x 0.165" W (7.10mm x 4.20mm) Height - Seated (Max): 0.047" (1.20mm) Standard
- Operating Temperature: -55 to 155 C
- Packing Method: Tape Reel, Other
- Power Rating: 4 watts
- Resistance Range: 4.3 ohms
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Supplier: Win Source Electronics
Description: Market: 85 pct. MSL Level: 3 (168 Hours) REACH Status: Vendor Undefined HTSUS: 0000.00.0000 Mfr: Infineon Technologies Other Names: 2156-PSB21653EV1.4-G ,LANINFPSB21653EV1.4 -G RoHS Status: Not applicable
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Supplier: Advanced Assembly, LLC.
Description: multiple vendors, pieces or parts. One purchase order and one price. No worrying whether you have the right number of parts. Smoother, more efficient assembly. We are accountable for the entire process! To ensure perfect operational functionality
- Location: North America, United States Only
- Manufacturing: Printed Circuit Board Assembly, Flexible Printed Circuit Board Assembly, Rigid-Flexible Printed Circuit Board Assembly, Through Hole Assembly, Surface Mount Assembly, Other
- Material Acquisition: Vendor Supplied
- Production Capabilities: Prototype / Low Volume, Mid Volume, High Volume, Quick Turn
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Supplier: Broadcom Inc.
Description: The latest server designs and solid state drives continue to drive demands for optimum storage performance. For OEMs and server vendors looking to build enterprise-class data protection and throughput into their entry to mid-range servers the SAS 3108 RAID-on-Chip (ROC) is a natural
- Disk Channels Interface: SATA, Other
- Host Interface: Other
- Maximum Data Transfer Rate: 12000 MB/Sec
- RAID Level Supported: RAID 0, RAID 1, RAID 5, RAID 10, RAID 50, Other
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Supplier: RS Components, Ltd.
Description: enables the storage of memory module and vendor details. Applications include DIMM modules, laptops, PCs and servers. Sensor Function = Temperature Output Type = Digital Interface Type = Serial-I2C, SMBus Accuracy = ±3°C Mounting Type = Surface Mount Pin Count = 8
- Input (Supply) Voltage: 2.7 volts
- Operating Temperature: -40 to 125 C
- Sensor Type: Temperature Sensor
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Supplier: Microchip Technology, Inc.
Description: ±0.5°C/±1°C (typical/maximum) from +75°C to +95°C. In addition, this device has an internal 256 Byte EEPROM which can be used to store memory module and vendor information. Additional Features Meets JEDEC Specification JC42.4 Temperature Sensor + 2 Kbit Serial
- IC Package Type: SSOP, Other
- Memory Category: EEPROM
- Operating Temperature: -40 to 125 C
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Supplier: RS Components, Ltd.
Description: enables the storage of memory module and vendor details. Applications include DIMM modules, laptops, PCs and servers. Sensor Function = Temperature Output Type = Digital Interface Type = Serial-I2C, SMBus Accuracy = ±3°C Mounting Type = Surface Mount Pin Count = 8
- Input (Supply) Voltage: 2.7 volts
- Operating Temperature: -40 to 125 C
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Supplier: Infineon Technologies AG
Description: -band (2.4 GHz) 1x1 SISO 20 MHz channels, up to 96 Mbps PHY data rate Integrated internal PA, LNA, and T/R switch General features SDIO v2.0, gSPI Host Interface WPA2 Coexistence 3-wire
- Features: RoHS Compliant
- Interface: SPI, Other
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Supplier: Microchip Technology, Inc.
Description: the Motor Control Library featured in HarmonyV3 Supported by MPLAB X IDE, and MPLAB Harmony. In addition, external tools from vendors KEIL and IAR are also supported. Functional Safety This device supports the IEC 61508 (SIL 2/3) Functional Safety standard. · To
- IC Package Type: Other
- Operating Temperature: -40 to 85 C
- Pin Count: 26
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Supplier: Infineon Technologies AG
Description: +1, 6+2, 5+3, or 4+4 phases are supported. Command and monitoring functions are controlled through the PMBus and SVID interfaces which supports dynamic voltage identification with 5 mV/step or 10 mV/step in Intel mode, output range up to 3.04 V, offset and trim resolution of 625 uV and
- IC Package Type: Other
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Supplier: TechInsights Inc.
Description: , communications chips, network processors, access processors, broadband interface chips, and much more. We help clients understand the market for these devices, the strategies of the vendors, key differentiators for each product, and how to select the right device or product
- Discipline: Biomedical Engineering, Computer Engineering, Electronic Engineering, Software Engineering
- Industry Served: Computer Systems, Electrical / Electronics, Network / Communications
- Location: Canada Only, Other Regional Preference
- Management Services: Business Consulting, Communication Services, Project Management
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Supplier: Richardson RFPD
Description: The AD-FMCOMMS2-EBZ is a high-speed analog module designed to showcase the AD9361, a high performance, highly integrated RF transceiver intended for use in RF applications, such as 3G and 4G base station and test equipment applications, and software defined radios. Its
- Category: Development Board
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Description: Class F as specified in ISO/IEC 11801 (2002), it eliminates the need for implementation of the complex functions specified in ISO/IEC 8802-3 that cancel the effects of crosstalk and return loss. This provides a solution that can operate at a much lower power level, and that can be implemented
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Description: Class F as specified in ISO/IEC 11801 (2002), it eliminates the need for implementation of the complex functions specified in ISO/IEC 8802-3 that cancel the effects of crosstalk and return loss. This provides a solution that can operate at a much lower power level, and that can be implemented
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Supplier: Advantech
Description: System On Chip up to 8 cores Processor 2x 1GbE RJ45 implemented by Intel i210 for management 4x 1GbE RJ45 by Marvell with 2 segment advanced LAN bypass support Multiple storage options depends on system performance requirement Tested and Certified by key software vendors for universal
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Supplier: Microchip Technology, Inc.
Description: -shaping and output driver, twisted-pair receiver with on-chip adaptive equalizer and baseline wander (BLW) correction, clock and data recovery, and Media Independent Interface (MII). The LAN83C185 is fully compliant with IEEE 802.3/802.3u standards and supports both
- Form Factor / Package: Surface Mount Technology (SMT), Other
- Operating Temperature: Up to 70 C
- Supply Voltage: 3.3 volts
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Supplier: CSA Group
Description: Class F as specified in ISO/IEC 11801 (2002), it eliminates the need for implementation of the complex functions specified in ISO/IEC 8802-3 that cancel the effects of crosstalk and return loss. This provides a solution that can operate at a much lower power level, and that can be implemented
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Supplier: Cirrus Logic, Inc.
Description: CobraNet® technology has established itself as the product of choice for multi-vendor networked audio. The EV-2 provides a means of easily evaluating CM-2 CobraNet modules. It also provides an example CobraNet interface and can be used as a development platform for Cobra
- Number of Channels: 2 #
- Sampling Frequency: 48 to 96 kHz
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Supplier: Broadcom Inc.
Description: in-distribution driver support with leading OS vendors Key Features Combinations of 16GFC and 8GFC and/or 10GbE, or a single 40GbE port PCIe 3.0 bus interface Virtualization and cloud scalability features to support up to 255 VFs,* 2048
- Device Type / Applications: Line / Bus Controller
- IC Package Type: FCBGA
- RoHS Compliant: Yes
- Supply Voltage: 1.2 V, 1.8 V, Other
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Supplier: ASTM International
Description: only when the failure distribution can be described by a log-Normal distribution. 1.2 This test method is intended for use as a referee method between laboratories and for comparing metallization alloys and metallizations prepared in different ways. It is not intended for qualifying vendors
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Supplier: Microchip Technology, Inc.
Description: , High-Speed Inter-Chip (HSIC) USB Electrical Specification Revision 1.0, and will attach to an upstream port as a Full-Speed hub or as a Full-/Hi-Speed hub. The 3-port hub supports Low-Speed, Full-Speed, and Hi-Speed (if operating as a Hi-Speed hub) downstream devices on all of the
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Supplier: Advanced Assembly, LLC.
Description: : No need for multiple vendors, pieces or parts. One purchase order and one price. No worrying whether you have the right number of parts. Smoother, more efficient assembly. We are accountable for the entire process! To ensure perfect
- Location: North America, United States Only
- PCB Type: Single-Sided Boards, Double-Sided Boards, Multi-Layer Boards, Flexible Boards, Rigid-Flexible Boards, SMT Components, THT Components
- Supplier Capability: Prototype Quantities, Production Quantities, Testing and Evaluation, PCB Assembly
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Supplier: 4D Systems Pty. Ltd.
Description: , utilizing the CP2102 chip and special RESET circuitry, which is encapsulated into the USB connector at the end of the cable. The cable is RoHS compliant and is available with a 5pin female header (0.1"/2.54mm pitch) at TTL levels of 3.3V for RX and TX. The 5pin header is labeled with
- Display Type: Graphic Display
- Technology: Thin Film Transistor (TFT)
![Standard Test Method for Estimating Electromigration Median Time-to-Failure and Sigma of Integrated Circuit Metallizations [Metric] (Withdrawn 2009) -- ASTM F1260M-96(2003)](https://partimages.globalspec.com/14/2064/3517064_medium.png "Standard Test Method for Estimating Electromigration Median Time-to-Failure and Sigma of Integrated Circuit Metallizations [Metric] (Withdrawn 2009) -- ASTM F1260M-96(2003)")
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equipment, barcode scanners, advanced metering boxes, and battery backup systems. The MOSFETs can balance two to four supercaps with very small voltage differences and dissipate no power beyond the actual leakage current differences between the two cells. When VIN = 3.0 V is (read more)
Browse Metal-Oxide Semiconductor FET (MOSFET) Datasheets for Advanced Linear Devices, Inc. -
Cornell Dubilier’s XMPL Series Polymer Chip Capacitor series has been expanded to match applications requiring higher voltage and/or capacitance requirements. With very low ESR and robust ripple current ratings, they will easily outperform surface mount (read more)
Browse Capacitors Datasheets for Cornell Dubilier -
ML3G is a non-contact tool measurement system designed to control any type of tool directly on machine. The main feature of a “non-contact” tool setter is that the measurement is performed by interrupting a laser beam instead of mechanical contact with a stylus. This (read more)
Browse Optical Micrometers and Laser Micrometers Datasheets for Marposs Corp -
XMWT80L1G is a flip-chip, surface-mountable 50 Ω termination with a power rating of 0.5 Watts (AVG) and a peak-to-average ratio of 12 dB. This thick film ALN component has industry-leading bandwidth of DC-81 GHz and is (read more)
Browse RF Terminations Datasheets for Richardson RFPD -
With the launch of the IEP3, FAULHABER expands its product line with an incremental encoder which, thanks to the latest chip technology, achieves a very high resolution and accuracy. With a diameter of just 8 mm, the IEP3 is very lightweight and compact yet still (read more)
Browse Incremental Rotary Encoders Datasheets for FAULHABER MICROMO -
are RTD Platinum sensors without leads suitable for automatic assembling on PCB by soldering and bonding. Depending on the connection process and the required temperature range you could choose between the different types: FlipChip 0402 -> 3FC (read more)
Browse Temperature Sensor Chips Datasheets for Innovative Sensor Technology IST USA Division -
filter constructions that replace larger form factor circuit board constructions. Tight fabrication tolerances allow for less unit-to-unit variation than traditional filter technologies. The MFBP-00081CSP3 is available in our 3.5 x 3.5mm CSP3 chip scale package (read more)
Browse RF Band Pass Filters Datasheets for Marki Microwave LLC -
Sumida launches the WCNFC Series of wound chip structured DC common mode choke coils, featuring very low profile and compact SMD designs ranging from 1.4 x 1.2 x 0.9mm to 4.7 x 3.4 x 3.0mm. These choke coils deliver superior EMI suppression with minimal impact on high-speed differential data (read more)
Browse Inductors, Coils, and Chokes Datasheets for New Yorker Electronics Co., Inc. -
Vishay Intertechnology has introduced the Sfernice S2F and S3F thin film chip fuse series, designed to deliver low resistance, dependable circuit continuity, and precise overload protection. Available in 0402, 0603, and 1206 case sizes, the UL 248-14 compliant fuses support currents from 0.315 A (read more)
Browse Fuses Datasheets for New Yorker Electronics Co., Inc. -
Cornell Dubilier’s XMPL Series Polymer Chip Capacitors deliver high-performance energy storage in a compact SMD footprint (7.3×4.3×1.9mm). Available in 6.8µF to 470µF values and up to 35VDC, they feature solid polymer dielectric for very low ESR, robust ripple (read more)
Browse Capacitors Datasheets for New Yorker Electronics Co., Inc.
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Using Serial RapidIO (R) to Optimize Baseband Interconnect in DSP-based 3G Base Stations
. The standard interface between network elements creates a more open competitive environment, driving down costs. The constant pressure to reduce the cost of 3G infrastructure has also provided a catalyst for interface standardization within the Node B, and specifically on the baseband card, which represents
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
chip markets. The RF chip maker is also reportedly working on a 3G chip with Motorola. U.K. academics invent form of "spintronic " logic Researchers from Imperial College London, Durham University and the University of Sheffield have developed a technology they have named "magnetic domain-wall logic
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
annual growth rates in the next four years, according to some analysts. Qualcomm rolls out chip set for entry-level 3G handsets SAN DIEGO -- Qualcomm Inc. here rolled out an entry-level chip set for third-generation (3G) handsets, based on code-division multiple access (CDMA) technology. Based
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
disk drive chip business for $100 million North America is key to Israeli DSL supplier Metalink's Q4 revenue growth Intel forum to map three-front battle for processor platforms Amkor, suppliers tackle testing bottlenecks for 5-GHz chip package Ericsson, Intel to define new flash memories for 3G cell
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Ericsson readies a common 3G platform, urges China to award licenses Future Horizons goes back to 18% growth forecast for ICs The Week in Review: November 23 to 29 Dubai pulls the plug on German foundry, says report Citigroup reportedly offers $430 million for non-memory Hynix Strong October chip
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
announced an agreement to acquire the smart card subsidiary of Groupe Bull S.A. for $325 million. Qualcomm announces chip for W-CDMA, but then blasts the 3G standard SAN FRANCISCO -- Qualcomm Inc. here announced one of the world's first digital-cellular chip sets for wideband code-division multiple
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
two years, according to the Associated Press. Some 14,000 jobs would be slashed in Japan, while the remaining positions would be cut overseas, the report said. In total, Toshiba employs about 190,000 workers. Heard on the Street (Aug. 24) Heard on the Street (Aug. 24) Wiscon to supply chip sets
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Designs Ltd., a small UK start-up with a massively parallel approach to 3G baseband processing, already claims to have its PC101 chip in evaluation with at least one "tier one " supplier of 3G basestations. However as Intel steps forward with its own reconfigurable and parallel baseband
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Comsys Unveils Novel Architecture for W-CDMA base-band Intellectual Property
LiteCore Enables Chip Vendors to Produce Lower Cost 3G Chips .
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TTPCom and ARM colloborate on complete IP Platforms for Multimode, 3G Baseband Designs
The new platforms will significantly reduce engineering effort and time-to-market for semiconductor vendors developing 3G system-on- chip (SoC) solutions.
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4G/LTE chips coming . . . but first, a little chaos
Gone are the days when baseband chip vendors could continuously hold onto their existing 3G /2G solutions -- many of them hard-wired.
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TTPCom announces complete technology suite for the development of 3G terminals
For silicon vendors TTPCom offers 3G intellectual property (IP) in the form of baseband and radio chip designs.
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Market Focus: DSP makers' forward spin on the market
Chipset vendors are sanguine about 3G technology because it will require more powerful, more expensive chips , said Andy Fuertes, an analyst at Allied Business Intelligence, Oyster Bay, N.Y.
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Spreadtrum Communications Licenses ParthusCeva High Performance TeakLite DSP Core Technology
The company provides 2.5G, 3G base band chip set, protocol stack software, application software, and total solution for wireless equipment manufactures, mobile terminal vendors , and semiconductor companies.
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Spreadtrum Launches World's First Chinese 3G Chipset Powered By CEVA-Teak DSP Core
The company provides 2G, 2.5G, 3G base band chip set, protocol stack software, application software, and total solutions for wireless equipment manufactures, mobile terminal vendors , and semiconductor companies.
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Spreadtrum Commences Shipments Of GSM/GPRS Chip Powered By CEVA-TeakLite DSP Core To Chinese Market
The company provides 2.5G, 3G base band chip set, protocol stack software, application software, and total solution for wireless equipment manufactures, mobile terminal vendors , and semiconductor companies.